S. F. Danko

Bio: S. F. Danko is an academic researcher from United States Department of the Army. The author has an hindex of 1, co-authored 1 publications receiving 12 citations.

The Micro-Module: A Logical Approach to Microminiaturization

Abstract: Among the diverse activities of research and development of electronic parts at the U. S. Army Signal Research and Development Laboratory, particular emphasis has been placed on the evolution of a coherent and practical microminiaturization "system." An objective analysis of the several techniques suitable for a system base indicates that the advantages of each of the techniques could be combined logically into an approach called the "micromodule." The flexibility of this system to assimilate advancements in the state of the art, its compatibility to mechanized assembly, and its short- and long-range applicability as a universal construction system for all low and medium power circuits are reviewed. The weakness of "miniaturization for miniaturization's sake" is discussed frankly, and perspective is drawn for microminiature, circuits, for digital circuits and for general electronic usage. Latest experimental micro-modules are illustrated and their features are discussed. Several complex solid-state circuits are shown and quantitatively assessed to show the ultimate capabilities of this approach and its adaptability to the micro-module construction philosophy.

Government Support of the Semiconductor Industry: Diverse Approaches and Information Flows

Abstract: Intensive research and development during the Second World War had resulted in new technologies uch as radar, the proximity fuse, and the atomic bomb, all of which contributed to the Allied victory. The Cold War marked a new era in government funding for research and development, however, as new geopolitical pressures convinced military and civilian policymakers to maintain R&D expenditures ata level far exceeding that of the prewar years. 2 The majority of government research dollars after the war went to a small number of industries, most prominently aerospace and electronics [Mowery and Rosenberg, 1989, p.132], amply supporting both fundamental nd applied research. 3 Government funding of industrial R&D has received a great deal of attention from scholars in a number of disciplines. In particular, historians and economists interested in technological

Titanium Printed Capacitors for Microminiaturization

Abstract: It is shown in this paper that by an appropriate cleaning and forming procedure titanium metal can be anodically oxidized to a low leakage current, which makes it possible to use this material for capacitor fabrication. Experimental data are given for the metal/oxide/metal thin-film capacitor. A new "printing" technique especially suited for the fabrication of film capacitors in printed microminiaturized electronic circuits is described for the forming of the dielectric oxide layer.

Printed Circuits and Microelectronics

Abstract: In the two decades since the concept of ceramic based "printed circuits" was first suggested for an Army Ordnance application, substantial changes have taken place in the techniques of electronic circuit construction in the United States. Today, such ceramic circuits, in simple and complex networks, are complemented by printed wiring assemblies in several variations. Both technologies, now well established and in mass use on production lines, represent the current plateaus in miniature circuit construction for general commercial and military usage. Other construction philosophies and technologies are now shaping in the country's industrial and military laboratories, all aimed at new orders of size reduction of electronic equipments. In the several microelectronic techniques under development, the elemental electronic part appears destined to lose its logistic identity completely, and yield its classical position as a building block to black boxes called "circuit functions." The paper provides a summary review of the evolution of current ceramic printed circuits and printed wiring practices and, in the light of today's microelectronic activities, frames the trend in equipment design in the years ahead.