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Mark Simpson

Researcher at Philips

Publications -  49
Citations -  866

Mark Simpson is an academic researcher from Philips. The author has contributed to research in topics: Silicon on insulator & Layer (electronics). The author has an hindex of 15, co-authored 49 publications receiving 857 citations. Previous affiliations of Mark Simpson include NXP Semiconductors.

Papers
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Proceedings ArticleDOI

High performance 600 V smart power technology based on thin layer silicon-on-insulator

TL;DR: In this article, a high-performance 600 V smart power technology has been developed in which novel lateral double-diffused MOS transistors (LDMOS) are merged with a BiCMOS process flow for the construction of power integrated circuits on bonded silicon-on-insulator (BSOI) substrates.
Patent

Personalized news retrieval system

TL;DR: In this paper, a video retrieval system is presented that allows a user to quickly and easily select and receive stories of interest from a video stream, which is particularly well suited for targeted news retrieval.
Patent

Laterial thin-film silicon-on-insulator (SOI) device having a gate electrode and a field plate electrode

TL;DR: In this paper, a lateral thin-film Silicon-On-Insulator (SOI) device is presented, where a gate electrode is provided over a body region in which a channel region is formed during operation and extending over a part of the lateral drift region adjacent the body region, with the gate electrode being at least substantially insulated from the body regions and drift region by an insulation region.
Patent

A high voltage thin film transistor with improved on-state characteristics and method for making same

TL;DR: In this article, an offset region between the source and thin drift regions was introduced to achieve an offset between the onset of the linear doping profile and the thinning of the SOI layer that results in the thin drift region.
Patent

Lateral thin-film silicon-on-insulator (SOI) device having a lateral drift region with a retrograde doping profile, and method of making such a device

TL;DR: In this article, a lateral thin-film Silicon-On-Insulator (SOI) device is proposed, which includes a semiconductor substrate, a buried insulating layer on the substrate, and a lateral transistor device in an SOI layer in the substrate.