Philip J. Tobin

Bio: Philip J. Tobin is an academic researcher from Freescale Semiconductor. The author has contributed to research in topics: Gate dielectric & Gate oxide. The author has an hindex of 47, co-authored 186 publications receiving 6502 citations. Previous affiliations of Philip J. Tobin include University of Helsinki & Motorola.

Thermodynamic stability of high-K dielectric metal oxides ZrO2 and HfO2 in contact with Si and SiO2

Abstract: We present theoretical and experimental results regarding the thermodynamic stability of the high-k dielectrics ZrO2 and HfO2 in contact with Si and SiO2 The HfO2/Si interface is found to be stable with respect to formation of silicides whereas the ZrO2/Si interface is not The metal–oxide/SiO2 interface is marginally unstable with respect to formation of silicates Cross-sectional transmission electron micrographs expose formation of nodules, identified as silicides, across the polycrystalline silicon/ZrO2/Si interfaces but not for the interfaces with HfO2 For both ZrO2 and HfO2, the x-ray photoemission spectra illustrate formation of silicate-like compounds in the MO2/SiO2 interface

Method for forming high dielectric constant metal oxides

Abstract: A method for forming a metal gate (20) structure begins by providing a semiconductor substrate (12). The semiconductor substrate (12) is cleaned to reduce trap sites. A nitrided layer (14) having a thickness of less than approximately 20 Angstroms is formed over the substrate (12). This nitrided layer prevents the formation of an oxide at the substrate interface and has a dielectric constant greater than 3.9. After the formation of the nitrided layer(14), a metal oxide layer (16) having a permittivity value of greater than roughly 8.0 is formed over the nitrided layer (14). A metal gate (20) is formed over the nitrided layer whereby the remaining composite gate dielectric (14 and 16) has a larger physical thickness but a high-performance equivalent oxide thickness (EOT).

The effects of boron penetration on p/sup +/ polysilicon gated PMOS devices

Abstract: The penetration of boron into and through the gate oxides of PMOS devices which employ p/sup +/ doped polysilicon gates is studied. Boron penetration results in large positive shifts in V/sub FB/, increased PMOS subthreshold slope and electron trapping rate, and decreased low-field mobility and interface trap density. Fluorine-related effects caused by BF/sub 2/ implantations into the polysilicon gate are shown to result in PMOS threshold voltage instabilities. Inclusion of a phosphorus co-implant or TiSi/sub 2/ salicide prior to gate implantation is shown to minimize this effect. The boron penetration phenomenon is modeled by a very shallow, fully-depleted p-type layer in the silicon substrate close to the SiO/sub 2//Si interface. >

Fermi-level pinning at the polysilicon/metal-oxide interface-Part II

Abstract: We report here that Fermi pinning at the polysilicon/metal-oxide interface causes high threshold voltages in MOSFET devices. In Part I, we investigated the different gatestack regions and determined that the polysilicon/metal oxide interface plays a key role on the threshold voltages. Now in Part II, the effects of the interfacial bonding are examined by experiments with submonolayer atomic-layer deposition (ALD) metal oxides and atomistic simulation. Results indicate that pinning occurs due to the interfacial Si-Hf and Si-O-Al bonds for HfO/sub 2/ and Al/sub 2/O/sub 3/, respectively. Oxygen vacancies at polysilicon/HfO/sub 2/ interfaces also lead to Fermi pinning. This fundamental characteristic affects the observed polysilicon depletion.

Contributions to the effective work function of platinum on hafnium dioxide

Abstract: The intrinsic and extrinsic contributions to Fermi level pinning of platinum (Pt) electrodes on hafnium dioxide (HfO2) gate dielectrics are investigated by examining the impact of oxygen and forming gas anneals on the effective work function of Pt-HfO2-silicon capacitors. The effective platinum work function is ∼4.6eV when annealed in forming gas. However, diffusion of oxygen to the Pt∕HfO2 interface increases the platinum work function to a value of ∼4.9eV. Subsequent annealing in forming gas returns the platinum work function to a value comparable to that measured prior to the oxygen anneal. The effective platinum work functions are compared to the prediction of the metal induced gap states (MIGS) model. The presence of interfacial oxygen vacancies or platinum–hafnium bonds is believed to be responsible for a degree of pinning that is stronger than predicted from the MIGS model alone.

Surface modification of titanium, titanium alloys, and related materials for biomedical applications

Abstract: Titanium and titanium alloys are widely used in biomedical devices and components, especially as hard tissue replacements as well as in cardiac and cardiovascular applications, because of their desirable properties, such as relatively low modulus, good fatigue strength, formability, machinability, corrosion resistance, and biocompatibility. However, titanium and its alloys cannot meet all of the clinical requirements. Therefore, in order to improve the biological, chemical, and mechanical properties, surface modification is often performed. This article reviews the various surface modification technologies pertaining to titanium and titanium alloys including mechanical treatment, thermal spraying, sol–gel, chemical and electrochemical treatment, and ion implantation from the perspective of biomedical engineering. Recent work has shown that the wear resistance, corrosion resistance, and biological properties of titanium and titanium alloys can be improved selectively using the appropriate surface treatment techniques while the desirable bulk attributes of the materials are retained. The proper surface treatment expands the use of titanium and titanium alloys in the biomedical fields. Some of the recent applications are also discussed in this paper.

Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process

Abstract: Atomic layer deposition(ALD), a chemical vapor deposition technique based on sequential self-terminating gas–solid reactions, has for about four decades been applied for manufacturing conformal inorganic material layers with thickness down to the nanometer range. Despite the numerous successful applications of material growth by ALD, many physicochemical processes that control ALD growth are not yet sufficiently understood. To increase understanding of ALD processes, overviews are needed not only of the existing ALD processes and their applications, but also of the knowledge of the surface chemistry of specific ALD processes. This work aims to start the overviews on specific ALD processes by reviewing the experimental information available on the surface chemistry of the trimethylaluminum/water process. This process is generally known as a rather ideal ALD process, and plenty of information is available on its surface chemistry. This in-depth summary of the surface chemistry of one representative ALD process aims also to provide a view on the current status of understanding the surface chemistry of ALD, in general. The review starts by describing the basic characteristics of ALD, discussing the history of ALD—including the question who made the first ALD experiments—and giving an overview of the two-reactant ALD processes investigated to date. Second, the basic concepts related to the surface chemistry of ALD are described from a generic viewpoint applicable to all ALD processes based on compound reactants. This description includes physicochemical requirements for self-terminating reactions,reaction kinetics, typical chemisorption mechanisms, factors causing saturation, reasons for growth of less than a monolayer per cycle, effect of the temperature and number of cycles on the growth per cycle (GPC), and the growth mode. A comparison is made of three models available for estimating the sterically allowed value of GPC in ALD. Third, the experimental information on the surface chemistry in the trimethylaluminum/water ALD process are reviewed using the concepts developed in the second part of this review. The results are reviewed critically, with an aim to combine the information obtained in different types of investigations, such as growth experiments on flat substrates and reaction chemistry investigation on high-surface-area materials. Although the surface chemistry of the trimethylaluminum/water ALD process is rather well understood, systematic investigations of the reaction kinetics and the growth mode on different substrates are still missing. The last part of the review is devoted to discussing issues which may hamper surface chemistry investigations of ALD, such as problematic historical assumptions, nonstandard terminology, and the effect of experimental conditions on the surface chemistry of ALD. I hope that this review can help the newcomer get acquainted with the exciting and challenging field of surface chemistry of ALD and can serve as a useful guide for the specialist towards the fifth decade of ALD research.

Ferroelectricity in hafnium oxide thin films

Abstract: We report that crystalline phases with ferroelectric behavior can be formed in thin films of SiO2 doped hafnium oxide. Films with a thickness of 10 nm and with less than 4 mol. % of SiO2 crystallize in a monoclinic/tetragonal phase mixture. We observed that the formation of the monoclinic phase is inhibited if crystallization occurs under mechanical encapsulation and an orthorhombic phase is obtained. This phase shows a distinct piezoelectric response, while polarization measurements exhibit a remanent polarization above 10 μC/cm2 at a coercive field of 1 MV/cm, suggesting that this phase is ferroelectric. Ferroelectric hafnium oxide is ideally suited for ferroelectric field effect transistors and capacitors due to its excellent compatibility to silicon technology.

High dielectric constant gate oxides for metal oxide Si transistors

Abstract: The scaling of complementary metal oxide semiconductor transistors has led to the silicon dioxide layer, used as a gate dielectric, being so thin (14?nm) that its leakage current is too large It is necessary to replace the SiO2 with a physically thicker layer of oxides of higher dielectric constant (?) or 'high K' gate oxides such as hafnium oxide and hafnium silicate These oxides had not been extensively studied like SiO2, and they were found to have inferior properties compared with SiO2, such as a tendency to crystallize and a high density of electronic defects Intensive research was needed to develop these oxides as high quality electronic materials This review covers both scientific and technological issues?the choice of oxides, their deposition, their structural and metallurgical behaviour, atomic diffusion, interface structure and reactions, their electronic structure, bonding, band offsets, electronic defects, charge trapping and conduction mechanisms, mobility degradation and flat band voltage shifts The oxygen vacancy is the dominant electron trap It is turning out that the oxides must be implemented in conjunction with metal gate electrodes, the development of which is further behind Issues about work function control in metal gate electrodes are discussed

Semiconductor device, and manufacturing method thereof

Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.