Martin T. Goosey

Bio: Martin T. Goosey is an academic researcher. The author has contributed to research in topics: Conductive polymer & Electroactive polymers. The author has an hindex of 3, co-authored 6 publications receiving 173 citations.

Plastics for Electronics

Abstract: List of Contributors. Preface. 1. Introduction to Polymers and Their Important Properties for Electronic Applications M. Goosey. 2. Silicone Materials for Electronic Components and Circuit Protection J.-P. Mollie. 3. Engineering Thermoplastics H. van Baal. 4. Epoxide Resins and Their Formulation M. Goosey, et al. 5. Recent Developments in the Encapsulation of Semiconductors by Transfer Moulding M. Goosey, M. Plant. 6. Materials for Advanced Encapsulation N. Hackett. 7. Recent Developments in the Chemistry of Lithography for Electronics Production D. Merricks. 8. Ferroelectric Polymers J.A. Chilton. 9. Polymers in Printed Circuit Board (PCB) and Related Advanced Interconnect Applications M. Goosey. 10. New Polymers for Emerging Interconnect Applications J. Everett, et al. 11. Moulded Interconnect Devices (MIDs) F. Pohlau, K. Feldmann.

Special Polymers for Electronics and Optoelectronics

Abstract: Conductive polymers. Electrodepositable resists. Polymeric Langmuir-Blodgett films. Nonlinear materials. Ferroelectric polymers. Electroactive composites. Thermotropic liquid crystal polymers. Photoconductive polymers. Polymers for optical data storage. Index.

Introduction to Plastics and their Important Properties for Electronic Applications

Abstract: The word plastic has its origins in the Greek language where ‘plastikos’ meant to form or shape. Today plastic has a number of meanings but the one which best fits the description of materials detailed in this work is that referring to any of various substances which harden and retain their shape after being moulded or formed by heat and pressure. This description is still rather broad, covering a large number of materials including many such as tar, clay and even mud which do not really agree with our current perception of a plastic. In order to qualify the word plastic, a more accurate description would be synthetic plastic, since this eliminates the naturally occurring materials that have plastic properties and only includes those derived by chemical means from relatively simple raw materials. Plastics are thus man-made polymers where the word polymer is an abbreviation of the two words poly and monomer and literally means many monomers. It should also be noted, however, that the word plastic is generally taken to refer to thermoplastic materials and therefore does not include thermosetting materials. Consequently, in this revision of the original chapter the word polymer will generally be used unless the reference is specifically to a thermoplastic material.

Epoxide Resins and Their Formulation

Abstract: The epoxide resins are a class of materials that possess all the properties required to make them useful for a wide range of applications throughout the electronics industry When fully cured they have good electrical properties, low shrinkage, good adhesion and resistance to thermal and mechanical shock, whilst also possessing resistance to moisture, solvents and general chemical attack

Plastic Encapsulation of Semiconductors by Transfer Moulding

Abstract: In the early days of semiconductor fabrication, devices were largely packaged in glass, ceramic or metal. However, by the 1960s device manufacturers began to seriously investigate the possibility of encapsulating their products in some of the new plastic materials that were becoming available, as an alternative to the more conventional methods. The main incentives for this move towards plastic encapsulation were the large cost reductions offered over the standard ceramic and metal parts and compatability with mass production techniques, which often allowed several hundred parts to be encapsulated in a single operation taking less than 2 min. Motorola introduced the plastic T092 package in the mid 1960s and by the late 1970s worldwide annual production of plastic encapsulated parts was estimated to have exceeded 10 billion units. The total market in the USA for encapsulants of both active and passive components was valued at well over US $80 million in 1980 and is predicted to have exceeded US $225 million by 1985.

A Review of Current Flame Retardant Systems for Epoxy Resins

Abstract: The review covers materials currently available or which appear to be in serious development, with emphasis on electrical laminates and encapsulation, and brief coverage of other applications. The dominant technology for FR-4 printed wiring boards uses tetrabromobisphenol-A reacted into the epoxy resin. Nonhalogen systems include additives such as alumina trihydrate, alumina trihydrate plus red phosphorus, and aromatic phosphates. Reactives include a dihydrooxaphosphaphenanthrene oxide and various adducts thereof, and hydroxyl-terminated oligomeric phosphorus-containing esters. A further approach is the modification of the epoxy resin by placement of aromatic groups between the glycidyloxyphenyl groups, and/or by use of a triazine-modified novolac as crosslinker. Flame retardant epoxy coatings continue to make use of ammonium polyphosphate plus char-forming additives.

Highly stable polarization gratings in photocrosslinkable polymer liquid crystals

Abstract: Highly stable polarization gratings have been prepared in photocrosslinkable polymer liquid-crystal films by the use of two orthogonally polarized He–Cd laser beams and subsequent annealing. The resulting pure polarization gratings exhibiting thermal stability up to 150 °C diffract the beam and convert the polarization state at the same time according to the theoretical expectation.