R
Rao Tummala
Researcher at Georgia Institute of Technology
Publications - 628
Citations - 12781
Rao Tummala is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Interposer & Capacitor. The author has an hindex of 43, co-authored 623 publications receiving 11663 citations. Previous affiliations of Rao Tummala include Qualcomm & IBM.
Papers
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Proceedings ArticleDOI
A novel 20-100/spl mu/m pitch IC-to-package interconnect and assembly process for Pb-free solder, copper or gold stud bumps
TL;DR: An IC-to-package interconnect and assembly process for ultra-fine pitch flip chip with Pb-free solders, copper, nickel or gold stud bumps and other low-standoff interconnects is presented in this article.
Journal ArticleDOI
Determination of Energy Release Rate Through Sequential Crack Extension
Scott McCann,Gregory Ostrowicki,Anh Tran,Timothy Huang,Tobias Bernhard,Rao Tummala,Suresh K. Sitaraman +6 more
Proceedings ArticleDOI
Scaling Cu Pillars to 20um Pitch and Below: Critical Role of Surface Finish and Barrier Layers
Ting-Chia Huang,Vanessa Smet,Pulugurtha Markondeya Raj,Rick Nichols,Gustavo Ramos,Maja Tomic,Robin Taylor,Rao Tummala +7 more
TL;DR: In this paper, a two-fold approach is pursued to extend scalability of conventional Cu pillars by replacing standard ENEPIG with ultra-thin electroless Pd autocatalytic Au surface finish, and, for further pitch scaling and enhanced electrical and thermal performances, enable void-free, manufacturable all-intermetallic joints solely composed of the metastable Cu6Sn5 phase by introduction of diffusion barrier layers.
Proceedings ArticleDOI
Biofunctionalization of Multi-walled Carbon Nanotubes (MWNTs) for the Fabrication of Protein Nano Biosensors
TL;DR: In this article, the authors demonstrate a route for the fabrication of a novel and sensitive protein biosensor using multi-walled carbon nanotubes (MWNTs), which were surface modified with carboxylic group (COOH) by refluxing in concentrated nitric acid, and then non-covalently attached to surface of clean glassy carbon electrode (GCE) surface using N,N, dimethlyformaide (DMF) solvent.
Proceedings ArticleDOI
Design of Low-Profile Integrated Transformer and Inductor for Substrate-Embedding in 1-5kW Isolated GaN DC-DC Converters
TL;DR: In this article, a low-profile integrated magnetic component design that enables low-loss and high-power density is proposed for 400V/48V DC-DC resonant converters with 1kW output power.