P
Paul M. Zavracky
Researcher at Northeastern University
Publications - 49
Citations - 2972
Paul M. Zavracky is an academic researcher from Northeastern University. The author has contributed to research in topics: Surface micromachining & Thin film. The author has an hindex of 21, co-authored 49 publications receiving 2927 citations. Previous affiliations of Paul M. Zavracky include Tufts University.
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Patent
Microscale fluid handling system
Barry L. Karger,František Foret,Paul M. Zavracky,Nicol E. McGruer,Qifeng Xue,Yuriy M. Dunayevskiy +5 more
TL;DR: In this article, a micro-scale fluid handling system that permits the efficient transfer of nanoliter to picoliter quantities of a fluid sample from the spatially concentrated environment of a microfabricated chip to 'off-chip' analytical or collection devices for further off-chip sample manipulation and analysis is disclosed.
Journal ArticleDOI
Multichannel microchip electrospray mass spectrometry.
Qifeng Xue,František Foret,Yuriy M. Dunayevskiy,Paul M. Zavracky,Nicol E. McGruer,Barry L. Karger +5 more
TL;DR: The parallel mutliple-channel microchip system allowed ESI-MS analysis of different samples of standard peptides and proteins in one chip, and the detection limit of the microchip MS experiment for myoglobin was found to be lower than 6 x 10(-8) M.
Patent
Micromechanical switch with insulated switch contact
TL;DR: In this article, the authors present a micromechanical switch made by surface micromachining techniques and include an isolated contact located on the beam and separated from the main body of the beam by an insulated connector.
Journal ArticleDOI
Micromechanical switches fabricated using nickel surface micromachining
TL;DR: Micromechanical switches have been fabricated in electroplated nickel using a four-level surface micromachining process as mentioned in this paper, with three terminals, a source, a drain, and a gate.
Journal ArticleDOI
Thermal expansion coefficient of polycrystalline silicon and silicon dioxide thin films at high temperatures
Haruna Tada,Amy E. Kumpel,Richard E. Lathrop,John B. Slanina,Patricia M. Nieva,Paul M. Zavracky,Ioannis N. Miaoulis,Peter Y. Wong +7 more
TL;DR: In this article, a technique was developed to use MEMS test structures for the determination of the difference in thermal expansion coefficients (α) between poly-Si and SiO2 thin films at high temperatures.