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Showing papers by "Rao Tummala published in 1980"


Patent
Bernt Narken1, Rao Tummala1
16 Jan 1980
TL;DR: In this paper, a multilayer glass-ceramic substrate composed for the attachment of semiconductor devices and a method for manufacturing a provided with connecting lines pack for a number of silicon wafers for a previously prepared merhrschichtigen glaskeramischen substrate, by the repeated deposition of a conductive pattern on the substrate and forming an overlying a kristallisierbarenGlasbestehenden dielectric layer, which is then crystallized into a glassceramic before further line pattern and crystallizable glass layers as the dielect
Abstract: Die Erfindung betrifft ein mehrschichtiges aus Glaskeramik bestehendes Substrat (32) fur die Befestigung von Halbleitervorrichtungen und ein Verfahren zum Herstellen einer mit Verbindungleitungen versehenen Packung (30) fur eine Anzahl von Halbleiterplattchen (24) und Herstellung einer mehrschichtigen glaskeramischen Struktur mit einer mehrschichtigen Verteilung von Verbindungsleitungen auf einem vorher hergestellten merhrschichtigen Glas-Keramik-Substrat, durch das wiederholte Niederschlagen eines Leitungsmusters auf dem Substrat und Herstellen einer daruber liegenden, aus einem kristallisierbarenGlasbestehenden dielektrischen Schicht, die dann zu einer Glaskeramik kristallisiert wird, bevor weitere Leitungsmuster und kristallisierbare Glasschichten als dielektrische Schichten zur Bildung einer monolithischen Struktur aufgebracht werden. The invention relates to a multilayered glass-ceramic substrate composed (32) for the attachment of semiconductor devices and a method for manufacturing a provided with connecting lines pack (30) for a number of semiconductor wafers (24) and producing a multilayer glass-ceramic structure having a multi-layer distribution of connection lines on a previously prepared merhrschichtigen glass-ceramic substrate, by the repeated deposition of a conductive pattern on the substrate and forming an overlying a kristallisierbarenGlasbestehenden dielectric layer, which is then crystallized into a glass-ceramic before further line pattern and crystallizable glass layers as the dielectric layers to forming a monolithic structure are applied. Diese Struktur soll dabei mit den Betriebseigenschaften von Halbleiterplattchen vertraglich sein, die auf dem auf der Oberflache der sich ergebenden glaskeramischen Packung frei zuganglich liegenden Leitungsmuster elektrisch angeschlossen werden konnen. This structure is intended to be compatible with the operating characteristics of semiconductor wafers, which can be electrically connected to the freely accessible lying on the surface of the resultant glass-ceramic packing line pattern.

16 citations



Patent
16 Jan 1980
TL;DR: In this paper, the authors describe the production of sintered glass-ceramic substrates containing in several planes interconnected thick-film conductive patterns on the copper base, which are obtained here by firing in a carefully controlled atmosphere of hydrogen and H 2 O and at temperatures below the melting point of copper.
Abstract: Die Erfindung betrifft die Herstellung gesinterter glaskeramischer Substrate, die in mehreren Ebenen miteinander verbundene Dickschicht-Leitungsmuster auf Kupferbasis enthalten. The invention relates to the production of sintered glass-ceramic substrates containing in several planes interconnected thick-film conductive patterns on the copper base. Diese Substrate werden dabei durch Brennen in einer genau uberwachten Atmosphare von Wasserstoff und H 2 O und bei Temperaturen unterhalb des Schmelzpunktes von Kupfer erhalten. These substrates are obtained here by firing in a carefully controlled atmosphere of hydrogen and H 2 O and at temperatures below the melting point of copper.

10 citations


Patent
09 Jan 1980
TL;DR: In this article, the formation of sintered glass-ceramic sub-strates containing multi-level, interconnected thick-film circuit patterns of copper-based conductors obtained by firing in a controlled ambient of hydrogen and H2O at temperatures below the melting point of copper.
Abstract: MULTILAYERED GLASS-CERAMIC STRUCTURES HAVING AN INTERNAL DISTRIBUTION OF COPPER-BASED CONDUCTORS Abstract of the Disclosure The formation of sintered glass-ceramic sub-strates containing multi-level, interconnected thick-film circuit patterns of copper-based conductors obtained by firing in a controlled ambient of hydrogen and H2O at temperatures below the melting point of copper.

5 citations



Patent
Jimmie L. Powell1, Rao Tummala1
18 Jun 1980
TL;DR: Alkaline ink-resistant multi-nozzle array for ink jet printers, where a number of glass nozzles are embedded in a glass substance, characterized in that the glass mass used for embedding the nozzleles comprises the following oxides, bu weight % : PbO 45 - 53,5%, Ge O2 0% SiO2 15 - 24,5% Zr O2 4,5%. B2 O3 5 - 12% Mg O 0,5 - 1,5, ZnO 3,5- 4, 5% Ba
Abstract: 1. Alkaline ink-resistant multi-nozzle array for ink jet printers, where a number of glass nozzles are embedded in a glass substance, characterized in that the glass mass used for embedding the nozzles comprises the following oxides, bu weight % : PbO 45 - 53,5% Ge O2 0% SiO2 15 - 24,5% Zr O2 4,5% B2 O3 5 - 12% Mg O 0,5 - 1,5% ZnO 3,5 - 4,5% Ba O 0 - 1,5% Al2 O3 3 - 4% Ti O2 0 - 2% Na2 O 1 - 6,5% Ca O 0,5 - 1,5% CdO 2 - 3% La2 O3 0 - 0,5% Cu2 O 0 - 2%