R
Rao Tummala
Researcher at Georgia Institute of Technology
Publications - 628
Citations - 12781
Rao Tummala is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Capacitor. The author has an hindex of 43, co-authored 623 publications receiving 11663 citations. Previous affiliations of Rao Tummala include Qualcomm & IBM.
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Book
Fundamentals of Microsystems Packaging
TL;DR: This chapter discussesfundamentals of Microsystems Design for the Environment, as well as the role of Packaging in Microelectronics, and how to design for Reliability.
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Ceramic and Glass‐Ceramic Packaging in the 1990s
TL;DR: In this paper, a broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety of computer system needs is presented, both for high-performance and low-performance applications.
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ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across au electrodes.
TL;DR: Rectifying diodes of single nanobelt/nanowire-based devices have been fabricated by aligning single ZnO nanobelts/ nanowires across paired Au electrodes using dielectrophoresis to form the Schottky diode.
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SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade
TL;DR: The SOP package overcomes both the computing limitations and integration limitations of SOC, SIP, MCM, and traditional system packaging by having global wiring as well as RF, digital, and optical component integration in the package, not in the chip.