R
Rao Tummala
Researcher at Georgia Institute of Technology
Publications - 628
Citations - 12781
Rao Tummala is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Capacitor. The author has an hindex of 43, co-authored 623 publications receiving 11663 citations. Previous affiliations of Rao Tummala include Qualcomm & IBM.
Papers
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Proceedings ArticleDOI
RF-microwave multi-band design solutions for multilayer organic system on package integrated passives
M.F. Davis,S.-W. Yoon,Soumyajit Mandal,N. Bushyager,M. Maeng,Kyutae Lim,Stephane Pinel,A. Sutono,J. Laskar,Manos M. Tentzeris,T. Nonaka,Venky Sundaram,Fuhan Liu,Rao Tummala +13 more
TL;DR: In this article, the authors present multi-band design solutions for integrated passives using multilayer organic (MLO) process technology for RF and microwave System on Package (SOP) module development.
Proceedings ArticleDOI
Substrate-integrated waveguides in glass interposers with through-package-vias
TL;DR: In this paper, a substrate-integrated waveguide (SIW) with through-package-vias (TPVs) operating at 20 GHz was designed in bare glass substrates to support the dominant TE10 mode and to avoid exciting TE 20 mode.
Journal ArticleDOI
Metal–Polymer Composite Interconnections for Ultra Fine-Pitch Wafer Level Packaging
TL;DR: In this paper, a low-temperature fabrication process that combines polymer structures with electroless copper plating to create low stress composite structures for extremely fine-pitch wafer level packages is presented.
Proceedings ArticleDOI
Design and Demonstration of 2.5D Glass Interposers as a Superior Alternative to Silicon Interposers for 28 Gbps Signal Transmission
Brett Sawyer,Bruce C. Chou,Jialing Tong,William Vis,Kadappan Panayappan,Shuhui Deng,Hugues Tournier,Venky Sundaram,Rao Tummala +8 more
TL;DR: In this article, the authors present the design and demonstration of redistribution layers directly on the surface of glass for high-speed 28 Gbps signaling applications, and demonstrate that the smooth surface roughness (Ra) of glass interposers provides similar interconnect densities as silicon but at higher performance and lower cost.
Proceedings ArticleDOI
Novel 3D-/Inkjet-Printed Flexible On-package Antennas, Packaging Structures, and Modules for Broadband 5G Applications
TL;DR: In this article, a 3D printed flexible material, FLGR02, is applied to the flexible mm-wave packaging application and fabrication process and material characterizations including solutions to surface treatment for ink adhesion, smooth of surface roughness, and CTE mismatch between the flexible material and the silver ink are proposed.