Author
R. Srikanth
Bio: R. Srikanth is an academic researcher from Indian Institute of Technology Madras. The author has contributed to research in topics: Phase-change material & Heat sink. The author has an hindex of 3, co-authored 4 publications receiving 58 citations.
Papers
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TL;DR: In this paper, a numerical optimization and experimental investigation of phase change material (PCM) based composite pin fin matrix heat sink was performed to determine the optimized configuration of the matrix type heat sink that will stretch the operation time during heating cycle and minimize the time during discharging cycle.
63 citations
11 Jul 2017
TL;DR: In this paper, the performance of a phase change material based cuboidal heat sinks with 72pin fins on the inside to act as thermal conductivity enhancers was investigated, and correlations were developed for the characteristic time for phase change with natural convection as a function of the individual heat input values.
Abstract: This paper reports the results of an experimental investigation on the thermal performance of a phase change material based cuboidal heat sinks with 72 pin fins on the inside to act as thermal conductivity enhancers. The heat sink base is heated with four equal sized heaters. The total power of the heaters is fixed, while the individual wattage can vary. First, in house experiments are conducted for different combinations of power. Based on the experimental results, correlations are then developed for the characteristic time for phase change with natural convection as a function of the individual heat input values. Additional experiments are conducted to validate the developed correlation and a good agreement is found. The correlations developed are useful for future optimization studies.
9 citations
01 Sep 2016
TL;DR: In this article, a phase change material assisted by a thermosyphon inside a two dimensional rectangular domain is numerically investigated and the effects of inclusion of multiple heat pipes on the melting of the PCM inside the enclosure is studied.
Abstract: Melting of a phase change material assisted by a thermosyphon inside a two dimensional rectangular domain is numerically investigated. The PCM used is n-eicosane and the thermosyphon is made of copper. The working fluid is water. The fill ratio of the working fluid (water) is taken to be 50%. A lumped model is used for the simulation of transient operation of the thermosyphon and enthalpy-porosity method is employed for numerical simulation of melting of PCM. The effects of inclusion of multiple heat pipes on the melting of the PCM inside the enclosure is studied. Simulation results indicate that the addition of heat pipes enhances the performance of latent heat thermal energy storage system only upto a certain extent.
4 citations
01 Jan 2014
2 citations
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TL;DR: In this paper, a parametric analysis for the round pin-finned heat sinks subjected to steady heat densities for effective and reliable cooling of mobile electronic devices is presented, where phase change material (PCM) namely paraffin wax is adopted as energy storage material and aluminum made round pinfins are selected as thermal conductivity enhancers (TCEs).
164 citations
TL;DR: In this article, the effects of phase change material (PCM) and a nano/nano-PCM on the thermal performance of an electronic chipset have been investigated in passive and active operating modes.
160 citations
TL;DR: In this article, the authors investigated the performance of pin-fin configurations with and without phase change materials (PCMs) for heat transfer in electronic integrated circuits and found that triangular pin-fins are the most effective configuration for heat-transfer.
154 citations
TL;DR: In this paper, the authors present a correlation to estimate the optimum number of fins and optimum PCM volume fraction in a phase change material (PCM) based heat sink, where the objective function is defined as the longest safe operating time of the device prior to reach the critical temperature.
139 citations
TL;DR: In this article, phase change materials (PCMs) were used as thermal conductivity enhancers (TCEs) for passive cooling systems. But, the authors focused on the optimization of passive cooling system using extruded finned surfaces.
129 citations