scispace - formally typeset
Search or ask a question
Author

Michio Kadota

Bio: Michio Kadota is an academic researcher from Murata Manufacturing. The author has contributed to research in topics: Surface acoustic wave & Interdigital transducer. The author has an hindex of 14, co-authored 82 publications receiving 1656 citations.


Papers
More filters
Patent
04 Jun 2003
TL;DR: In this article, an n-type contact layer is formed by an ECR sputtering method or other suitable method on a zinc-polar surface of a ZnO substrate.
Abstract: A semiconductor device having excellent crystallinity and excellent electric characteristics includes a ZnO thin film having excellent surface smoothness. ZnO-based thin films (an n-type contact layer, an n-type clad layer, an active layer, a p-type clad layer, and a p-type contact layer) primarily including ZnO are formed sequentially by an ECR sputtering method or other suitable method on a zinc-polar surface of a ZnO substrate. A transparent electrode and a p-side electrode are formed by an evaporation method or other suitable method on a surface of the p-type contact layer, and an n-side electrode is formed on an oxygen-polar surface of the ZnO substrate.

1,021 citations

Patent
19 Mar 1999
TL;DR: An optical electronic integrated circuit (OIEI) as mentioned in this paper comprises a silicon substrate, an electronic circuit formed in the silicon substrate and processing an electric signal; a ZnO film formed on at least portion of the silicon substrategies; and an optical circuit electrically connected to the electronic circuit.
Abstract: An optical electronic integrated circuit comprises: a silicon substrate; an electronic circuit formed in the silicon substrate and processing an electric signal; a ZnO film formed on at least portion of the silicon substrate; and an optical circuit electrically connected to the electronic circuit. The optical circuit includes at least one GaN-based semiconductor compound layer which is provided on the ZnO film, and the GaN-based compound semiconductor layer either receives or emits an optical signal.

87 citations

Patent
24 Jun 1999
TL;DR: In this paper, a GaAs substrate, a light-emitting/light-receiving layer including a GaN-based compound semiconductor, and a ZnO film formed between the substrate and the light emitting/light receiving layer is presented.
Abstract: A semiconductor optical device includes a GaAs substrate, a light-emitting/light-receiving layer including a GaN-based compound semiconductor, and a ZnO film formed between the GaAs substrate and the light-emitting/light receiving layer.

42 citations

Patent
30 May 2003
TL;DR: A manufacturing method for a surface acoustic wave apparatus, which comprises the steps of: preparing a piezoelectric substrate (41), forming an electrode (42) on the substrate, forming an insulating layer to cover the electrode (43), and planarizing a difference of the height of the interior layer between a portion where the electrode is present and a portion that is not present as mentioned in this paper.
Abstract: A manufacturing method for a surface acoustic wave apparatus, comprises the steps of: preparing a piezoelectric substrate (41); forming an electrode (42) on the piezoelectric substrate; forming an insulating layer to cover the electrode (43); and planarizing a difference of the height of the insulating layer (43) between a portion where the electrode (42) is present and a portion where the electrode is not present.

32 citations

Patent
01 Jun 2007
TL;DR: In this paper, the authors propose a method for producing a boundary acoustic wave device that includes a first medium, a second medium, and a third medium laminated in that order, and electrodes disposed at the interface between the first medium and the second medium.
Abstract: In a method for producing a boundary acoustic wave device that includes a first medium, a second medium, and a third medium laminated in that order, and electrodes disposed at the interface between the first medium and the second medium, the method includes the steps of preparing a laminate including the first medium, the second medium, and the electrodes disposed at the interface between the first medium and the second medium, adjusting the thickness of the second medium after the step of preparing the laminate to regulate a frequency or the acoustic velocity of a surface acoustic wave, a pseudo-boundary acoustic wave, or a boundary acoustic wave, after the adjusting step, forming the third medium different from the second medium in terms of the acoustic velocity with which the boundary acoustic wave propagates therethrough and/or in terms of material.

32 citations


Cited by
More filters
Patent
01 Aug 2008
TL;DR: In this article, the oxide semiconductor film has at least a crystallized region in a channel region, which is defined as a region of interest (ROI) for a semiconductor device.
Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

1,501 citations

Patent
25 Sep 2013
TL;DR: In this paper, a connection terminal portion is provided with a plurality of connection pads which are part of the connection terminal, each of which includes a first connection pad and a second connection pad having a line width different from that of the first one.
Abstract: An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

1,136 citations

Patent
17 Jan 2006
TL;DR: In this article, the authors propose a technique by which a pattern of wirings or the like which is partially constitutes a semiconductor device or a display device can be formed with a desired shape with controllability.
Abstract: To provide a semiconductor device and a display device which can be manufactured through a simplified process and the manufacturing technique. Another object is to provide a technique by which a pattern of wirings or the like which is partially constitutes a semiconductor device or a display device can be formed with a desired shape with controllability.

1,043 citations

Patent
03 Jan 2013
TL;DR: In this paper, the authors present a system and method in a building or vehicle for an actuator operation in response to a sensor according to a control logic, the system comprising a router or a gateway communicating with a device associated with the sensor, and an external Internet-connected control server associated with control logic implementing a PID closed linear control loop and communicating with the router over external network for controlling the in-building or in-vehicle phenomenon.
Abstract: A system and method in a building or vehicle for an actuator operation in response to a sensor according to a control logic, the system comprising a router or a gateway communicating with a device associated with the sensor and a device associated with the actuator over in-building or in-vehicle networks, and an external Internet-connected control server associated with the control logic implementing a PID closed linear control loop and communicating with the router over external network for controlling the in-building or in-vehicle phenomenon. The sensor may be a microphone or a camera, and the system may include voice or image processing as part of the control logic. A redundancy is used by using multiple sensors or actuators, or by using multiple data paths over the building or vehicle internal or external communication. The networks may be wired or wireless, and may be BAN, PAN, LAN, WAN, or home networks.

590 citations

Patent
19 Nov 2002
TL;DR: In this article, a light-emitting element and a driver circuit of the light emitting element are provided over different substrates to prevent a point defect and a line defect in forming a light emitting device, thereby improving the yield.
Abstract: To prevent a point defect and a line defect in forming a light-emitting device, thereby improving the yield. A light-emitting element and a driver circuit of the light-emitting element, which are provided over different substrates, are electrically connected. That is, a light-emitting element and a driver circuit of the light-emitting element are formed over different substrates first, and then electrically connected. By providing a light-emitting element and a driver circuit of the light-emitting element over different substrates, the step of forming the light-emitting element and the step of forming the driver circuit of the light-emitting element can be performed separately. Therefore, degrees of freedom of each step can be increased, and the process can be flexibly changed. Further, steps (irregularities) on the surface for forming the light-emitting element can be reduced than in the conventional technique.

479 citations