This paper describes a fabrication technique for building three-dimensional (3-D) micro-channels in polydimethylsiloxane (PDMS) elastomer. The process allows for the stacking of many thin (less than 100-/spl mu/m thick) patterned PDMS layers to realize complex 3-D channel paths. The master for each layer is formed on a silicon wafer using an epoxy-based photoresist (SU 8). PDMS is cast against the master producing molded layers containing channels and openings. To realize thin layers with openings, a sandwich molding configuration was developed that allows precise control of the PDMS thickness. The master wafer is clamped within a sandwich that includes flat aluminum plates, a flexible polyester film layer, a rigid Pyrex wafer, and a rubber sheet. A parametric study is performed on PDMS surface activation in a reactive-ion-etching system and the subsequent methanol treatment for bonding and aligning very thin individual components to a substrate. Low RF power and short treatment times are better than high RF power and long treatment times, respectively, for instant bonding. Layer-to-layer alignment of less then 15 /spl mu/m is achieved with manual alignment techniques that utilize surface tension driven self-alignment methods. A coring procedure is used to realize off-chip fluidic connections via the bottom PDMS layer, allowing the top layer to remain smooth and flat for complete optical access.

Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer

If you've not been involved in MEMS (MicroElectroMechanical Systems) technology or had the cause to use MEMS devices, then you may wonder what all the fuss is about. What are MEMS anyway? What's the difference between MEMS and MST (MicroSystems Technology)? What are the advantages over existing technologies? If you have ever found yourself pondering over such questions, then this book may be for you. As the title suggests, the main aim is to provide an introduction to MEMS by describing the processes and materials available and by using examples of commercially available devices. The intended readership are those technical managers, engineers, scientists and graduate students who are keen to learn about MEMS but have little or no experience of the technology. I was particularly pleased to note that Maluf has dedicated a whole chapter to the important (and often difficult) area of packaging. The first three chapters provide a general overview of the technology. Within the first three pages we are introduced to the MEMS versus MST question, only to discover that the difference depends on where you live! The United States prefer MEMS, while the Europeans use the handle MST. (Note to self: tell colleagues in MEMS group at Southampton). A good account is given of the basic materials used in the technology, including silicon, silicon oxide/nitride/carbide, metals, polymers, quartz and gallium arsenide. The various processes involved in the creation of MEMS devices are also described. A good treatment is given to etching and bonding in addition to the various deposition techniques. It was interesting to note that the author doesn't make a big issue of the differences between bulk and surface micromachined devices; the approach seems to be `here's your toolbag - get on with it'. One of the great strengths of this book is the coverage of commercial MEMS structures. Arising as they have, from essentially a planar technology, MEMS devices are often elaborate three-dimensional creations, and 2D drawings don't do them much justice. I have to say that I was extremely impressed with the many aesthetic isometric views of some of these wonderful structures. Pressure sensors, inkjet print nozzles, mass flow sensors, accelerometers, valves and micromirrors are all given sufficient treatment to describe the fundamental behaviour and design philosophy, but without the mathematical rigour expected for a traditional journal paper. Chapter 5 addresses the promise of the technology as a means of enabling a new range of applications. The concept of using MEMS devices as key elements within complex systems (or even microsystems!) is explored. The so-called `lab-on-a-chip' approach is described, whereby complex analytical systems are integrated onto a single chip together with the associated micropumps and microvalves. The design and fabrication of MEMS devices are important issues by themselves. A key area, often overlooked, is that of packaging. Painstaking modelling and intricate fabrication methodologies can produce resonator structures oscillating at precisely, say, 125 kHz. The device is then mounted in a dual-in-line carrier and the frequency shifts by 10 kHz because of the additional internal stresses produced. Packaging issues can't be decoupled from those of the micromachined components. Many of these issues, such as protective coatings, thermal management, calibration etc, are covered briefly in the final chapter. Overall, I found this book informative and interesting. It has a broad appeal and gives a good insight into this fascinating and exciting subject area. Neil White

An Introduction to Microelectromechanical Systems Engineering

Surface micromachining is characterized by the fabrication of micromechanical structures from deposited thin films. Originally employed for integrated circuits, films composed of materials such as low-pressure chemical-vapor-deposition polycrystalline silicon, silicon nitride, and silicon dioxides can be sequentially deposited and selectively removed to build or "machine" three-dimensional structures whose functionality typically requires that they be freed from the planar substrate. Although the process to accomplish this fabrication dates from the 1960's, its rapid extension over the past few years and its application to batch fabrication of micromechanisms and of monolithic microelectromechanical systems (MEMS) make a thorough review of surface micromachining appropriate at this time. Four central issues of consequence to the MEMS technologist are: (i) the understanding and control of the material properties of microstructural films, such as polycrystalline silicon, (ii) the release of the microstructure, for example, by wet etching silicon dioxide sacrificial films, followed by its drying and surface passivation, (iii) the constraints defined by the combination of micromachining and integrated-circuit technologies when fabricating monolithic sensor devices, and (iv) the methods, materials, and practices used when packaging the completed device. Last, recent developments of hinged structures for postrelease assembly, high-aspect-ratio fabrication of molded parts from deposited thin films, and the advent of deep anisotropic silicon etching hold promise to extend markedly the capabilities of surface-micromachining technologies.

/pdf/surface-micromachining-for-microelectromechanical-systems-13y44jiffs.pdf

Surface micromachining for microelectromechanical systems

http://www.tissueeng.net/lab/papers/124.pdf

Engineering microscale topographies to control the cell-substrate interface.

MEMS devices are manufactured using similar microfabrication techniques as those used to create integrated circuits. They often, however, have moving components that allow physical or analytical functions to be performed by the device. Although MEMS can be aseptically fabricated and hermetically sealed, biocompatibility of the component materials is a key issue for MEMS used in vivo. Interest in MEMS for biological applications (BioMEMS) is growing rapidly, with opportunities in areas such as biosensors, pacemakers, immunoisolation capsules, and drug delivery. The key to many of these applications lies in the leveraging of features unique to MEMS (for example, analyte sensitivity, electrical responsiveness, temporal control, and feature sizes similar to cells and organelles) for maximum impact. In this paper, we focus on how the biological integration of MEMS and other implantable devices can be improved through the application of microfabrication technology and concepts. Innovative approaches for improved physical and chemical integration of systems with the body are reviewed. An untapped potential for MEMS may lie in the area of nervous and endocrine system actuation, whereby the ability of MEMS to deliver potent drugs or hormones, combined with their precise temporal control, may provide new treatments for disorders of these systems.

/pdf/a-biomems-review-mems-technology-for-physiologically-24byptabzh.pdf

A BioMEMS review: MEMS technology for physiologically integrated devices

Bulk silicon etching techniques, used to selectively remove silicon from substrates, have been broadly applied in the fabrication of micromachined sensors, actuators, and structures. Despite the more recent emergence of higher resolution, surface-micromachining approaches, the majority of currently shipping silicon sensors are made using bulk etching. Particularly in light of newly introduced dry etching methods compatible with complementary metal-oxide-semiconductors, it is unlikely that bulk micromachining will decrease in popularity in the near future. The available etching methods fall into three categories in terms of the state of the etchant: wet, vapor, and plasma. For each category, the available processes are reviewed and compared in terms of etch results, cost, complexity, process compatibility, and a number of other factors. In addition, several example micromachined structures are presented.

/pdf/bulk-micromachining-of-silicon-57ln84jsy8.pdf

Bulk micromachining of silicon

The present invention provides a proportional microvalve (10) having a first (12), second (14) and third layer (16), and having high aspect ratio geometries. The first layer (12) defines a cavity (24) with inlet (20) and outlet (22) ports. The second layer (14), doped to have a low resistivity and bonded between the first (12) and third (16) layers, defines a cavity (24) having a flow area to permit fluid flow between the inlet (20) and outlet (22) ports. The second layer (14) further defines an actuatable displaceable member (26), and one or more thermal actuators (28, 30) for actuating the displaceable member (26) to a position between and including an open and a closed position to permit or occlude fluid flow. The third layer (16) provides one wall of the cavity (24) and provides electrical contacts (32a, 32b, 34a, 34b) for electrically heating the thermally expandable actuators (28, 30). The thermal actuators (28, 30) and the displaceable member (26) have high aspect ratios and are formed by deep reactive ion etching such that they are displaceable in the plane of the second layer (14) while being very stiff out of the plane. Thus, both actuation and displacement of the displaceable member (26) are in the plane of the layer.

Proportional micromechanical device

Disclosed is a microvalve suitable for use in high pressure applications such as refriigeration. The microvalve has a displaceable member that slides across an inlet port, thereby creating an orifice. A pressure-equalizing contour is positioned beneath the displaceable member and is in fluid contact with the inlet port. The pressure on the displaceable member from the inlet port is equalized by the pressure from the pressure-equalizing contour. Consequently, the microvalve can be configured with its inlet port and outlet port on opposite sides of the microvalve. Pressures in the x and y direction are also equalized because of recesses that permit fluid from the inlet to contact all faces of the displaceable member.

Microvalve with pressure equalization

The present invention provides a proportional microvalve (10) having a first (12), second (14) and third layer (16), and having high aspect ratio geometries. The first layer defines a cavity with inlet (20) and outlet ports (22). The second layer, doped to have a low resistivity and bonded between the first and third layers, defines a cavity having a flow area to permit fluid flow between the inlet and outlet ports. The second layer further defines an actuatable displaceable member (26), and one or more thermal actuators (28, 30) for actuating the displaceable member to a position between and including an open and a closed position to permit or occlude fluid flow. The third layer provides one wall of the cavity and provides electrical contacts (32a, 32b, 34a, 34b) for electrically heating the thermally expandable actuators. The thermal actuators and the displaceable member have high aspect ratios and are formed by deep reactive ion etching such that they are displaceable in the plane of the second layer while being very stiff out of the plane. Thus, both actuation and displacement of the displaceable member are in the plane of the layer.

Proportional micromechanical valve

/pdf/novel-interconnection-technologies-for-integrated-1gqgojg3ol.pdf

Nadim I. Maluf

Papers

Bulk micromachining of silicon

Proportional micromechanical device

Microvalve with pressure equalization

Proportional micromechanical valve

Novel Interconnection Technologies for Integrated Microfluidic Systems