Raju Mudavath

Bio: Raju Mudavath is an academic researcher from Osmania University. The author has contributed to research in topics: Signal integrity & Printed circuit board. The author has an hindex of 2, co-authored 3 publications receiving 5 citations.

Analysis of Crosstalk Noise for Coupled Microstrip Interconnect Models in High-Speed PCB Design

Abstract: In high-speed regime, as the PCBs (Printed Circuit Boards) are diminished, and the continuous increasing of the clock frequency in the state-of-the-art digital systems, at higher frequencies there is no more interconnects are transparent. The behavior of the electrical properties of traces (Transmission lines) plays a major role in determining the performance of the PCB board. As an enormous increase of frequencies and usage of data rates and decreasing of size, it's necessary to check the signal integrity issues on a PCBs to reduce failure products. In this paper, we design and analyzed the coupled transmission lines for a single-ended micro-strip model with $50\Omega$ characteristic impedance and extracted RLC parameters. Estimated the Near End Crosstalk(NEXT) and Far End Crosstalk (FEXT) noise in ADS and validated with SPICE Tool on victim line and also, compared with an empirical equations values.

Analysis and minimization of crosstalk noise in copper interconnects for high-speed VLSI circuits

Abstract: Due to the rapid advances of technologies, the scaling of parameters are decreasing. In VLSI (Very Large Scale Integration) technology, the feature size of integrated circuits (IC) has driving reduced in terms of power, speed, area and cost characteristics. The decreasing the sizes in sub-quarter microns, spacing between the components on-chip VLSI design and the signal switching time in terms of pico seconds or even less. As a result, the signal integrity (SI) issues are occurring at higher frequencies and high data rates. The evaluation of crosstalk noise between the coupled interconnect is one of the prominent issue in designing of high-speed ICs. In this paper, investigated the crosstalk noise of coupled copper (Cu) interconnect models with analytically at 32 nm technology nodes. Also, investigated the crosstalk reduction with shield insertion technique and increasing physical spacing between the coupled lines. For the low power VLSI applications, the shield insertion technique is preferable for reducing the crosstalk effects in coupled interconnects.

The mitigation of signal integrity issues in coupled MWCNT bundles and a comparison with Cu interconnects

Abstract: In the nanoscale regime, carbon nanotubes (CNTs) are being considered as a future alternative interconnect material for traditional copper (Cu) wires in integrated circuit technology. The advances in device scaling and the continuous increase of clock frequencies in very large-scale integration technology have resulted in signal integrity (SI) issues. The reduction of such SI issues in coupled multiwalled CNT bundle interconnects is evaluated herein. The worst-case crosstalk delay and peak noise voltage are simulated for three-line coupled interconnects at the 22-nm technology node. To minimize the crosstalk effects, a passive shielding technique is proposed, resulting in reductions of 15.3% and 40.8% in the dynamic in-phase and out-phase crosstalk condition, respectively. The SI of single- and two-line coupled MWCNT bundle interconnects is also investigated based on eye diagrams in a channel simulator and compared with that of Cu interconnects. The eye-opening height is significantly enhanced in the MWCNT bundle and Cu interconnects when using the proposed technique. Moreover, the MWCNT bundle has a higher eye-opening compared with its Cu counterpart.

Estudo de crosstalk em placas de circuito impresso via kit didático

Abstract: Uma nova proposta de kit didatico para estudo de crosstalk em placas de circuito impresso (PCI) e apresentada no presente artigo O referido kit tem diversos atributos que o tornam atraente para a utilizacao em cursos academicos e em treinamentos dos mais variados niveis educacionais: do ensino tecnico a pos-graduacao Dentre os atributos citamos o baixo custo do kit , o baixo custo da estrutura laboratorial para a utilizacao deste, o pequeno peso e volume, colocando-o como opcao para cursos de educacao a distância Alem desses atributos fisicos ha os atributos didaticos que sao a possibilidade de estudo do crosstalk em PCI em dez diferentes arranjos de trilhas proporcionando o estudo da influencia da distância entre as trilhas, largura das mesmas e do comprimento no problema de crosstalk de forma individualizada Alem disso, permite a analise de cada uma das situacoes com duas frequencias de excitacao diferentes dos arranjos mantendo o tempo de transicao entre niveis logicos igual Isso e uma caracteristica positiva do ponto de vista didatico pois desmistifica a importância da frequencia fundamental no projeto visando a Compatibilidade Eletromagnetica A flexibilidade e possibilidades nao terminam por ai, ainda ha a possibilidade de excitar os arranjos com sinais externos ao kit e o de testar medidas corretivas pos projeto como, por exemplo, a adicao capacitor para a reducao da interferencia Esta proposta tem por objetivo apresentar uma solucao para o contexto de raras atividades praticas em cursos da tematica de Compatibilidade Eletromagnetica oportunizando atividades motivadoras e que proporcionam um aprendizado mais significativo Os resultados apresentados demonstram que, tanto o estudante quanto o professor tem a oportunidade de criar um ambiente de aprendizado que vai alem da simples relacao teoria-pratica desenvolvendo intuicao nas melhores praticas de projeto de produtos eletronicos

Delay and Crosstalk Aware Analysis for High Speed On-Chip Global RLC VLSI Interconnects

Abstract: At the advanced stage of technologies, when feature size is being reduced, it is compulsory to introduce other parameters for more accurate modelling of transmission line interconnects. So mutual inductance and coupling capacitance how have become more important role for analysis of high-speed on-line VLSI interconnects. This paper introduces a mathematical aware analysis result for crosstalk noise of ‘L’ type RLC interconnections using mutual inductance. Two RLC interconnect lines of ‘L’ type, are equidistant to each other and used as ‘Aggressor line’ and ‘Victim line’ respectively, whereas, a step signal voltage is employed as input to aggressor line. Other calculative results for Delay and peak noise voltage between these two RLC electrical lines with using mutual inductance, are also introduced in this paper. This paper also shows a comparative result between our derived expression values and BKM values for simulation purpose.