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Mi-Chang Chang

Bio: Mi-Chang Chang is an academic researcher. The author has contributed to research in topics: NMOS logic & Electrostatic discharge. The author has an hindex of 3, co-authored 3 publications receiving 236 citations.

Papers
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Proceedings ArticleDOI
01 Jan 1996
TL;DR: In this article, a circuit-level simulator for ESD and EOS is presented, which uses the three terminal currents obtained from a single high current I-V curve, and compared to experimental data for single devices as well as a practical output circuit.
Abstract: A circuit-level simulator for ESD and EOS is presented. Equations for modeling the high current behavior of NMOS and PMOS transistors have been developed and implemented in SPICE. A simple and practical extraction methodology for obtaining the bipolar parameters is given, which uses the three terminal currents obtained from a single high current I-V curve. Simulation results are presented and compared to experimental data for single devices as well as a practical output circuit.

146 citations

Journal ArticleDOI
TL;DR: In this article, a description of the behavior of the MOS device in the high current regime is presented together with the model equations governing that behaviour, and the equations have been implemented into a SPICE circuit simulator and the experimental and simulation results are given.
Abstract: The design and optimization of ESD protection circuits is greatly enhanced by the ability to perform circuit-level simulations of the protection circuits and the I/O buffers. Most available simulators do not cover the high current region of the circuit operation, but still enable an approximate analysis to be made of the behaviour under ESD conditions. In this article, a description of the behaviour of the MOS device in the high current regime is presented together with the model equations governing that behaviour. The equations have been implemented into a SPICE circuit simulator, and the experimental and simulation results are given. A simple parameter extraction methodology is presented that uses the terminal currents from a single MOS DC I-V curve to obtain all the MOS and bipolar parameters required for the model.

58 citations

Proceedings ArticleDOI
07 Dec 1997
TL;DR: In this article, a new unified substrate current model for weak and strong impactionization was developed, which is semi-empirical and is able to capture non-local field effects.
Abstract: We have developed a new unified substrate current model for weak and strong impact-ionization The model which is semi-empirical is able to capture non-local field effects The importance of this model is its simplicity requiring three parameters which can be extracted easily from a single wafer-level measurement The implementation of this model in a circuit simulator provides the capability to include hot-carrier and ESD effects into circuit design optimization, which is essential for achieving design-in-reliability targets

37 citations


Cited by
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Journal ArticleDOI
TL;DR: An overview on the electrostatic discharge (ESD) protection circuits by using the silicon controlled rectifier (SCR)-based devices in CMOS ICs is presented and the solutions to overcome latchup issue in the SCR-based devices are discussed.
Abstract: An overview on the electrostatic discharge (ESD) protection circuits by using the silicon controlled rectifier (SCR)-based devices in CMOS ICs is presented The history and evolution of SCR device used for on-chip ESD protection is introduced Moreover, two practical problems (higher switching voltage and transient-induced latchup issue) limiting the use of SCR-based devices in on-chip ESD protection are reported Some modified device structures and trigger-assist circuit techniques to reduce the switching voltage of SCR-based devices are discussed The solutions to overcome latchup issue in the SCR-based devices are also discussed to safely apply the SCR-based devices for on-chip ESD protection in CMOS IC products

224 citations

Journal ArticleDOI
Steven H. Voldman1
TL;DR: In this article, state-of-the-art electrostatic discharge (ESD) protection in advanced semiconductor technologies and emerging technologies is discussed, as well as emerging technologies.
Abstract: This paper discusses state-of-the-art electrostatic discharge (ESD) protection in advanced semiconductor technologies and emerging technologies. ESD physics, semiconductor process issues, device and circuit simulation, circuits, and devices are examined.

102 citations

Proceedings ArticleDOI
26 Sep 2000
TL;DR: In this article, a floating guardring is used to pump the local substrate of the protection NMOS to achieve uniform npn protection in a multi-finger NMOS for advanced CMOS technologies with silicide.
Abstract: The use of a substrate pump to achieve uniform npn protection in a multi-finger NMOS is reported for advanced CMOS technologies with silicide. The novel feature of this device technique is the implementation of a floating guardring to effectively pump the local substrate of the protection NMOS. SPICE simulations are presented to illustrate the device concept as well as the device design optimization.

96 citations

Journal ArticleDOI
TL;DR: This paper describes the design methodology for gate driven NMOS ESD protection in submicron CMOS processes and shows how the PDN-MOS is effective even for small analog/mixed-signal designs.
Abstract: This paper describes the design methodology for gate driven NMOS ESD protection in submicron CMOS processes. A new PNP Driven NMOS (PDNMOS)-protection scheme is presented. Without requiring any additional process steps or introducing any additional impedance in signal path, the PDN-MOS is effective even for small analog/mixed-signal designs. SPICE simulations are used to optimize the design. High ESD performance of the PDNMOS protection in both nonsilicided and silicided submicron processes is demonstrated in this work.

78 citations

Journal ArticleDOI
TL;DR: In this article, a description of the behavior of the MOS device in the high current regime is presented together with the model equations governing that behaviour, and the equations have been implemented into a SPICE circuit simulator and the experimental and simulation results are given.
Abstract: The design and optimization of ESD protection circuits is greatly enhanced by the ability to perform circuit-level simulations of the protection circuits and the I/O buffers. Most available simulators do not cover the high current region of the circuit operation, but still enable an approximate analysis to be made of the behaviour under ESD conditions. In this article, a description of the behaviour of the MOS device in the high current regime is presented together with the model equations governing that behaviour. The equations have been implemented into a SPICE circuit simulator, and the experimental and simulation results are given. A simple parameter extraction methodology is presented that uses the terminal currents from a single MOS DC I-V curve to obtain all the MOS and bipolar parameters required for the model.

58 citations