Author
R.R. Riehl
Bio: R.R. Riehl is an academic researcher from National Institute for Space Research. The author has contributed to research in topics: Computer cooling & Thermal resistance. The author has an hindex of 1, co-authored 1 publications receiving 87 citations.
Papers
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TL;DR: In this article, a copper miniature loop heat pipe (mLHP) with a flat disk shaped evaporator, 30mm in diameter and 10-mm thick, was designed for thermal control of computer microprocessors.
Abstract: This paper presents an experimental investigation on a copper miniature loop heat pipe (mLHP) with a flat disk shaped evaporator, 30mm in diameter and 10-mm thick, designed for thermal control of computer microprocessors. Tests were conducted with water as the heat transfer fluid. The device was capable of transferring a heat load of 70W through a distance up to 150mm using 2-mm diameter transport lines. For a range of power applied to the evaporator, the system demonstrated very reliable startup and was able to achieve steady state without any symptoms of wick dry-out. Unlike cylindrical evaporators, flat evaporators are easy to attach to the heat source without need of any cylinder-to-plane reducer material at the interface and thus offer very low thermal resistance to the heat acquisition process. In the horizontal configuration, under air cooling, the minimum value for the mLHP thermal resistance is 0.17degC/W with the corresponding evaporator thermal resistance of 0.06degC/W. It is concluded from the outcomes of the current study that a mLHP with flat evaporator geometry can be effectively used for the thermal control of electronic equipment including notebooks with limited space and high heat flux chipsets. The results also confirm the superior heat transfer characteristics of the copper-water configuration in mLHPs
99 citations
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TL;DR: In this article, the state-of-the-art of multi-level thermal management techniques for both air- and liquid-cooled data centers is reviewed. But the main focus is on the sources of inefficiencies and the improvement methods with their configuration features and performances at each level.
272 citations
TL;DR: A review of small heat pipes, including their design, analysis, and fabrication, is presented in this article, where the authors also discuss the potential of nano-wicks, such as carbon nanotubes (CNTs), to represent the future of heat pipes.
205 citations
TL;DR: In this paper, the authors compared the heat transfer characteristics of several cooling technologies with potential application in the server electronics industry and concluded that some form of liquid cooling is necessary in high performance computing applications.
164 citations
TL;DR: In this paper, an analytical review of development, results of tests and simulation of loop heat pipes with disk-shaped, rectangular and flat-oval evaporators is presented, which may be arbitrarily separated into evaporators with opposite replenishment (EORs) and evaporators of longitudinal replenishment.
150 citations
TL;DR: In this article, a copper-water compact loop heat pipe (LHP) with a unique flat, square evaporator with dimension of 30mm (L )×30mm (W )×15mm (H ) and a connecting tube having an inner diameter of 5mm.
123 citations