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Showing papers by "Rao Tummala published in 1993"

Journal Article•DOI•
Materials in microelectronics

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Rao Tummala1, Michael R. Haley1, George Czornyj1•
IBM1
01 Jan 1993-Ceramics International
TL;DR: The role of packages, beyond being simply passive containers in the past, is viewed as setting limits to the ultimate performance of computers as discussed by the authors, and the packages of the 1990s need to interconnect, power, cool, and protect devices in such a way that results in leading-edge performance and reliability.

9 citations

Patent•
Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering

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Jon A. Casey1, Sylvia M. DeCarr1, Srinivasa S. N. Reddy1, Subhash L. Shinde1, Bibetsuku Meiden Sura1, Rao Tummala1 •
IBM1
01 Feb 1993
TL;DR: In this article, a sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of: ______________________________________ Fe--Cr Cu--TiFe--Cr--Ni Ag--TiCr--Al Nb--AlNi--CrCu--Al Ni--Al Cu--Al--CrFe--Al
Abstract: A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of: ______________________________________ Fe--Cr Cu--TiFe--Cr--Ni Ag--TiCr--Al Nb--AlNi--Cr Cu--AlNi--Al Cu--Al--CrFe--Al______________________________________ The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000° C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.

8 citations

Proceedings Article•DOI•
Overview of IBM glass ceramic packaging technology

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Rao Tummala1, B.T. Clark, H. Bhatia, S. Kadakia•
IBM1
01 Jun 1993
TL;DR: In this article, the ES9000 glass-ceramic/copper substrate has been used for high-end machines including supercomputer applications and two technology alternatives are discussed in this paper, both aimed at achieving high density, yet they differ quite a bit in their applications.
Abstract: A major technological break-through was achieved with the design and development of the ES9000 glass-ceramic/copper substrate. Since then many innovations have been made to enhance the packaging technology to meet the demand of high end machines including supercomputer applications. Two technology alternatives are discussed in this paper. Both are aimed at achieving high density, yet they differ quite a bit in their applications. Various aspects of the packaging technology are described here. >