M
Mauricio Pinto
Researcher at University of Colorado Boulder
Publications - 13
Citations - 44
Mauricio Pinto is an academic researcher from University of Colorado Boulder. The author has contributed to research in topics: Monolithic microwave integrated circuit & Amplifier. The author has an hindex of 3, co-authored 10 publications receiving 24 citations. Previous affiliations of Mauricio Pinto include Chalmers University of Technology & Raytheon Space and Airborne Systems.
Papers
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Journal ArticleDOI
Supply-Modulated Radar Transmitters With Amplitude-Modulated Pulses
TL;DR: In this paper, an efficient radar transmitter with improved spectral confinement, enabled by a pulse waveform that contains both amplitude and frequency modulation, is presented. But the performance of the power amplifier under a Gaussian envelope is compared to that of a Class-A PA.
Proceedings ArticleDOI
Design-Oriented Modelling of Microstrip Ferrite Circulators
TL;DR: In this paper, a modeling approach for the design of microstrip ferrite circulators is presented and validated on several examples using the same commercially available ferrite disk, and several design parameters are shown to affect the frequency response; the ferrite thickness relative the microstrip substrate thickness shifts the operating frequency, while external matching networks can increase the fractional bandwidth from 10% up 40%.
Journal ArticleDOI
Metal-Embedded Chip Assembly Processing for Enhanced RF Circuit Performance
TL;DR: In this article, passive components, such as lumped metal insulator-semiconductor (MIS) and ceramic capacitors, as well as coupler circuits implemented on alumina substrates, are integrated in a metal-embedded chip assembly (MECA) process together with GaN monolithic microwave-integrated circuits (MMICs) in a way that provides a common RF and thermal ground.
Proceedings ArticleDOI
Bandwidth design of ferrite-based circulators
TL;DR: In this paper, the authors report on the RF design of planar ferrite-based RF circulators with bandwidth control through the height of the ferrite puck and the DC magnetic bias.
Proceedings ArticleDOI
Alumina Passives Using the Interconnect Layer of Metal-Embedded Chip Assembly Processing
TL;DR: In this article, the authors describe the additional design dimension of a new heterogeneous packaging process, referred to as Metal-Embedded Chip Assembly (MECA), which can be used as an additional degree of freedom for design and manufacturing of passive circuits for integrated RF front-ends.