There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality.

Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

I and i

抗原变异可使得多种致病微生物易于逃避宿主免疫应答。表达在感染红细胞表面的恶性疟原虫红细胞表面蛋白1（PfPMP1）与感染红细胞、内皮细胞、树突状细胞以及胎盘的单个或多个受体作用，在黏附及免疫逃避中起关键的作用。每个单倍体基因组var基因家族编码约60种成员，通过启动转录不同的var基因变异体为抗原变异提供了分子基础。

疟原虫var基因转换速率变化导致抗原变异[英]／Paul H, Robert P, Christodoulou Z, et al//Proc Natl Acad Sci U S A

INTRODUCTION: Brief History. Multifingered Hands and Dextrous Manipulation. Outline of the Book. Bibliography. RIGID BODY MOTION: Rigid Body Transformations. Rotational Motion in R3. Rigid Motion in R3. Velocity of a Rigid Body. Wrenches and Reciprocal Screws. MANIPULATOR KINEMATICS: Introduction. Forward Kinematics. Inverse Kinematics. The Manipulator Jacobian. Redundant and Parallel Manipulators. ROBOT DYNAMICS AND CONTROL: Introduction. Lagrange's Equations. Dynamics of Open-Chain Manipulators. Lyapunov Stability Theory. Position Control and Trajectory Tracking. Control of Constrained Manipulators. MULTIFINGERED HAND KINEMATICS: Introduction to Grasping. Grasp Statics. Force-Closure. Grasp Planning. Grasp Constraints. Rolling Contact Kinematics. HAND DYNAMICS AND CONTROL: Lagrange's Equations with Constraints. Robot Hand Dynamics. Redundant and Nonmanipulable Robot Systems. Kinematics and Statics of Tendon Actuation. Control of Robot Hands. NONHOLONOMIC BEHAVIOR IN ROBOTIC SYSTEMS: Introduction. Controllability and Frobenius' Theorem. Examples of Nonholonomic Systems. Structure of Nonholonomic Systems. NONHOLONOMIC MOTION PLANNING: Introduction. Steering Model Control Systems Using Sinusoids. General Methods for Steering. Dynamic Finger Repositioning. FUTURE PROSPECTS: Robots in Hazardous Environments. Medical Applications for Multifingered Hands. Robots on a Small Scale: Microrobotics. APPENDICES: Lie Groups and Robot Kinematics. A Mathematica Package for Screw Calculus. Bibliography. Index Each chapter also includes a Summary, Bibliography, and Exercises

http://www.cds.caltech.edu/%7Emurray/books/MLS/pdf/mls94-complete.pdf

A Mathematical Introduction to Robotic Manipulation

Self-assembly is the autonomous organization of components into patterns or structures without human intervention. Self-assembling processes are common throughout nature and technology. They involve components from the molecular (crystals) to the planetary (weather systems) scale and many different kinds of interactions. The concept of self-assembly is used increasingly in many disciplines, with a different flavor and emphasis in each.

http://science.sciencemag.org/content/sci/295/5564/2418.full.pdf

Self-assembly at all scales.

Microfluidic devices for manipulating fluids are widespread and finding uses in many scientific and industrial contexts. Their design often requires unusual geometries and the interplay of multiple physical effects such as pressure gradients, electrokinetics, and capillarity. These circumstances lead to interesting variants of well-studied fluid dynamical problems and some new fluid responses. We provide an overview of flows in microdevices with focus on electrokinetics, mixing and dispersion, and multiphase flows. We highlight topics important for the description of the fluid dynamics: driving forces, geometry, and the chemical characteristics of surfaces.

Engineering flows in small devices

We present a review on the state of knowledge of surface phenomena behind adhesion in surface micromechanical structures. After introducing the problem of release-related and in-use adhesion, a theoretical framework for understanding the various surface forces that cause strong adhesion of micromechanical structures is presented. Various approaches are described for reducing the work of adhesion. These include surface roughening and chemical modification of polycrystalline silicon surfaces. The constraints that fabrication processes such as release, drying, assembly, and packaging place on surface treatments are described in general. Finally, we briefly outline some of the important scientific and technological issues in adhesion and friction phenomena in micromechanical structures that remain to be clarified.

Critical Review: Adhesion in surface micromechanical structures

Laterally Driven Polysilicon Resonant Microstructures

Interdigitated finger (comb) structures are demonstrated to be effective for electrostatically exciting the resonance of polysilicon microstructures parallel to the plane of the substrate. Linear plates suspended by a folded-cantilever truss and torsional plates suspended by spiral and serpentine springs are fabricated from a 2- mu m-thick phosphorus-doped low-pressure chemical vapor deposited polysilicon film. Resonance is observed visually, with frequencies ranging from 18 kHz to 80 kHz and quality factors from 20 to 130. Simple beam theory is adequate for calculating the resonant frequencies, using a Young's modulus of 140 GPa and neglecting residual strain in the released structures. >

Laterally driven polysilicon resonant microstructures

Surface micromachining is characterized by the fabrication of micromechanical structures from deposited thin films. Originally employed for integrated circuits, films composed of materials such as low-pressure chemical-vapor-deposition polycrystalline silicon, silicon nitride, and silicon dioxides can be sequentially deposited and selectively removed to build or "machine" three-dimensional structures whose functionality typically requires that they be freed from the planar substrate. Although the process to accomplish this fabrication dates from the 1960's, its rapid extension over the past few years and its application to batch fabrication of micromechanisms and of monolithic microelectromechanical systems (MEMS) make a thorough review of surface micromachining appropriate at this time. Four central issues of consequence to the MEMS technologist are: (i) the understanding and control of the material properties of microstructural films, such as polycrystalline silicon, (ii) the release of the microstructure, for example, by wet etching silicon dioxide sacrificial films, followed by its drying and surface passivation, (iii) the constraints defined by the combination of micromachining and integrated-circuit technologies when fabricating monolithic sensor devices, and (iv) the methods, materials, and practices used when packaging the completed device. Last, recent developments of hinged structures for postrelease assembly, high-aspect-ratio fabrication of molded parts from deposited thin films, and the advent of deep anisotropic silicon etching hold promise to extend markedly the capabilities of surface-micromachining technologies.

/pdf/surface-micromachining-for-microelectromechanical-systems-13y44jiffs.pdf

Surface micromachining for microelectromechanical systems

The computing demands of future data-intensive applications will greatly exceed the capabilities of current electronics, and are unlikely to be met by isolated improvements in transistors, data storage technologies or integrated circuit architectures alone. Instead, transformative nanosystems, which use new nanotechnologies to simultaneously realize improved devices and new integrated circuit architectures, are required. Here we present a prototype of such a transformative nanosystem. It consists of more than one million resistive random-access memory cells and more than two million carbon-nanotube field-effect transistors-promising new nanotechnologies for use in energy-efficient digital logic circuits and for dense data storage-fabricated on vertically stacked layers in a single chip. Unlike conventional integrated circuit architectures, the layered fabrication realizes a three-dimensional integrated circuit architecture with fine-grained and dense vertical connectivity between layers of computing, data storage, and input and output (in this instance, sensing). As a result, our nanosystem can capture massive amounts of data every second, store it directly on-chip, perform in situ processing of the captured data, and produce 'highly processed' information. As a working prototype, our nanosystem senses and classifies ambient gases. Furthermore, because the layers are fabricated on top of silicon logic circuitry, our nanosystem is compatible with existing infrastructure for silicon-based technologies. Such complex nano-electronic systems will be essential for future high-performance and highly energy-efficient electronic systems.

Roger T. Howe

Papers

Critical Review: Adhesion in surface micromechanical structures

Laterally Driven Polysilicon Resonant Microstructures

Laterally driven polysilicon resonant microstructures

Surface micromachining for microelectromechanical systems

Three-dimensional integration of nanotechnologies for computing and data storage on a single chip