Showing papers by "Rao Tummala published in 1992"
IBM1
TL;DR: Several aspects of multichip module technology, including its functions, leverages, applications, and markets, are reviewed in this article, where the packaging technologies used in multi-chip, such as sealing and encapsulation, heat removal, chip level connections, thin film, ceramic, and printed wiring, are discussed.
Abstract: Several aspects of the multichip module technology, including its functions, leverages, applications, and markets, are reviewed All the packaging technologies used in multichip, such as sealing and encapsulation, heat removal, chip level connections, thin film, ceramic, and printed wiring, are discussed The module corrections and electrical testing used in forming a high-performance or portable system are also discussed >
66 citations
IBM1
TL;DR: IBM currently produces six varieties of multichip modules, including air-cooled TCMs, water-cooling TCMs and metallized multichips as discussed by the authors.
Abstract: IBM currently manufactures six varieties of multichip module. They include air-cooled TCMs (thermal conduction modules) based on 63 layers of alumina-molybdenum with surface thin-film wiring, and water-cooled TCMs based on glass-ceramic/copper with thin-film redistribution. The four other multichips are all air-cooled and are based on ultradense thin film on silicon, high-density laminated printed wiring multichip with direct chip attach by flip-chip, and pinned, thin-film metallized multichip. The number of chips in these products ranges from 2 to 121, and the applications range from personal computers to mainframes. >
14 citations
IBM1
10 citations