R
Renato Rimolo-Donadio
Researcher at Costa Rica Institute of Technology
Publications - 95
Citations - 1215
Renato Rimolo-Donadio is an academic researcher from Costa Rica Institute of Technology. The author has contributed to research in topics: Printed circuit board & CMOS. The author has an hindex of 16, co-authored 89 publications receiving 1081 citations. Previous affiliations of Renato Rimolo-Donadio include University of Hamburg & Hamburg University of Technology.
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Journal ArticleDOI
Monolithic Silicon Integration of Scaled Photonic Switch Fabrics, CMOS Logic, and Device Driver Circuits
Benjamin G. Lee,Alexander V. Rylyakov,William M. J. Green,Solomon Assefa,Christian W. Baks,Renato Rimolo-Donadio,Daniel M. Kuchta,Marwan H. Khater,Tymon Barwicz,Carol Reinholm,Edward W. Kiewra,Steven M. Shank,Clint L. Schow,Yurii A. Vlasov +13 more
TL;DR: This work shows that the various switch-and-driver systems are capable of delivering nanosecond-scale reconfiguration times, low crosstalk, compact footprints, low power dissipations, and broad spectral bandwidths, and validate the dynamic reconfigurability of the switch fabric changing the state of the fabric using time slots with sub-100-ns durations.
Journal ArticleDOI
Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz
Renato Rimolo-Donadio,Xiaoxiong Gu,Young H. Kwark,Mark B. Ritter,Bruce Archambeault,F. de Paulis,Yaojiang Zhang,Jun Fan,Heinz-Dietrich Bruns,Christian Schuster +9 more
TL;DR: In this paper, an analytical model for vias and traces is presented for simulation of multilayer interconnects at the package and printed circuit board levels, which can be applied to efficiently simulate a wide range of structures.
Journal ArticleDOI
Is 25 Gb/s On-Board Signaling Viable?
Dong Gun Kam,Mark B. Ritter,Troy J. Beukema,John F. Bulzacchelli,Petar Pepeljugoski,Young H. Kwark,L. Shan,Xiaoxiong Gu,Christian W. Baks,Richard A. John,Gareth G. Hougham,Christian Schuster,Renato Rimolo-Donadio,Boping Wu +13 more
TL;DR: In this paper, the authors present a study of distance and speed limits for electrical on-board module-to-module links with an eye to answering the questions of what package improvements are required for dense, high-aggregate bandwidth buses running at data rates beyond 10 Gb/s per channel and when might optical interconnects on the board be required?
Journal ArticleDOI
Circular Ports in Parallel-Plate Waveguide Analysis With Isotropic Excitations
TL;DR: In this article, an exact and consistent modeling of circularly shaped ports in the power/ground plane analysis under the assumption of isotropic excitations is addressed, where the analytical solutions for infinite planes are combined with the contour integral method to model finite-sized power planes.
Journal ArticleDOI
Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays
Sebastian Muller,Xiaomin Duan,Miroslav Kotzev,Yaojiang Zhang,Jun Fan,Xiaoxiong Gu,Young H. Kwark,Renato Rimolo-Donadio,H-D Brüns,Christian Schuster +9 more
TL;DR: In this article, the accuracy of the physics-based via model, specifically when applied to dense via arrays, was studied with regard to four types of modes based on an eigenmode expansion for the radial waveguide.