R. J. Schaefer

Bio: R. J. Schaefer is an academic researcher from National Institute of Standards and Technology. The author has contributed to research in topics: Phase (matter) & Intermetallic. The author has an hindex of 16, co-authored 30 publications receiving 932 citations.

The Effect of Rapid Solidification Velocity on the Microstructure of Ag-Cu Alloys

Abstract: Electron beam solidification passes have been performed on a series of Ag-Cu alloys between 1 wt pct Cu and the eutectic composition (28.1 wt pct Cu) at speeds between 1.5 and 400 cm per second. At low growth rates conventional dendritic or eutectic structures are obtained. The maximum growth rate of eutectic structure is 2.5 cm per second. At high growth rates microsegregation-free single phase structures are obtained for all compositions. The velocity required to produce this structure increases with composition for dilute alloys and agrees with the theory of absolute stability of a planar liquid-solid interface with equilibrium partitioning. For alloys between 15 and 28 wt pct Cu, the velocity required to produce the microsegregation-free extended solid solution decreases with composition and is related to nonequilibrium trapping of solute at the liquid solid interface. At intermediate growth rates for alloys with 9 wt pct Cu or greater, a structure consisting of alternating bands of cellular and cell-free material is obtained. The bands form approximately parallel to the local interface.

Icosahedral and decagonal phase formation in Al-Mn alloys

Abstract: The solidification conditions leading to the formation of the icosahedral phase in Al-Mn alloys have been investigated, using samples prepared by melt spinning and electron beam surface melting. It is found that the icosahedral phase can grow with a range of compositions, but that it grows in competition with another metastable phase which is decagonal. Both of these phases can displace the equilibrium intermetallic phases by nucleating ahead of them in the melt when the solidification velocity is greater than a few centimeters per second. The relative abundance of the icosahedral and decagonal phases varies with composition and solidification rate. Icosahedral crystals in electron beam melt trails are often about 25 μm in diameter, and they grow dendritically along a preferred crystallographic direction.

Stable and metastable phase equilibria in the Al-Mn system

Abstract: The aim of the present investigation was resolution of certain obscure features of the Al-Mn phase diagram. The experimental approach was guided by assessment of the previous literature and modeling of the thermodynamics of the system. It has been shown that two phases of approximate stoichiometry “Al4Mn” (λ and μ) are present in stable equilibrium, λ forming by a peritectoid reaction at 693 ± 2 °C. The liquidus and stable equilibrium invariant reactions as proposed by Goedecke and Koester have been verified. A map has been made of the successive nonequilibrium phase transformations of as-splat-quenched alloys. Finally, the thermodynamic calculation of the phase diagram allows interpretation of complex reaction sequences during cooling in terms of a catalogue of all the metastable invariant reactions involving (Al), Al6Mn, λ, μ, ϕ, and Al11Mn4 phases.

Precipitation in rapidly solidified Al-Mn alloys

Abstract: Precipitation at 450 °C was studied in melt-spun ribbons containing up to 15 wt pct Mn in solid solution in Al. The as-spun ribbons were microsegregation-free at compositions up to 5 wt pct Mn, but in more concentrated alloys a cellular microstructure was present. Upon annealing, four precipitate phases are observed, some of them being found preferentially on cell boundaries and others being found within the cells. Al6Mn, G, and the Gℍ phase can coexist for long times at 450 °C, but the G phase appears to be slightly more stable. A less stable T phase was detected in Al-5 wt pct Mn foils following short annealing periods. The supersaturation of the Al matrix can persist for many hours in alloys containing up to 3 wt pct Mn, but is essentially gone after 1 hour in alloys with 5 wt pct Mn or more.

Phase-Field Simulation of Solidification

Abstract: ▪ Abstract An overview of the phase-field method for modeling solidification is presented, together with several example results. Using a phase-field variable and a corresponding governing equation to describe the state (solid or liquid) in a material as a function of position and time, the diffusion equations for heat and solute can be solved without tracking the liquid-solid interface. The interfacial regions between liquid and solid involve smooth but highly localized variations of the phase-field variable. The method has been applied to a wide variety of problems including dendritic growth in pure materials; dendritic, eutectic, and peritectic growth in alloys; and solute trapping during rapid solidification.

A review of mechanical properties of lead-free solders for electronic packaging

Abstract: The characterization of lead-free solders, especially after isothermal aging, is very important in order to accurately predict the reliability of solder joints. However, due to lack of experimental testing standards and the high homologous temperature of solder alloys (Th > 0.5Tm even at room temperature), there are very large discrepancies in both the tensile and creep properties provided in current databases for both lead-free and Sn–Pb solder alloys. Some recent researches show that the room temperature aging has significant effects on mechanical properties of solders. This paper is intended to review all available data in the field and give rise to the possible factors including room temperature effects which causes the large discrepancies of data. This review of the research literatures has documented the dramatic changes that occur in the constitutive and failure behavior of solder materials and solder joint interfaces during isothermal aging. However, these effects have been largely ignored in most previous studies involving solder material characterization or finite element predictions of solder joint reliability during thermal cycling. It is widely acknowledged that the large discrepancies in measured solder mechanical properties from one study to another arise due to differences in the microstructures of the tested samples. This problem is exacerbated by the aging issue, as it is clear that the microstructure and material behavior of the samples used in even a single investigation are moving targets that change rapidly even at room temperature. Furthermore, the effects of aging on solder behavior must be better understood so that more accurate viscoplastic constitutive equations can be developed for SnPb and SAC solders. Without such well-defined relationship, it is doubtful that finite element reliability predictions can ever reach their full potential.