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R. Glogowski

Bio: R. Glogowski is an academic researcher from University of Lisbon. The author has contributed to research in topics: Return loss & Waveguide (optics). The author has an hindex of 1, co-authored 1 publications receiving 6 citations.

Papers
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Proceedings Article
08 Apr 2013
TL;DR: In this paper, a simple right-angle transition between a rectangular waveguide and a substrate integrated waveguide (SIW) is proposed, where two slots etched in the broad wall of the SIW are used to create double resonance behavior that results in a broad bandwidth of the element.
Abstract: In this paper the authors present a simple right-angle transition between a rectangular waveguide (RWG) and Substrate Integrated Waveguide (SIW). The coupling between both waveguide types is realised by using two slots etched in the broad wall of the SIW. Different lengths of the slots create a double resonance behaviour that results in a broad bandwidth of the element. The standard flange of the rectangular waveguide can be easily flush-mounted to the substrate of the SIW, and therefore, the proposed component has a simple mechanical configuration. A sample transition is designed to work in the lower part of the Ka-band. The simulation results show that the proposed component has the return loss better than 15 dB in the bandwidth of 1.9 GHz. The insertion loss is better than 1 dB including the losses of a short section of SIW.

6 citations


Cited by
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Patent
13 Jun 2014
TL;DR: In this article, an integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the material and a second side opposite to the first side, and an integrated antenna structure arranged between the first and second isolating layers.
Abstract: An integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the electrically conductive material and a second side opposite to the first side, a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and arranged at a package side, and an integrated antenna structure arranged between the first electrically isolating layer and the second electrically isolating layer. The electrically conductive material is encapsulated by a dielectric material, arranged to partly overlap the integrated antenna structure, separated from the integrated antenna structure by at least the first electrically isolating layer and arranged to reflect a radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side.

18 citations

Patent
13 Jun 2014
TL;DR: In this paper, the authors proposed a radio frequency coupling structure consisting of a dielectric layer, a first electrically conductive layer comprising a first transition structure, and an integrated waveguide structure.
Abstract: A radio frequency coupling structure is arranged to couple a radio frequency signal between a first side of the radio frequency coupling structure to a second side of the radio frequency coupling structure opposite to the first side. The radio frequency coupling structure comprises a dielectric layer, a first electrically conductive layer comprising a first transition structure, a second electrically conductive layer comprising a second transition structure, and an integrated waveguide structure formed by an array of electrically conductive vias extending through the dielectric layer from the first to the second electrically conductive layer to enclose a portion of the dielectric layer. The portion is arranged to guide the radio frequency signal between the first transition structure and the second transition structure.

11 citations

Patent
29 Aug 2014
TL;DR: In this article, a radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at first and second sides of a first dielectric substrate, respectively.
Abstract: A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises: a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The hole extends beyond the first wall away from the second wall.

8 citations

Patent
13 Jun 2014
TL;DR: In this article, an integrated circuit package comprises a dielectric material, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and receiving a radio frequency signal arranged between the first and second electrically isolating layers.
Abstract: An integrated circuit package comprises a dielectric material, a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer arranged at a first side of the integrated circuit package, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and/or receiving a radio frequency signal arranged between the first and second electrically isolating layers. The electrically conductive material is separated from the integrated antenna structure by at least the dielectric material and the first electrically isolating layer, arranged to partly overlap the integrated antenna structure and to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer and the dielectric material to the first side.

7 citations

Patent
26 Oct 2016
TL;DR: In this article, a radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at first and second sides of a first dielectric substrate, respectively.
Abstract: A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises first and second coupling structures. Each coupling structure has a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The first and second coupling structures are symmetrically arranged with the first electrically conductive layers closer to each other than the second electrically conductive layers are to each other.

5 citations