Maximilian C. Scardelletti

Bio: Maximilian C. Scardelletti is an academic researcher from Glenn Research Center. The author has contributed to research in topics: Coplanar waveguide & Slot antenna. The author has an hindex of 12, co-authored 57 publications receiving 646 citations.

Miniaturized Wilkinson power dividers utilizing capacitive loading

Abstract: The authors report the miniaturization of a planar Wilkinson power divider by capacitive loading of the quarter wave transmission lines employed in conventional Wilkinson power dividers. Reduction of the transmission line segments from /spl lambda//4 to between /spl lambda//5 and /spl lambda//12 are reported here. The input and output lines at the three ports and the lines comprising the divider itself are coplanar waveguide (CPW) and asymmetric coplanar stripline (ACPS), respectively. The 10 GHz power dividers are fabricated on high resistivity silicon (HRS) and alumina wafers. These miniaturized dividers are 74% smaller than conventional Wilkinson power dividers, and have a return loss better than +30 dB and an insertion loss less than 0.55 dB. Design equations and a discussion about the effect of parasitic reactance on the isolation are presented for the first time.

Design and Measurement of Self-Matched Dual-Frequency Coplanar Waveguide-Fed-Slot Antennas

Abstract: Two new designs of dual frequency coplanar waveguide (CPW)-fed double folded slot antennas are presented. An important advantage of these antennas is that they are self-matched to the feeding CPW without the need for external matching circuit. This reduces the antenna size and simplifies its design. To verify the designs, the return loss and radiation patterns are measured and compared to those obtained using available commercial software with good agreement

Electrically small folded slot antenna utilizing capacitive loaded slot lines

Abstract: This paper presents an electrically small, coplanar waveguide fed, folded slot antenna that uses capacitive loading. Several antennas are fabricated with and without capacitive loading to demonstrate the ability of this design approach to reduce the resonant frequency of the antenna, which is analogous to reducing the antenna size. The antennas are fabricated on Cu-clad Rogers DuriodTM 6006 with multilayer chip capacitors to load the antennas. Simulated and measured results show close agreement, thus, validating the approach. The electrically small antennas have a measured return loss greater than 15 dB and a gain of 5.4, 5.6, and 2.7 dBi at 4.3, 3.95, and 3.65 GHz, respectively.

RF MEMS phase shifters and their application in phase array antennas

Abstract: Electronically scanned arrays are required for space based radars that are capable of tracking multiple robots, rovers, or other assets simultaneously and for beam-hopping communication systems between the various assets. ^Traditionally, these phased array antennas used GaAs Monolithic Microwave Integrated Circuit (MMIC) phase shifters, power amplifiers, and low noise amplifiers to amplify and steer the beam, but the development of RF MEMS switches over the past ten years has enabled system designers to consider replacing the GaAs MMIC phase shifters with RF Micro-Electro Mechanical System (MEMS) phase shifters. In this paper, the implication of replacing the relatively high loss GaAs MMICs with low loss MEMS phase shifters is investigated.

MEMS, Ka-band single-pole double-throw (SPDT) switch for switched line phase shifters

Abstract: Ka-band MEMS doubly anchored cantilever beam capacitive shunt devices are used to demonstrate a MEMS SPDT switch fabricated on high resistivity silicon (HRS) utilizing finite ground coplanar waveguide (FGC) transmission lines. The SPDT switch has an insertion loss (IL), return loss (RL), and isolation of 0.3 dB, 40 dB, and 30 dB, respectively, at Ka-band.

Compact planar microstripline branch-line and rat-race couplers

Abstract: Both branch-line and rat-race couplers are easily realized using planar circuit technology as they employ only transmission lines without additional components. However, as the electrical lengths of the transmission line elements are either 90/spl deg/ or 270/spl deg/, such couplers consume a significant amount of circuit area. This paper shows the development of branch-line and rat-race couplers that use artificial transmission lines (ATLs) in place of conventional transmission lines resulting in significant size reduction. As the ATLs are constructed entirely from microstriplines, the couplers are easily fabricated using conventional printed-circuit processes. The design formulas developed for the ATLs are explicit. Full-wave simulation and experimental results were used to confirm the design approach for hybrids operating at 1.8 GHz. The frequency response of the proposed hybrids is similar to conventional hybrids.

High Efficiency RF and Microwave Solid State Power Amplifiers

Abstract: Preface. About the Authors. Acknowledgments. 1 Power Amplifier Fundamentals. 1.1 Introduction. 1.2 Definition of Power Amplifier Parameters. 1.3 Distortion Parameters. 1.4 Power Match Condition. 1.5 Class of Operation. 1.6 Overview of Semiconductors for PAs. 1.7 Devices for PA. 1.8 Appendix: Demonstration of Useful Relationships. 1.9 References. 2 Power Amplifier Design. 2.1 Introduction. 2.2 Design Flow. 2.3 Simplified Approaches. 2.4 The Tuned Load Amplifier. 2.5 Sample Design of a Tuned Load PA. 2.6 References. 3 Nonlinear Analysis for Power Amplifiers. 3.1 Introduction. 3.2 Linear vs. Nonlinear Circuits. 3.3 Time Domain Integration. 3.4 Example. 3.5 Solution by Series Expansion. 3.6 The Volterra Series. 3.7 The Fourier Series. 3.8 The Harmonic Balance. 3.9 Envelope Analysis. 3.10 Spectral Balance. 3.11 Large Signal Stability Issue. 3.12 References. 4 Load Pull. 4.1 Introduction. 4.2 Passive Source/Load Pull Measurement Systems. 4.3 Active Source/Load Pull Measurement Systems. 4.4 Measurement Test-sets. 4.5 Advanced Load Pull Measurements. 4.6 Source/Load Pull Characterization. 4.7 Determination of Optimum Load Condition. 4.8 Appendix: Construction of Simplified Load Pull Contours through Linear Simulations. 4.9 References. 5 High Efficiency PA Design Theory. 5.1 Introduction. 5.2 Power Balance in a PA. 5.3 Ideal Approaches. 5.4 High Frequency Harmonic Tuning Approaches. 5.5 High Frequency Third Harmonic Tuned (Class F). 5.6 High Frequency Second Harmonic Tuned. 5.7 High Frequency Second and Third Harmonic Tuned. 5.8 Design by Harmonic Tuning. 5.9 Final Remarks. 5.10 References. 6 Switched Amplifiers. 6.1 Introduction. 6.2 The Ideal Class E Amplifier. 6.3 Class E Behavioural Analysis. 6.4 Low Frequency Class E Amplifier Design. 6.5 Class E Amplifier Design with 50# Duty-cycle. 6.6 Examples of High Frequency Class E Amplifiers. 6.7 Class E vs. Harmonic Tuned. 6.8 Class E Final Remarks. 6.9 Appendix: Demonstration of Useful Relationships. 6.10 References. 7 High Frequency Class F Power Amplifiers. 7.1 Introduction. 7.2 Class F Description Based on Voltage Wave-shaping. 7.3 High Frequency Class F Amplifiers. 7.4 Bias Level Selection. 7.5 Class F Output Matching Network Design. 7.6 Class F Design Examples. 7.7 References. 8 High Frequency Harmonic Tuned Power Amplifiers. 8.1 Introduction. 8.2 Theory of Harmonic Tuned PA Design. 8.3 Input Device Nonlinear Phenomena: Theoretical Analysis. 8.4 Input Device Nonlinear Phenomena: Experimental Results. 8.5 Output Device Nonlinear Phenomena. 8.6 Design of a Second HT Power Amplifier. 8.7 Design of a Second and Third HT Power Amplifier. 8.8 Example of 2nd HT GaN PA. 8.9 Final Remarks. 8.10 References. 9 High Linearity in Efficient Power Amplifiers. 9.1 Introduction. 9.2 Systems Classification. 9.3 Linearity Issue. 9.4 Bias Point Influence on IMD. 9.5 Harmonic Loading Effects on IMD. 9.6 Appendix: Volterra Analysis Example. 9.7 References. 10 Power Combining. 10.1 Introduction. 10.2 Device Scaling Properties. 10.3 Power Budget. 10.4 Power Combiner Classification. 10.5 The T-junction Power Divider. 10.6 Wilkinson Combiner. 10.7 The Quadrature (90 ) Hybrid. 10.8 The 180 Hybrid (Ring Coupler or Rat-race). 10.9 Bus-bar Combiner. 10.10 Other Planar Combiners. 10.11 Corporate Combiners. 10.12 Resonating Planar Combiners. 10.13 Graceful Degradation. 10.14 Matching Properties of Combined PAs. 10.15 Unbalance Issue in Hybrid Combiners. 10.16 Appendix: Basic Properties of Three-port Networks. 10.17 References. 11 The Doherty Power Amplifier. 11.1 Introduction. 11.2 Doherty's Idea. 11.3 The Classical Doherty Configuration. 11.4 The 'AB-C' Doherty Amplifier Analysis. 11.5 Power Splitter Sizing. 11.6 Evaluation of the Gain in a Doherty Amplifier. 11.7 Design Example. 11.8 Advanced Solutions. 11.9 References. Index.

Development of Low Profile Cavity Backed Crossed Slot Antennas for Planar Integration

Abstract: Single fed low profile cavity backed crossed slot antennas for dual frequency dual linear polarization and circular polarization applications are first presented in this paper. By employing the substrate integrated waveguide (SIW) technique in the antenna designs, the low profile backed cavity structure can be realized by using only a single layer of low cost printed circuit board (PCB) substrate. A single grounded coplanar waveguide (GCPW) is employed as the feeding element to excite the TE 120 and TE 210 modes in the SIW cavity. A crossed slot structure is used as the radiating element in order to radiate the desired dual linearly or circularly polarized wave. From the measurement results, it is seen that these novel antennas retain the advantages of conventional metallic cavity backed antennas, including high gain, high front-to-back ratio (FTBR), and low cross polarization level (CPL). Furthermore, the proposed antennas also possess the advantages of low profile, light weight, low fabrication cost, and easy integration with planar circuits.

Mechanically-compliant intracortical implants reduce the neuroinflammatory response

Abstract: Objective. The mechanisms underlying intracortical microelectrode encapsulation and failure are not well understood. A leading hypothesis implicates the role of the mechanical mismatch between rigid implant materials and the much softer brain tissue. Previous work has established the benefits of compliant materials on reducing early neuroinflammatory events. However, recent studies established late onset of a disease-like neurodegenerative state. Approach. In this study, we implanted mechanically-adaptive materials, which are initially rigid but become compliant after implantation, to investigate the long-term chronic neuroinflammatory response to compliant intracortical microelectrodes. Main results. Three days after implantation, during the acute healing phase of the response, the tissue response to the compliant implants was statistically similar to that of chemically matched stiff implants with much higher rigidity. However, at two, eight, and sixteen weeks post-implantation in the rat cortex, the compliant implants demonstrated a significantly reduced neuroinflammatory response when compared to stiff reference materials. Chronically implanted compliant materials also exhibited a more stable blood-brain barrier than the stiff reference materials. Significance. Overall, the data show strikingly that mechanically-compliant intracortical implants can reduce the neuroinflammatory response in comparison to stiffer systems.

A novel compact-size branch-line coupler

Abstract: A novel compact-size branch-line coupler without any implementation of lumped-elements, bonding wires, and via holes is proposed. In this study, the size of the proposed coupler occupied only 45% of the conventional branch-line coupler at 2.4GHz. The performances of the circuit can be competed with the conventional coupler. The element sizes of this coupler can be realized easily by using simply standard printed-circuit-board etching processes. It is very useful for applications in the wireless communication systems.