Showing papers by "Rao Tummala published in 1979"
Patent•
IBM1
TL;DR: In this paper, a method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multilayered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multilayered glassceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass, prior to further additions of conductor patterns and crystallisable glass layers to form a monolithic compatible substrate all through.
Abstract: A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.
88 citations
Patent•
IBM1
TL;DR: A seal glass for unitizing an array of glass nozzles of an ink jet printer is described in this article, which is corrosion resistant to alkaline and acidic inks and has low softening points, medium high expansivities and anneal points.
Abstract: A seal glass for unitizing an array of glass nozzles of an ink jet printer. The seal glasses are corrosion resistant to alkaline and acidic inks, and have low softening points, medium high expansivities and anneal points and are compatible with the nozzle glasses.
18 citations
Patent•
16 Aug 1979
2 citations
Patent•
31 Aug 1979
TL;DR: Substrats de verreceramique frittes comportant des configurations of conducteurs electriques multicouches, constituees par des metaux bons conducteur tels que l'or, l'argent ou le cuivre, are used to support de blocs de circuits integres as discussed by the authors.
Abstract: Substrats de verre-ceramique frittes comportant des configurations de conducteurs electriques multicouches, constituees par des metaux bons conducteurs tels que l'or, l'argent ou le cuivre La cuisson de ces metaux est faite a des temperatures situees au-dessous de leurs points de fusion Les substrats sont realises en superposant des feuilles crues composees d'un liant en resine thermoplastique dans lequel sont dispersees des particules de 2 a 7 microns de verres beta -spodumene ou alpha -cordierite, puis en laminant et en chauffant ces feuilles crues, les configurations de conducteurs etant placees sur les surfaces de feuilles crues avant l'etape de laminage Ces substrats sont utilises comme support de blocs de circuits integres