Rajesh Kumar

Bio: Rajesh Kumar is an academic researcher from Indian Institute of Technology Roorkee. The author has contributed to research in topics: Photonics & Silicon on insulator. The author has an hindex of 9, co-authored 48 publications receiving 1770 citations. Previous affiliations of Rajesh Kumar include Indian Institute of Technology Delhi & University of Colorado Boulder.

Single-chip microprocessor that communicates directly using light

Abstract: An electronic–photonic microprocessor chip manufactured using a conventional microelectronics foundry process is demonstrated; the chip contains 70 million transistors and 850 photonic components and directly uses light to communicate to other chips. The rapid transfer of data between chips in computer systems and data centres has become one of the bottlenecks in modern information processing. One way of increasing speeds is to use optical connections rather than electrical wires and the past decade has seen significant efforts to develop silicon-based nanophotonic approaches to integrate such links within silicon chips, but incompatibility between the manufacturing processes used in electronics and photonics has proved a hindrance. Now Chen Sun et al. describe a 'system on a chip' microprocessor that successfully integrates electronics and photonics yet is produced using standard microelectronic chip fabrication techniques. The resulting microprocessor combines 70 million transistors and 850 photonic components and can communicate optically with the outside world. This result promises a way forward for new fast, low-power computing systems architectures. Data transport across short electrical wires is limited by both bandwidth and power density, which creates a performance bottleneck for semiconductor microchips in modern computer systems—from mobile phones to large-scale data centres. These limitations can be overcome1,2,3 by using optical communications based on chip-scale electronic–photonic systems4,5,6,7 enabled by silicon-based nanophotonic devices8. However, combining electronics and photonics on the same chip has proved challenging, owing to microchip manufacturing conflicts between electronics and photonics. Consequently, current electronic–photonic chips9,10,11 are limited to niche manufacturing processes and include only a few optical devices alongside simple circuits. Here we report an electronic–photonic system on a single chip integrating over 70 million transistors and 850 photonic components that work together to provide logic, memory, and interconnect functions. This system is a realization of a microprocessor that uses on-chip photonic devices to directly communicate with other chips using light. To integrate electronics and photonics at the scale of a microprocessor chip, we adopt a ‘zero-change’ approach to the integration of photonics. Instead of developing a custom process to enable the fabrication of photonics12, which would complicate or eliminate the possibility of integration with state-of-the-art transistors at large scale and at high yield, we design optical devices using a standard microelectronics foundry process that is used for modern microprocessors13,14,15,16. This demonstration could represent the beginning of an era of chip-scale electronic–photonic systems with the potential to transform computing system architectures, enabling more powerful computers, from network infrastructure to data centres and supercomputers.

An ultra-small, low power all-optical flip-flop memory on a silicon chip

Abstract: Ultra-small, low-power, all-optical switching and memory elements, such as all-optical flip-flops, as well as photonic integrated circuits of many such elements, are in great demand for all-optical signal buffering, switching and processing. Silicon-on-insulator is considered to be a promising platform to accommodate such photonic circuits in large-scale configurations. Through heterogeneous integration of InP membranes onto silicon-on-insulator, a single microdisk laser with a diameter of 7.5 µm, coupled to a silicon-on-insulator wire waveguide, is demonstrated here as an all-optical flip-flop working in a continuous-wave regime with an electrical power consumption of a few milliwatts, allowing switching in 60 ps with 1.8 fJ optical energy. The total power consumption and the device size are, to the best of our knowledge, the smallest reported to date at telecom wavelengths. This is also the only electrically pumped, all-optical flip-flop on silicon built upon complementary metal-oxide semiconductor technology. Scientists demonstrate that a single 7.5-μm-diameter microdisk laser coupled to a silicon-on-insulator wire waveguide can work as an all-optical flip-flop memory. Under a continuous bias of 3.5 mA, flip-flop operation is demonstrated using optical triggering pulses of 1.8 fJ and with a switching time of 60 ps. This device is attractive for on-chip all-optical signal buffering, switching, and processing.

An ultra-small, low-power all-optical flip-flop memory on a silicon chip

Abstract: A 7.5pm-diameter InP microdisk laser, integrated on an SOI waveguide is demonstrated as all-optical flip-flop working in continuous-wave regime with an electrical power consumption of several mW, and allowing switching in 60ps with pulses of 1.8fJ.

Nanophotonic Devices for Optical Interconnect

Abstract: We review recent progress in nanophotonic devices for compact optical interconnect networks. We focus on microdisk-laser-based transmitters and discuss improved design and advanced functionality including all-optical wavelength conversion and flip-flops. Next we discuss the fabrication uniformity of the passive routing circuits and their thermal tuning. Finally, we discuss the performance of a wavelength selective detector.

Cascadable excitability in microrings.

Abstract: To emulate a spiking neuron, a photonic component needs to be excitable. In this paper, we theoretically simulate and experimentally demonstrate cascadable excitability near a self-pulsation regime in high-Q-factor silicon-on-insulator microrings. For the theoretical study we use Coupled Mode Theory. While neglecting the fast energy and phase dynamics of the cavity light, we can still preserve the most important microring dynamics, by only keeping the temperature difference with the surroundings and the amount of free carriers as dynamical variables of the system. Therefore we can analyse the microring dynamics in a 2D phase portrait. For some wavelengths, when changing the input power, the microring undergoes a subcritical Andronov-Hopf bifurcation at the self-pulsation onset. As a consequence the system shows class II excitability. Experimental single ring excitability and self-pulsation behaviour follows the theoretic predictions. Moreover, simulations and experiments show that this excitation mechanism is cascadable.

Silicon microring resonators

Abstract: An overview is presented of the current state-of-the-art in silicon nanophotonic ring resonators. Basic theory of ring resonators is discussed, and applied to the peculiarities of submicron silicon photonic wire waveguides: the small dimensions and tight bend radii, sensitivity to perturbations and the boundary conditions of the fabrication processes. Theory is compared to quantitative measurements. Finally, several of the more promising applications of silicon ring resonators are discussed: filters and optical delay lines, label-free biosensors, and active rings for efficient modulators and even light sources.

Deep learning with coherent nanophotonic circuits

Abstract: Artificial Neural Networks have dramatically improved performance for many machine learning tasks. We demonstrate a new architecture for a fully optical neural network that enables a computational speed enhancement of at least two orders of magnitude and three orders of magnitude in power efficiency over state-of-the-art electronics.

Integrated lithium niobate electro-optic modulators operating at CMOS-compatible voltages

Abstract: Electro-optic modulators translate high-speed electronic signals into the optical domain and are critical components in modern telecommunication networks1,2 and microwave-photonic systems3,4. They are also expected to be building blocks for emerging applications such as quantum photonics5,6 and non-reciprocal optics7,8. All of these applications require chip-scale electro-optic modulators that operate at voltages compatible with complementary metal–oxide–semiconductor (CMOS) technology, have ultra-high electro-optic bandwidths and feature very low optical losses. Integrated modulator platforms based on materials such as silicon, indium phosphide or polymers have not yet been able to meet these requirements simultaneously because of the intrinsic limitations of the materials used. On the other hand, lithium niobate electro-optic modulators, the workhorse of the optoelectronic industry for decades9, have been challenging to integrate on-chip because of difficulties in microstructuring lithium niobate. The current generation of lithium niobate modulators are bulky, expensive, limited in bandwidth and require high drive voltages, and thus are unable to reach the full potential of the material. Here we overcome these limitations and demonstrate monolithically integrated lithium niobate electro-optic modulators that feature a CMOS-compatible drive voltage, support data rates up to 210 gigabits per second and show an on-chip optical loss of less than 0.5 decibels. We achieve this by engineering the microwave and photonic circuits to achieve high electro-optical efficiencies, ultra-low optical losses and group-velocity matching simultaneously. Our scalable modulator devices could provide cost-effective, low-power and ultra-high-speed solutions for next-generation optical communication networks and microwave photonic systems. Furthermore, our approach could lead to large-scale ultra-low-loss photonic circuits that are reconfigurable on a picosecond timescale, enabling a wide range of quantum and classical applications5,10,11 including feed-forward photonic quantum computation. Chip-scale lithium niobate electro-optic modulators that rapidly convert electrical to optical signals and use CMOS-compatible voltages could prove useful in optical communication networks, microwave photonic systems and photonic computation.

Single-chip microprocessor that communicates directly using light

Abstract: An electronic–photonic microprocessor chip manufactured using a conventional microelectronics foundry process is demonstrated; the chip contains 70 million transistors and 850 photonic components and directly uses light to communicate to other chips. The rapid transfer of data between chips in computer systems and data centres has become one of the bottlenecks in modern information processing. One way of increasing speeds is to use optical connections rather than electrical wires and the past decade has seen significant efforts to develop silicon-based nanophotonic approaches to integrate such links within silicon chips, but incompatibility between the manufacturing processes used in electronics and photonics has proved a hindrance. Now Chen Sun et al. describe a 'system on a chip' microprocessor that successfully integrates electronics and photonics yet is produced using standard microelectronic chip fabrication techniques. The resulting microprocessor combines 70 million transistors and 850 photonic components and can communicate optically with the outside world. This result promises a way forward for new fast, low-power computing systems architectures. Data transport across short electrical wires is limited by both bandwidth and power density, which creates a performance bottleneck for semiconductor microchips in modern computer systems—from mobile phones to large-scale data centres. These limitations can be overcome1,2,3 by using optical communications based on chip-scale electronic–photonic systems4,5,6,7 enabled by silicon-based nanophotonic devices8. However, combining electronics and photonics on the same chip has proved challenging, owing to microchip manufacturing conflicts between electronics and photonics. Consequently, current electronic–photonic chips9,10,11 are limited to niche manufacturing processes and include only a few optical devices alongside simple circuits. Here we report an electronic–photonic system on a single chip integrating over 70 million transistors and 850 photonic components that work together to provide logic, memory, and interconnect functions. This system is a realization of a microprocessor that uses on-chip photonic devices to directly communicate with other chips using light. To integrate electronics and photonics at the scale of a microprocessor chip, we adopt a ‘zero-change’ approach to the integration of photonics. Instead of developing a custom process to enable the fabrication of photonics12, which would complicate or eliminate the possibility of integration with state-of-the-art transistors at large scale and at high yield, we design optical devices using a standard microelectronics foundry process that is used for modern microprocessors13,14,15,16. This demonstration could represent the beginning of an era of chip-scale electronic–photonic systems with the potential to transform computing system architectures, enabling more powerful computers, from network infrastructure to data centres and supercomputers.

Recent progress in lasers on silicon

Abstract: Silicon lasers have long been a goal for semiconductor scientists, and a number of important breakthroughs in the past decade have focused attention on silicon as a photonic platform. Here we review the most recent progress in this field, including low-threshold silicon Raman lasers with racetrack ring resonator cavities, the first germanium-on-silicon lasers operating at room temperature, and hybrid silicon microring and microdisk lasers. The fundamentals of carrier transition physics in crystalline silicon are discussed briefly. The basics of several important approaches for creating lasers on silicon are explained, and the challenges and opportunities associated with these approaches are discussed. Silicon lasers have long been a goal for semiconductor scientists. This Progress Article reviews the most recent developments in this field, including silicon Raman lasers, the first germanium-on-silicon lasers operating at room temperature, and hybrid silicon microring and microdisk lasers. Challenges and opportunities for the present approaches are also discussed.