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Ming-Yang Kao

Researcher at Northwestern University

Publications -  202
Citations -  4582

Ming-Yang Kao is an academic researcher from Northwestern University. The author has contributed to research in topics: Time complexity & Planar graph. The author has an hindex of 37, co-authored 202 publications receiving 4438 citations. Previous affiliations of Ming-Yang Kao include Tufts University & Indiana University.

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Book

Encyclopedia of Algorithms

Ming-Yang Kao
TL;DR: This dynamic reference work provides solutions to vital algorithmic problems for scholars, researchers, practitioners, teachers and students in fields such as computer science, mathematics, statistics, biology, economics, financial software, and medical informatics.
Journal ArticleDOI

Reversible sketches: enabling monitoring and analysis over high-speed data streams

TL;DR: Both the analytical and experimental results show that the proposed reversible sketch data structure along with reverse hashing algorithms are able to achieve online traffic monitoring and accurate change/intrusion detection over massive data streams on high speed links, all in a manner that scales to large key space size.
Book ChapterDOI

Compact Encodings of Planar Graphs via Canonical Orderings and Multiple Parentheses

TL;DR: Three sets of coding schemes which all take linear time for encoding and decoding are presented which are significantly shorter than the previously known results in each case.
Proceedings ArticleDOI

Reducing tile complexity for self-assembly through temperature programming

TL;DR: This work suggests that temperature change can constitute a natural, dynamic method for providing input to self-assembly systems that is potentially superior to the current technique of designing large tile sets with specific inputs hardwired into the tileset.
Posted Content

Reducing Tile Complexity for Self-Assembly Through Temperature Programming

TL;DR: In this paper, the authors consider the tile self-assembly model and show how to reduce tile complexity by allowing the temperature of the self-assembling system to be adjusted throughout the assembly process.