Minoru Sakata

Bio: Minoru Sakata is an academic researcher from Omron. The author has contributed to research in topics: Thin film & Photodetector. The author has an hindex of 8, co-authored 16 publications receiving 236 citations.

Micromachined relay which utilizes single crystal silicon electrostatic actuator

Abstract: A MMR which utilizes a single crystal silicon based electrostatic actuator is presented in this paper. The MMR is fabricated by critical-dimensions-controllable SOI-A/B (Anodic bonding) process. Size of the MMR is 2.0 mm/spl times/2.5 mm and driving voltage is 24 V. Hot-switching tests with 10 V-10 mA resistive load were performed 10/sup 6/ cycles with around 0.5 ohm relay resistance (sum. of signal line resistance, contact resistance and package resistance). Breakdown voltage (stand off voltage) is larger than 200 V. Switching time was around 03 msec and power consumption was less than 0.05 mW.

Electrostatic micro relay

Abstract: A movable substrate (20) is supported by a base (10) through a first elastic supporting section (22) and a traveling contact (12) is supported by the movable substrate (20) through a second elastic supporting section (23) having a moduli of elasticity larger than that of the first supporting section (22).

Two Dimensional Silicon Micromachined Optical Scanner Integrated With Photo Detector And Piezoresistor

Abstract: The silicon micromachined optical scanner integrated with photo detectors and piezoresistor has been developed for highly miniaturized scanning type of optical sensors. The scanner is fabricated with silicon micromachining technologies including IC manufacturing methods. It is capable of scanning a light beam spot two dimensionally and photo detection with the information of where the light beam is being scanned. The scanning angle was over 40 deg. x 30 deg. and the photo sensitivity was 0.5 A/W at 680 nm wavelength.

Static relay and communication device using static relay

Abstract: A silicon substrate (21) has fixed contacts (23A, 24A) on its upper surface. Signal lines (23, 24) connected electrically with the fixed contacts (23A, 24A) pass through the silicon substrate (21) from the front to the back. Bumps (32, 33) connected electrically with the signal line (23, 24) are formed on the back of the silicon substrate (21). A fixed electrode (22) is provided on each side of the fixed contact (23A, 24A). Wiring conductors (30, 31) connected electrically with the fixed electrode (22) pass through the silicon substrate (21) from the front to the back. Bumps (34, 35) connected electrically with the wiring conductors (30, 31) are provided on the back of the silicon substrate (21). The holes (26, 27) in the silicon substrate (21) through which the signal lines (23, 24) pass are sealed with a movable substrate (40) or a cap (50), and the holes (28, 29) in the silicon substrate (21) through which the wiring conductors (30, 31) pass are also sealed with a movable substrate (40) or a cap (50).

Two-dimensional miniature optical-scanning sensor with silicon micromachined scanning mirror

Abstract: For achieving higher performance and for miniaturizing the size of an optical scanning sensor, raising the scanning angle response, increasing the accuracy of detection of the scanning location independent from the environmental temperature, and miniaturizing an optical-scanning sensor were considered. And the silicon micromachined 2D optical scanner integrated with a piezoresistor for scanning location detection and a photodiode for optical intensity detection was newly designed and fabricated. The obtained results with the fabricated scanner are following. The scanner is capable of scanning a light beam more than 40 degrees 2D. The scanning angle sensitivities are 4.8 deg/V for horizontal direction and 10.5 deg/V for vertical direction. The scanning location detection sensitivity for each horizontal and vertical directions are 21 mV/deg and 26 mV/deg., respectively. The decrease of detection accuracy of scanning location has been reduced to less than 1 percent within +/- 10 degrees C temperature shift. And the photodetector has a photosensitivity of 0.33 A/W which allows the optical-scanning sensor to detect the reflected light intensity from an object which is 200 mm away from the sensor.© (1997) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

RF MEMS from a device perspective

Abstract: This paper reviews the recent progress in MEMS for radio frequency (RF) applications from a device perspective. RF MEMS devices reviewed include switches and relays, tunable capacitors, integrated inductors, mechanical resonators and filters, and some representative microwave and millimetre-wave components. Important device parameters are highlighted, as they have significant contributions to the performance of the final products in which the devices are used. The challenges and statuses of these RF MEMS devices are outlined and discussed. The intent of this topical review is to provide perspective to newcomers in the field, and empower potential end-users with an overall device picture, current status, and a vision of their ultimate performance capabilities.

Room Temperature Impact Consolidation (RTIC) of Fine Ceramic Powder by Aerosol Deposition Method and Applications to Microdevices

Abstract: Ceramic integration technology requires downsizing and/or improvement of device performance in many applications, such as in the fabrication of microelectromechanical systems, display devises, fuel cells, optical devices, and RF components. For these applications, realization of high-speed deposition rate, low process temperature, and fine patterning in ceramic coating are very important. The aerosol deposition (AD) method has many advantages for above requirements in comparison with conventional thin-film method or thermal spray coating technology. In this article, advantages of the AD method are highlighted by realizing a comparison with conventional thin-film methods and thermal spray technology. Challenges associated with AD method are also highlighted. At the end, examples of integration of AD method in the fabrication of electronic components are also given to show the easiness in usage and in integration of this method in the device process flow.

Processing, Structure, Properties, and Applications of PZT Thin Films

Abstract: There has been a resurgence of complex oxides of late owing to their ferroelectric and ferromagnetic properties. Although these properties had been recognized decades ago, the renewed interest stems from modern deposition techniques that can produce high quality materials and attractive proposed device concepts. In addition to their use on their own, the interest is building on the use of these materials in a stack also. Ferroelectrics are dielectric materials that have spontaneous polarization in certain temperature range and show nonlinear polarization–electric field dependence called a hysteresis loop. The outstanding properties of the ferroelectrics are due to non-centro-symmetric crystal structure resulting from slight distortion of the cubic perovskite structure. The ferroelectric materials are ferroelastic also in that a change in shape results in a change in the electric polarization (thus electric field) developed in the crystal and vice versa. Therefore they can be used to transform acoustic wav...

Miniature piezoelectric motors

Abstract: There is great demand for micro- or miniaturized actuators for practical application. However, magnetic coils of electromagnetic motors are an obstacle to such miniaturization because of their complicated construction. Furthermore, electrostatic micro-motors fabricated by IC-processing cannot generate sufficient output power. Piezoelectric motors are promising because of their simple construction and high power density. In fact, some piezoelectric actuators have been or are close to being launched in the market. For their miniaturization, proper fabrication processes including thick deposition methods are important. In this review, various principles of piezoelectric motors are introduced in addition to suitable fabrication processes.

Application of MEMS technology in automotive sensors and actuators

Abstract: Sensors and actuators are the critical system components that collect and act on information in the analog environment and link it to the world of digital electronics. The functional groups of sensors, software, controller hardware, and actuators from the backbone of present and future automotive systems. Unit volumes for sensors and actuators in the automotive industry are measured in millions per year and at a unit cost of a few dollars. The design of sensors and actuators has increasingly made use of microelectromechanical systems (MEMS) technology. This technology is well suited to producing a class of micromachined sensors and actuators that combines signal processing and communications on a single silicon chip or contained within the same package. This paper contains a discussion of the issues in producing MEMS sensors and actuators from the concept selection stage to the manufacturing platform. Examples of commercial and emerging automotive sensors and actuators are given, which illustrate the various aspects of device development. Future trends in MEMS technology as applied to automotive components are also discussed.