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Ritu Gupta

Researcher at Indian Institute of Technology, Jodhpur

Publications -  60
Citations -  1714

Ritu Gupta is an academic researcher from Indian Institute of Technology, Jodhpur. The author has contributed to research in topics: Coating & Electrode. The author has an hindex of 20, co-authored 60 publications receiving 1409 citations. Previous affiliations of Ritu Gupta include Purdue University & Jawaharlal Nehru Centre for Advanced Scientific Research.

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Visibly Transparent Heaters.

TL;DR: This review provides topical coverage of next generation transparent conducting electrodes (TCE) based on a wide range of materials such as oxide nanoparticles, CNTs, graphene, metal nanowires, metal meshes and their hybrids.
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Scalability and stability of very thin, roll-to-roll processed, large area, indium-tin-oxide free polymer solar cell modules

TL;DR: In this paper, the performance of polyethylene terephthalate foil (P3HT:PCBM)-based polysilicon solar cell modules was evaluated on thin flexible barrier polycarbonate foil.
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Spray coating of crack templates for the fabrication of transparent conductors and heaters on flat and curved surfaces.

TL;DR: Spray coating in the context of crack template is a powerful method for producing transparent heaters, which is shown for the first time in this work.
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Fabrication of Large Area, High‐Performance, Transparent Conducting Electrodes Using a Spontaneously Formed Crackle Network as Template

TL;DR: In this article, a single micro/nanowire network of a metal deposited over a large area on a transparent substrate serves as a transparent conducting electrode with optoelectronic properties that are enhanced in many ways relative to the conventional indium tin oxide films.
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Large area solution processed transparent conducting electrode based on highly interconnected Cu wire network

TL;DR: In this article, the authors used a four-step process involving deposition of commercially available colloidal dispersions onto polyethylene terephthalate (PET), drying to induce crackle network formation, nucleating Au or Pd seed nanoparticles inside the crackle regions, washing away the sacrificial layer and finally, depositing Cu electrolessly or by electroplating.