Matteo Cocchini

Bio: Matteo Cocchini is an academic researcher from IBM. The author has contributed to research in topics: Printed circuit board & Decoupling capacitor. The author has an hindex of 9, co-authored 50 publications receiving 345 citations. Previous affiliations of Matteo Cocchini include University of L'Aquila & Missouri University of Science and Technology.

Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

Abstract: The via-plate capacitance for a via transition to a multilayer printed circuit board is evaluated analytically in terms of higher order parallel-plate modes. The Green's function in a bounded coaxial cavity for a concentric magnetic ring current is first derived by introducing reflection coefficients for cylindrical waves at the inner and outer cavity walls. These walls can be perfect electric conductor (PEC)/perfect magnetic conductor(PMC) or a nonreflective perfectly matched layer. By further assuming a magnetic frill current on the via-hole in the metal plate, an analytical formula is derived for the via barrel-plate capacitance by summing the higher order modes in the bounded coaxial cavity. The convergence of the formula with the number of modes, as well as with the radius of the outer PEC/PMC wall is discussed. The analytical formula is validated by both quasi-static numerical methods and measurements. Furthermore, the formula allows the investigation of the frequency dependence of the via-plate capacitance, which is not possible with quasi-static methods.

Mutual External Inductance in Stripline Structures

Abstract: —The Method of Edge Currents (MEC) proposed in our previous paper [1] is applied herein for calculating the mutual external inductance associated with fringing magnetic fields that wrap ground planes of a stripline structure. This method employs a quasi-static approach, image theory, and direct magnetic field integration. The resultant mutual external inductance is frequency-independent. The approach has been applied to estimating mutual inductance for both symmetrical and asymmetrical stripline structures. Offset of the signal trace from the centered position both in horizontal and vertical directions is taken into account in asymmetrical structures. The results are compared with numerical simulations using the CST Microwave Studio Software.

Return via connections for extending signal link path bandwidth of via transitions

Abstract: This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.

Noise coupling between signal and power/ground nets due to signal vias transitioning through power/ground plane pair

Abstract: Signal vias are often used to move a signal from one PCB layer to another. As a result, these vias can penetrate power/ground plane pair and cause noise coupling (crosstalk) between signal and power/ground nets. This paper studies the noise coupling mechanism using a segmentation approach combined with a via capacitance model and a plane-pair cavity model. Noise coupling from signal to power/ground, and vice versa, is demonstrated in the modeling results.

Analytical PDN voltage ripple calculation using simplified equivalent circuit model of PCB PDN

Abstract: Printed circuit board (PCB) power distribution network (PDN) design performance depends on the peak voltage ripple caused by the integrated circuit (IC) switching currents. The input impedance seen by the IC looking into the PCB PDN can be calculated using a physics-based circuit model extracted from the cavity model approach. The input impedance is fitted to a simplified circuit model used to represent the PCB PDN. Using a switching current profile, the frequency domain noise voltage is found and transformed to the time domain ripple waveform which can then be used to evaluate the PDN design performance.

Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions

Abstract: This paper reviews recent progress and future directions of signal integrity design for high-speed digital circuits, focusing on four areas: signal propagation on transmission lines, discontinuity modeling and characterization, measurement techniques, and link-path design and analysis.

Cylindrical Magnets and Coils: Fields, Forces, and Inductances

Abstract: This paper presents a synthesis of analytical calculations of magnetic parameters (field, force, torque, stiffness) in cylindrical magnets and coils. By using the equivalence between the amperian current model and the coulombian model of a magnet, we show that a thin coil or a cylindrical magnet axially magnetized have the same mathematical model. Consequently, we present first the analytical expressions of the magnetic field produced by either a thin coil or a ring permanent magnet whose polarization is axial, thus completing similar calculations already published in the scientific literature. Then, this paper deals with the analytical calculation of the force and the stiffness between thin coils or ring permanent magnets axially magnetized. Such configurations can also be modeled with the same mathematical approach. Finally, this paper presents an analytical model of the mutual inductance between two thin coils in air. Throughout this paper, we emphasize why the equivalence between the coulombian and the amperian current models is useful for studying thin coils or ring permanent magnets. All our analytical expressions are based on elliptic integrals but do not require further numerical treatments. These expressions can be implemented in Mathematica or Matlab and are available online. All our models have been compared to previous analytical and semianalytical models. In addition, these models have been compared to the finite-element method. The computational cost of our analytical model is very low, and we find a very good agreement between our analytical model and the other approaches presented in this paper.

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Abstract: The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered power-ground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity.

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Abstract: Analytical models for vias and traces are presented for simulation of multilayer interconnects at the package and printed circuit board levels. Vias are modeled using an analytical formulation for the parallel-plate impedance and capacitive elements, whereas the trace-via transitions are described by modal decomposition. It is shown that the models can be applied to efficiently simulate a wide range of structures. Different scenarios are analyzed including thru-hole and buried vias, power vias, and coupled traces routed into different layers. By virtue of the modal decomposition, the proposed method is general enough to handle structures with mixed reference planes. For the first time, these models have been validated against full-wave methods and measurements up to 40 GHz. An improvement on the computation speed of at least two orders of magnitude has been observed with respect to full-wave simulations.