R. Van Overstraeten

Bio: R. Van Overstraeten is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Silicon & Doping. The author has an hindex of 25, co-authored 138 publications receiving 3829 citations. Previous affiliations of R. Van Overstraeten include IMEC.

III–nitrides: Growth, characterization, and properties

Abstract: During the last few years the developments in the field of III–nitrides have been spectacular. High quality epitaxial layers can now be grown by MOVPE. Recently good quality epilayers have also been grown by MBE. Considerable work has been done on dislocations, strain, and critical thickness of GaN grown on different substrates. Splitting of valence band by crystal field and by spin-orbit interaction has been calculated and measured. The measured values agree with the calculated values. Effects of strain on the splitting of the valence band and on the optical properties have been studied in detail. Values of band offsets at the heterointerface between several pairs of different nitrides have been determined. Extensive work has been done on the optical and electrical properties. Near band-edge spectra have been measured over a wide range of temperatures. Free and bound exciton peaks have been resolved. Valence band structure has been determined using the PL spectra and compared with the theoretically calcu...

Minority carrier recombination in heavily-doped silicon

Abstract: A review of our present understanding about the minority carrier recombination in silicon with dopant concentration in the range of 1018–1020 cm−3 is presented. After providing a short phenomenological description of carrier recombination processes and lifetime, the main theories of carrier recombination in a semiconductor are briefly reviewed and their expected contributions to carrier recombination in silicon at heavy doping are indicated. The various methods used for measuring the minority carrier lifetime in heavily doped silicon are described and critically examined. Four different mechanisms are examined to explain the available lifetime data. Two of these involve SRH-type phononic recombination (i) via deep level traps generated by dopant introduced defects and (ii) through shallow donor/acceptor states. The other two non-phononic mechanisms are: (iii) Band to band Auger recombination and (iv) trap assisted Auger recombination. Mechanism (i) can not explain the observed insensitivity of lifetime to processing conditions and the dopant atoms, and contribution of (ii) remains insignificant up to the heaviest doping. Phonon assisted band to band Auger recombination appears to explain the measured lifetimes satisfactorily in p-type silicon. However, for n-type silicon this mechanism predicts considerably higher values of lifetime than the measured results and it is likely that mechanism (iv) (and probably (i) also) competes with this process. Calculations indicate that the rate of trap-assisted Auger recombination through the dopant generated acceptor states in p-type silicon and through donor states in n-type silicon becomes large enough to compete with the band to band Auger process at heavy doping. In n-type silicon Auger recombination through crystal defects like vacancies may also become important. Perhaps all these processes contribute to the carrier recombination at heavy doping but which of these controls the lifetime in n-type silicon is not known.

Transport equations in heavy doped silicon

Abstract: The general transport equations in a heavy doped semiconductor are given, taking the position-dependent band structure into account. An intrinsic concentration depending on the doping levels is introduced. This quantity allows us to use the classical equations in a slightly modified form, if Maxwell-Boltzmann statistics can be applied for one or both kinds of the carrier. The total density of states in a heavy doped semiconductor is assumed to be the envelope of the density of states of the conduction (valence) band and impurity band. The effect of the skewness of the impurity band is included. The Fermi level and the effective intrinsic carrier concentration are calculated for this total density of states function. Experimental evidence for the calculated values is given.

Impact ionization in silicon: A review and update

Abstract: After defining the multiplication factor and the ionization rate together with their interrelationship, multiplication and breakdown models for diodes and MOS transistors are discussed. Different ionization models are compared and test structures are discussed for measuring the multiplication factor accurately enough for reliable extraction of the ionization rates. Multiplication measurements at different temperatures are performed on a bipolar NPN transistor, and yield new electron ionization rates at relatively low electrical fields. An explanation for the spread of the experimental values of the existing data on ionization rate is given. A new implementation method for a local avalanche model into a device simulator is presented. The results are less sensitive to the chosen grid size than the ones obtained from the existing method.

Low-cost industrial technologies of crystalline silicon solar cells

Abstract: Approximately 2 billion people, mainly in Third World countries, are not connected to an electric grid. The standard, centralized grid development is too expensive and time consuming to solve the energy demand problem. Therefore, there is a need for decentralized renewable energy sources. The main attractiveness of solar cells is that they generate electricity directly from sunlight and can be mounted in modular, stand-alone photovoltaic (PV) systems. Particular attention is paid in this paper to crystalline silicon solar cells, since bulk silicon solar-cell (mono and multi) modules comprise approximately 85% of all worldwide PV module shipments. Energy conversion efficiency as high as 24% has been achieved on laboratory, small-area monocrystalline silicon cells, whereas the typical efficiency of industrial crystalline silicon solar cells is in the range of 13-16%. The market price of PV modules remains for the last few years in the range of $3.5-4.5/watt peak (Wp). For the photovoltaic industry, the biggest concern is to improve the efficiency and decrease the price of the commercial PV modules. Efficiency-enhancement techniques of commercial cells are described in detail. Adaptation of many high-efficiency features to industrially fabricated solar cells. The latest study shows that increasing the PV market size toward 500 MWp/y and accounting for realistic industrial improvements can lead to a drastic PV module price reduction down to $1/Wp.

Band parameters for III–V compound semiconductors and their alloys

Abstract: We present a comprehensive, up-to-date compilation of band parameters for the technologically important III–V zinc blende and wurtzite compound semiconductors: GaAs, GaSb, GaP, GaN, AlAs, AlSb, AlP, AlN, InAs, InSb, InP, and InN, along with their ternary and quaternary alloys. Based on a review of the existing literature, complete and consistent parameter sets are given for all materials. Emphasizing the quantities required for band structure calculations, we tabulate the direct and indirect energy gaps, spin-orbit, and crystal-field splittings, alloy bowing parameters, effective masses for electrons, heavy, light, and split-off holes, Luttinger parameters, interband momentum matrix elements, and deformation potentials, including temperature and alloy-composition dependences where available. Heterostructure band offsets are also given, on an absolute scale that allows any material to be aligned relative to any other.

Fundamentals of Modern VLSI Devices

Abstract: Learn the basic properties and designs of modern VLSI devices, as well as the factors affecting performance, with this thoroughly updated second edition. The first edition has been widely adopted as a standard textbook in microelectronics in many major US universities and worldwide. The internationally-renowned authors highlight the intricate interdependencies and subtle tradeoffs between various practically important device parameters, and also provide an in-depth discussion of device scaling and scaling limits of CMOS and bipolar devices. Equations and parameters provided are checked continuously against the reality of silicon data, making the book equally useful in practical transistor design and in the classroom. Every chapter has been updated to include the latest developments, such as MOSFET scale length theory, high-field transport model, and SiGe-base bipolar devices.

Band parameters for nitrogen-containing semiconductors

Abstract: We present a comprehensive and up-to-date compilation of band parameters for all of the nitrogen-containing III–V semiconductors that have been investigated to date. The two main classes are: (1) “conventional” nitrides (wurtzite and zinc-blende GaN, InN, and AlN, along with their alloys) and (2) “dilute” nitrides (zinc-blende ternaries and quaternaries in which a relatively small fraction of N is added to a host III–V material, e.g., GaAsN and GaInAsN). As in our more general review of III–V semiconductor band parameters [I. Vurgaftman et al., J. Appl. Phys. 89, 5815 (2001)], complete and consistent parameter sets are recommended on the basis of a thorough and critical review of the existing literature. We tabulate the direct and indirect energy gaps, spin-orbit and crystal-field splittings, alloy bowing parameters, electron and hole effective masses, deformation potentials, elastic constants, piezoelectric and spontaneous polarization coefficients, as well as heterostructure band offsets. Temperature an...

Luminescence properties of defects in GaN

Abstract: Gallium nitride (GaN) and its allied binaries InN and AIN as well as their ternary compounds have gained an unprecedented attention due to their wide-ranging applications encompassing green, blue, violet, and ultraviolet (UV) emitters and detectors (in photon ranges inaccessible by other semiconductors) and high-power amplifiers. However, even the best of the three binaries, GaN, contains many structural and point defects caused to a large extent by lattice and stacking mismatch with substrates. These defects notably affect the electrical and optical properties of the host material and can seriously degrade the performance and reliability of devices made based on these nitride semiconductors. Even though GaN broke the long-standing paradigm that high density of dislocations precludes acceptable device performance, point defects have taken the center stage as they exacerbate efforts to increase the efficiency of emitters, increase laser operation lifetime, and lead to anomalies in electronic devices. The p...

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Abstract: The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.