Robert A. Reed

Bio: Robert A. Reed is an academic researcher from Vanderbilt University. The author has contributed to research in topics: Single event upset & Monte Carlo method. The author has an hindex of 48, co-authored 392 publications receiving 8571 citations. Previous affiliations of Robert A. Reed include United States Naval Research Laboratory & Goddard Space Flight Center.

Monte Carlo Simulation of Single Event Effects

Abstract: In this paper, we describe a Monte Carlo approach for estimating the frequency and character of single event effects based on a combination of physical modeling of discrete radiation events, device simulations to estimate charge transport and collection, and circuit simulations to determine the effect of the collected charge. A mathematical analysis of the procedure reveals it to be closely related to the rectangular parallelepiped (RPP) rate prediction method. The results of these simulations show that event-to-event variation may have a significant impact when predicting the single-event rate in advanced spacecraft electronics. Specific criteria for supplementing established RPP-based single event analysis with Monte Carlo computations are discussed.

Impact of Low-Energy Proton Induced Upsets on Test Methods and Rate Predictions

Abstract: Direct ionization from low energy protons is shown to cause upsets in a 65-nm bulk CMOS SRAM, consistent with results reported for other deep submicron technologies. The experimental data are used to calibrate a Monte Carlo rate prediction model, which is used to evaluate the importance of this upset mechanism in typical space environments. For the ISS orbit and a geosynchronous (worst day) orbit, direct ionization from protons is a major contributor to the total error rate, but for a geosynchronous (solar min) orbit, the proton flux is too low to cause a significant number of events. The implications of these results for hardness assurance are discussed.

The contribution of nuclear reactions to heavy ion single event upset cross-section measurements in a high-density SEU hardened SRAM

Abstract: Heavy ion irradiation was simulated using a Geant4 based Monte-Carlo transport code. Electronic and nuclear physics were used to generate statistical profiles of charge deposition in the sensitive volume of an SEU hardened SRAM. Simulation results show that materials external to the sensitive volume can affect the experimentally measured cross-section curve.

Impact of Heavy Ion Energy and Nuclear Interactions on Single-Event Upset and Latchup in Integrated Circuits

Abstract: The effects of heavy ion energy and nuclear interactions on the single-event upset (SEU) and single-event latchup (SEL) response of commercial and radiation-hardened CMOS ICs are explored. Above the threshold LET for direct ionization-induced upsets, little difference is observed in single-event upset and latchup cross sections measured using low versus high energy heavy ions. However, significant differences between low- and high-energy heavy ion test results are observed below the threshold LET for single-node direct ionization-induced upsets. The data suggest that secondary particles produced by nuclear interactions play a role in determining the SEU and SEL hardness of integrated circuits, especially at low LET. The role of nuclear interactions and implications for radiation hardness assurance and rate prediction are discussed.

Impact of Ion Energy and Species on Single Event Effects Analysis

Abstract: Experimental evidence and Monte-Carlo simulations for several technologies show that accurate SEE response predictions depend on a detailed description of the variability of radiation events (e.g., nuclear reactions), as opposed to the classical single-valued LET parameter. Rate predictions conducted with this simulation framework exhibit excellent agreement with the average observed SEU rate on NASA's MESSENGER mission to Mercury, while a prediction from the traditional IRPP method, which does not include the contribution from ion-ion reactions, falls well below the observed rate. While rate predictions depend on availability of technology information, the approach described here is sufficiently flexible that reasonably accurate results describing the response to irradiation can be obtained even in the absence of detailed information about the device geometry and fabrication process.

I and i

Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

Semiconductor device, and manufacturing method thereof

Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Basic mechanisms and modeling of single-event upset in digital microelectronics

Abstract: Physical mechanisms responsible for nondestructive single-event effects in digital microelectronics are reviewed, concentrating on silicon MOS devices and integrated circuits. A brief historical overview of single-event effects in space and terrestrial systems is given, and upset mechanisms in dynamic random access memories, static random access memories, and combinational logic are detailed. Techniques for mitigating single-event upset are described, as well as methods for predicting device and circuit single-event response using computer simulations. The impact of technology trends on single-event susceptibility and future areas of concern are explored.

Cities and Flooding: A Guide to Integrated Urban Flood Risk Management for the 21st Century

Abstract: The guide serves as a primer for decision and policy makers, technical specialists, central, regional and local government officials, and concerned stakeholders in the community sector, civil society and non-governmental organizations, and the private sector. The Guide embodies the state-of-the art on integrated urban flood risk management. The Guide starts with a summary for policy makers which outlines and describes the key areas which policy makers need to be knowledgeable about to create policy directions and an integrated strategic approach for urban flood risk management. The core of the Guide consists of seven chapters, organized as: understanding flood hazard; understanding flood impacts; integrated flood risk management (structural measures and non-structural measures); evaluating alternative flood risk management options: tools for decision makers; implementing integrated flood risk management; and conclusion. Each chapter starts with a full contents list and a summary of the chapter for quick reference.

Review of displacement damage effects in silicon devices

Abstract: This paper provides a historical review of the literature on the effects of radiation-induced displacement damage in semiconductor materials and devices. Emphasis is placed on effects in technologically important bulk silicon and silicon devices. The primary goals are to provide a guide to displacement damage literature, to offer critical comments regarding that literature in an attempt to identify key findings, to describe how the understanding of displacement damage mechanisms and effects has evolved, and to note current trends. Selected tutorial elements are included as an aid to presenting the review information more clearly and to provide a frame of reference for the terminology used. The primary approach employed is to present information qualitatively while leaving quantitative details to the cited references. A bibliography of key displacement-damage information sources is also provided.