Rao Tummala

TL;DR: In this article, the tensile strength of these materials has been found to be 5-6 times of the conventional microcrystalline forms and the fracture toughness, J/sub IC/ values for nc- copper and nickel have been found for these strength levels indicating considerable capacity for plastic deformation in these materials prior to fracture.

TL;DR: It is shown that machine-learning techniques can be efficiently used to characterize nanomagnetic-based antennas by accurately mapping the particle radius and volume fraction of the nanom magnetic material to antenna parameters such as gain, bandwidth, radiation efficiency, and resonant frequency.

TL;DR: In this article, a two-metal layer redistribution layer (RDL) structure integrating 2µm line and space wiring and less than 10 µm ultra-small microvias was demonstrated on ultra-thin glass and organic substrates.

TL;DR: In this article, the thermomechanical reliability of copper-plated through-package vias (TPVs) in ultrathin bare glass interposers was investigated through modeling, design, fabrication, reliability characterization, and failure analysis.

TL;DR: In this article, the authors developed ultra thin ceramics with high dielectric constant using organic compatible processes to meet the impedance requirements for emerging high-speed circuits and high power density microprocessors.