P. Chellapandi

Bio: P. Chellapandi is an academic researcher from Indira Gandhi Centre for Atomic Research. The author has contributed to research in topics: Tangent stiffness matrix & Viscoplasticity. The author has an hindex of 1, co-authored 1 publications receiving 7 citations.

Plant life management (PLiM) practices for sodium cooled fast neutron spectrum nuclear reactors (SFRs)

Abstract: This chapter gives an overview of life management issues of sodium cooled fast neutron spectrum reactors (SFRs). The topics covered in this chapter include robust design and validation, design by analysis philosophy, materials selection, manufacturing processes, state-of-the-art operation and maintenance strategies, meticulous in-service inspection, materials behaviour and ageing management, human resources and knowledge and asset management. The present state-of-the-art of PLiM practices for SFRs is reviewed and future trends in life assessment procedures and R&D required for further enhancing the safety and reliability of SFRs are highlighted.

Effects of the Unified Viscoplastic Formulation and Temperature Terms on the Thermomechanical Behavior of Soldering Materials

Abstract: Solder materials are critical packaging compounds and due to usually weakest melting temperature among packaging constitutive materials, thus, they are frequently subjected to a multitude of physical phenomena: creep, fatigue and combined hardening effects The complexity and interaction of such factors must be considered in suitable way in the mechanical behavior modeling using the appropriate material behavior laws The choice of the mechanical model depends on several factors such as the complexity of constitutive equations to be integrated, the availability and suitability of implementation in the FE codes, the number of parameters to be identified, the capability of the model to represent the most common physical features of the material… Following these observations and in order to deal with these critical remarks, comparisons between the most common unified viscoplastic models should be done in the local and finite element levels for the decision upon the most efficient model That is the aim of this paper with application to a tin based solder token as the test material

Efficiency and robustness of some behavior laws in the description of viscoplastic deformation and degradation of solder materials

Abstract: Solder materials are critical packaging compounds and due to usually weakest melting temperature among packaging constitutive materials, thus, they are frequently subjected to a multitude of physical phenomena: creep, fatigue and combined hardening effects. The complexity and interaction of such factors must be considered in suitable way in the mechanical behaviour modelling using the appropriate material behaviour laws. The choice of the mechanical model depends on several factors such as the complexity of constitutive equations to be integrated, the availability and suitability of implementation in the FE codes, the number of parameters to be identified, the capability of the model to represent the most common physical features of the material… Following these observations and in order to deal with this critical remarks, comparisons between the most common unified viscoplastic models should be done in the local and finite element levels for the decision upon the most efficient model. That is the aim of this paper with application to a tin based solder token as the test material.