Qamar Ul Wahab

Bio: Qamar Ul Wahab is an academic researcher from Linköping University. The author has contributed to research in topics: Amplifier & Schottky diode. The author has an hindex of 26, co-authored 118 publications receiving 2955 citations. Previous affiliations of Qamar Ul Wahab include NED University of Engineering and Technology & Swedish Defence Research Agency.

New materials for micro-scale sensors and actuators An engineering review

Abstract: This paper provides a detailed overview of developments in transducer materials technology relating to their current and future applications in micro-scale devices. Recent advances in piezoelectric, magnetostrictive and shape-memory alloy systems are discussed and emerging transducer materials such as magnetic nanoparticles, expandable micro-spheres and conductive polymers are introduced. Materials properties, transducer mechanisms and end applications are described and the potential for integration of the materials with ancillary systems components is viewed as an essential consideration. The review concludes with a short discussion of structural polymers that are extending the range of micro-fabrication techniques available to designers and production engineers beyond the limitations of silicon fabrication technology.

Ionization rates and critical fields in 4H silicon carbide

Abstract: Epitaxial p-n diodes in 4H SiC are fabricated showing a good uniformity of avalanche multiplication and breakdown. Peripheral breakdown is overcome using the positive angle beveling technique. Photomultiplication measurements were performed to determine electron and hole ionization rates. For the electric field parallel to the c-axis impact ionization is strongly dominated by holes. A hole to electron ionization coefficient ratio of up to 50 is observed. It is attributed to the discontinuity of the conduction band of 4H SiC for the direction along the c axis. Theoretical values of critical fields and breakdown voltages in 4H SiC are calculated using the ionization rates obtained.

Silicon carbide and diamond for high temperature device applications

Abstract: The physical and chemical properties of wide bandgap semiconductors silicon carbide and diamond make these materials an ideal choice for device fabrication for applications in many different areas, e.g. light emitters, high temperature and high power electronics, high power microwave devices, micro-electromechanical system (MEMS) technology, and substrates. These semiconductors have been recognized for several decades as being suitable for these applications, but until recently the low material quality has not allowed the fabrication of high quality devices. Silicon carbide and diamond based electronics are at different stages of their development. An overview of the status of silicon carbide's and diamond's application for high temperature electronics is presented.

High-carbon concentrations at the silicon dioxide–silicon carbide interface identified by electron energy loss spectroscopy

Abstract: High carbon concentrations at distinct regions at thermally-grown SiO2/6H-SiC(0001) interfaces have been detected by electron energy loss spectroscopy (EELS). The thickness of these C-rich regions is estimated to be 10-15 Angstrom. The oxides were grown on n-type 6H-SiC at 1100 degrees C in a wet O-2 ambient for 4 h immediately after cleaning the substrates with the complete RCA process. In contrast, C-rich regions were not detected from EELS analyses of thermally grown SiO2/Si interfaces nor of chemical vapor deposition deposited SiO2/SiC interfaces. Silicon-rich layers within the SiC substrate adjacent to the thermally grown SiO2/SiC interface were also evident. The interface state density D-it in metal-oxide-SiC diodes (with thermally grown SiO2) was approximately 9x10(11) cm(-2) eV(-1) at E- E-v=2.0 eV, which compares well with reported values for SiC metal-oxide-semiconductor (MOS) diodes that have not received a postoxidation anneal. The C-rich regions and the change in SiC stoichiometry may be associated with the higher than desirable D-it's and the low channel mobilities in SiC-based MOS field effect transistors. (C) 2000 American Institute of Physics. [S0003-6951(00)01940-9].

Influence of epitaxial growth and substrate-induced defects on the breakdown of 4H–SiC Schottky diodes

Abstract: Morphological defects and elementary screw dislocations in 4H-SiC were studied by high voltage Ni Schottky diodes. Micropipes were found to severely limit the performance of 4H-SiC power devices, w ...

Phd by thesis

Abstract: Deposits of clastic carbonate-dominated (calciclastic) sedimentary slope systems in the rock record have been identified mostly as linearly-consistent carbonate apron deposits, even though most ancient clastic carbonate slope deposits fit the submarine fan systems better. Calciclastic submarine fans are consequently rarely described and are poorly understood. Subsequently, very little is known especially in mud-dominated calciclastic submarine fan systems. Presented in this study are a sedimentological core and petrographic characterisation of samples from eleven boreholes from the Lower Carboniferous of Bowland Basin (Northwest England) that reveals a >250 m thick calciturbidite complex deposited in a calciclastic submarine fan setting. Seven facies are recognised from core and thin section characterisation and are grouped into three carbonate turbidite sequences. They include: 1) Calciturbidites, comprising mostly of highto low-density, wavy-laminated bioclast-rich facies; 2) low-density densite mudstones which are characterised by planar laminated and unlaminated muddominated facies; and 3) Calcidebrites which are muddy or hyper-concentrated debrisflow deposits occurring as poorly-sorted, chaotic, mud-supported floatstones. These

Large‐band‐gap SiC, III‐V nitride, and II‐VI ZnSe‐based semiconductor device technologies

Abstract: In the past several years, research in each of the wide‐band‐gap semiconductors, SiC, GaN, and ZnSe, has led to major advances which now make them viable for device applications. The merits of each contender for high‐temperature electronics and short‐wavelength optical applications are compared. The outstanding thermal and chemical stability of SiC and GaN should enable them to operate at high temperatures and in hostile environments, and also make them attractive for high‐power operation. The present advanced stage of development of SiC substrates and metal‐oxide‐semiconductor technology makes SiC the leading contender for high‐temperature and high‐power applications if ohmic contacts and interface‐state densities can be further improved. GaN, despite fundamentally superior electronic properties and better ohmic contact resistances, must overcome the lack of an ideal substrate material and a relatively advanced SiC infrastructure in order to compete in electronics applications. Prototype transistors have been fabricated from both SiC and GaN, and the microwave characteristics and high‐temperature performance of SiC transistors have been studied. For optical emitters and detectors, ZnSe, SiC, and GaN all have demonstrated operation in the green, blue, or ultraviolet (UV) spectra. Blue SiC light‐emitting diodes (LEDs) have been on the market for several years, joined recently by UV and blue GaN‐based LEDs. These products should find wide use in full color display and other technologies. Promising prototype UV photodetectors have been fabricated from both SiC and GaN. In laser development, ZnSe leads the way with more sophisticated designs having further improved performance being rapidly demonstrated. If the low damage threshold of ZnSe continues to limit practical laser applications, GaN appears poised to become the semiconductor of choice for short‐wavelength lasers in optical memory and other applications. For further development of these materials to be realized, doping densities (especially p type) and ohmic contact technologies have to be improved. Economies of scale need to be realized through the development of larger SiC substrates. Improved substrate materials, ideally GaN itself, need to be aggressively pursued to further develop the GaN‐based material system and enable the fabrication of lasers. ZnSe material quality is already outstanding and now researchers must focus their attention on addressing the short lifetimes of ZnSe‐based lasers to determine whether the material is sufficiently durable for practical laser applications. The problems related to these three wide‐band‐gap semiconductor systems have moved away from materials science toward the device arena, where their technological development can rapidly be brought to maturity.

Microscale acoustofluidics: Microfluidics driven via acoustics and ultrasonics

Abstract: This article reviews acoustic microfiuidics: the use of acoustic fields, principally ultrasonics, for application in microfiuidics. Although acoustics is a classical field, its promising, and indeed perplexing, capabilities in powerfully manipulating both fluids and particles within those fluids on the microscale to nanoscale has revived interest in it. The bewildering state of the literature and ample jargon from decades of research is reorganized and presented in the context of models derived from first principles. This hopefully will make the area accessible for researchers with experience in materials science, fluid mechanics, or dynamics. The abundance of interesting phenomena arising from nonlinear interactions in ultrasound that easily appear at these small scales is considered, especially in surface acoustic wave devices that are simple to fabricate with planar lithography techniques common in microfluidics, along with the many applications in microfluidics and nanofluidics that appear through the literature.

Piezoelectric and ferroelectric materials and structures for energy harvesting applications

Abstract: This review provides a detailed overview of the energy harvesting technologies associated with piezoelectric materials along with the closely related sub-classes of pyroelectrics and ferroelectrics. These properties are, in many cases, present in the same material, providing the intriguing prospect of a material that can harvest energy from multiple sources including vibration, thermal fluctuations and light. Piezoelectric materials are initially discussed in the context of harvesting mechanical energy from vibrations using inertial energy harvesting, which relies on the resistance of a mass to acceleration, and kinematic energy harvesting which directly couples the energy harvester to the relative movement of different parts of a source. Issues related to mode of operation, loss mechanisms and using non-linearity to enhance the operating frequency range are described along with the potential materials that could be employed for harvesting vibrations at elevated temperatures. In addition to inorganic piezoelectric materials, compliant piezoelectric materials are also discussed. Piezoelectric energy harvesting devices are complex multi-physics systems requiring advanced methodologies to maximise their performance. The research effort to develop optimisation methods for complex piezoelectric energy harvesters is then reviewed. The use of ferroelectric or multi-ferroic materials to convert light into chemical or electrical energy is then described in applications where the internal electric field can prevent electron–hole recombination or enhance chemical reactions at the ferroelectric surface. Finally, pyroelectric harvesting generates power from temperature fluctuations and this review covers the modes of pyroelectric harvesting such as simple resistive loading and Olsen cycles. Nano-scale pyroelectric systems and novel micro-electro-mechanical-systems designed to increase the operating frequency are discussed.

High-temperature electronics - a role for wide bandgap semiconductors?

Abstract: The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300/spl deg/C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog VLSI in this temperature range. However practical operation of silicon power devices at ambient temperatures above 200/spl deg/C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.