Rao Tummala

TL;DR: In this paper, a new approach was proposed to create a glass interposer structure with through-vias that is ready for solution-based metallization such as electroless deposition.

TL;DR: In this paper, the authors reported synthesis of low loss hydrothermal BaTiO/sub 3/ thin films via a low temperature process -hydrothermal synthesis at 95/spl deg/C on laminated titanium foils.

TL;DR: In this article, the authors demonstrate reliability of via diameter below 5 µm using panel-scalable dry film photosensitive dielectric, which enables high density redistribution layer (RDL) technology for panel-based fan-out and interposer substrates.

TL;DR: In this paper, the failure modes indicate that a combination of high dielectric stresses and warpage results in crack propagation in conventional epoxies and copper wiring, while the high stiffness (>350 GPa) ceramic boards did not fail even after 1000 cycles.

TL;DR: In this paper, the authors proposed a novel interconnection technology -Cu pillar with nanocopper caps -where a solid-state sub-20 GPa modulus nanoporous Cu cap is introduced to replace the solder cap and retain solder-like compliance in assembly, while achieving bulk-like properties through densification in low-temperature sintering.