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Reza Abdolvand

Researcher at University of Central Florida

Publications -  141
Citations -  3548

Reza Abdolvand is an academic researcher from University of Central Florida. The author has contributed to research in topics: Resonator & Q factor. The author has an hindex of 31, co-authored 128 publications receiving 3271 citations. Previous affiliations of Reza Abdolvand include Georgia Tech Research Institute & Georgia Institute of Technology.

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Thin-film piezoelectric-on-silicon resonators for high-frequency reference oscillator applications

TL;DR: This paper studies the application of lateral bulk acoustic thin-film piezoelectric-on-substrate (TPoS) resonators in high-frequency reference oscillators, designed and fabricated in 2 classes--high-order and coupled-array and the performance characteristics of the oscillators are measured and discussed.
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Piezoelectric-on-Silicon Lateral Bulk Acoustic Wave Micromechanical Resonators

TL;DR: In this article, the design, fabrication, and characterization of piezoelectrically-transduced micromechanical single-crystal-silicon resonators operating in their lateral bulk acoustic modes to address the need for high-Q microelectronic-integrable frequency-selective components is presented.
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High-Q single crystal silicon HARPSS capacitive beam resonators with self-aligned sub-100-nm transduction gaps

TL;DR: In this article, the HARPSS process was used to fabricate high quality factor (Q) single crystal silicon (SCS) in-plane capacitive beam resonators with sub-100 nm to submicron transduction gaps.
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Micromachined Resonators: A Review

TL;DR: A review of the remarkable progress that has been made during the past few decades in design, modeling, and fabrication of micromachined resonators with references to the most influential contributions in the field for those interested in a deeper understanding of the material.
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An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon

TL;DR: In this paper, a modification of the two-step time-multiplexed plasma etching recipe (also known as the Bosch process) was proposed to achieve high aspect-ratio sub-micron wide trenches in silicon.