This paper presents the many-core architecture, with hundreds to thousands of small cores, to deliver unprecedented compute performance in an affordable power envelope. We discuss fine grain power management, memory bandwidth, on die networks, and system resiliency for the many-core system.

http://www.ee.unlv.edu/~meiyang/ecg700/readings/Thousand%20Core%20Chips%20A%20Technology%20Perspective.pdf

Thousand core chips: a technology perspective

Commodity computer systems contain more and more processor cores and exhibit increasingly diverse architectural tradeoffs, including memory hierarchies, interconnects, instruction sets and variants, and IO configurations. Previous high-performance computing systems have scaled in specific cases, but the dynamic nature of modern client and server workloads, coupled with the impossibility of statically optimizing an OS for all workloads and hardware variants pose serious challenges for operating system structures.We argue that the challenge of future multicore hardware is best met by embracing the networked nature of the machine, rethinking OS architecture using ideas from distributed systems. We investigate a new OS structure, the multikernel, that treats the machine as a network of independent cores, assumes no inter-core sharing at the lowest level, and moves traditional OS functionality to a distributed system of processes that communicate via message-passing.We have implemented a multikernel OS to show that the approach is promising, and we describe how traditional scalability problems for operating systems (such as memory management) can be effectively recast using messages and can exploit insights from distributed systems and networking. An evaluation of our prototype on multicore systems shows that, even on present-day machines, the performance of a multikernel is comparable with a conventional OS, and can scale better to support future hardware.

/pdf/the-multikernel-a-new-os-architecture-for-scalable-multicore-1zaxph0v39.pdf

The multikernel: a new OS architecture for scalable multicore systems

The design and performance of next-generation chip multiprocessors (CMPs) will be bound by the limited amount of power that can be dissipated on a single die We present photonic networks-on-chip (NoC) as a solution to reduce the impact of intra-chip and off-chip communication on the overall power budget A photonic interconnection network can deliver higher bandwidth and lower latencies with significantly lower power dissipation We explain why on-chip photonic communication has recently become a feasible opportunity and explore the challenges that need to be addressed to realize its implementation We introduce a novel hybrid micro-architecture for NoCs combining a broadband photonic circuit-switched network with an electronic overlay packet-switched control network We address the critical design issues including: topology, routing algorithms, deadlock avoidance, and path-setup/tear-down procedures We present experimental results obtained with POINTS, an event-driven simulator specifically developed to analyze the proposed idea, as well as a comparative power analysis of a photonic versus an electronic NoC Overall, these results confirm the unique benefits for future generations of CMPs that can be achieved by bringing optics into the chip in the form of photonic NoCs

/pdf/photonic-networks-on-chip-for-future-generations-of-chip-4wqloco96y.pdf

Photonic Networks-on-Chip for Future Generations of Chip Multiprocessors

A significant part of future microprocessor real estate will be dedicated to L2 or L3 caches. These on-chip caches will heavily impact processor perfor- mance, power dissipation, and thermal management strategies. There are a number of interconnect design considerations that influence power/performance/area characteristics of large caches, such as wire mod- els (width/spacing/repeaters), signaling strategy (RC/differential/transmission), router design, etc. Yet, to date, there exists no analytical tool that takes all of these parameters into account to carry out a design space exploration for large caches and estimate an optimal organization. In this work, we implement two major extensions to the CACTI cache modeling tool that focus on interconnect design for a large cache. First, we add the ability to model different types of wires, such as RC-based wires with different power/delay characteristics and differential low-swing buses. Second, we add the ability to model Non-uniform Cache Access (NUCA). We not only adopt state-of-the-art design space exploration strategies for NUCA, we also enhance this exploration by considering on-chip network contention and a wider spectrum of wiring and routing choices. We present a validation analysis of the new tool (to be released as CACTI 6.0) and present a case study to showcase how the tool can improve architecture research methodologies. Keywords: cache models, non-uniform cache archi- tectures (NUCA), memory hierarchies, on-chip intercon- nects.

/pdf/optimizing-nuca-organizations-and-wiring-alternatives-for-3rrqqn2dbv.pdf

Optimizing NUCA Organizations and Wiring Alternatives for Large Caches with CACTI 6.0

To alleviate the complex communication problems that arise as the number of on-chip components increases, network-on-chip (NoC) architectures have been recently proposed to replace global interconnects. In this paper, we first provide a general description of NoC architectures and applications. Then, we enumerate several related research problems organized under five main categories: Application characterization, communication paradigm, communication infrastructure, analysis, and solution evaluation. Motivation, problem description, proposed approaches, and open issues are discussed for each problem from system, microarchitecture, and circuit perspectives. Finally, we address the interactions among these research problems and put the NoC design process into perspective.

Outstanding Research Problems in NoC Design: System, Microarchitecture, and Circuit Perspectives

A 275mm2 network-on-chip architecture contains 80 tiles arranged as a 10 times 8 2D array of floating-point cores and packet-switched routers, operating at 4GHz. The 15-F04 design employs mesochronous clocking, fine-grained clock gating, dynamic sleep transistors, and body-bias techniques. The 65nm 100M transistor die is designed to achieve a peak performance of 1.0TFLOPS at 1V while dissipating 98W.

An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS

This paper describes a novel technique to enable characterization of high-speed IO links and transceivers without the use of special external test equipment. The test circuit has been implemented in 7-metal 90nm CMOS technology. A register file has been used to characterize a high-speed IO link by recording information such as the number of errors, the time of the error and to calibrate the transceiver circuit parameters. The testing approach uses the IEEE 1149.1 JTAG protocol to feed the control signals and to capture the status of key nodes in the transceivers. The high-speed register file operating at 625 MHz has been made seamlessly readable through the JTAG scan chain operating at a maximum of 80 MHz. The simulation results show that we can successfully test the system and capture the behavior of the transceiver and link.

P. Iyer

Papers

An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS

Testing high-speed IO links using on-die circuitry