S
S.J. Souri
Researcher at Stanford University
Publications - 6
Citations - 1847
S.J. Souri is an academic researcher from Stanford University. The author has contributed to research in topics: Very-large-scale integration & Chip. The author has an hindex of 5, co-authored 6 publications receiving 1800 citations.
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Journal ArticleDOI
3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration
TL;DR: This paper analyzes the limitations of the existing interconnect technologies and design methodologies and presents a novel three-dimensional chip design strategy that exploits the vertical dimension to alleviate the interconnect related problems and to facilitate heterogeneous integration of technologies to realize a system-on-a-chip (SoC) design.
Journal ArticleDOI
Interconnect limits on gigascale integration (GSI) in the 21st century
Jeffrey A. Davis,R. Venkatesan,Alain E. Kaloyeros,M. Beylansky,S.J. Souri,Kaustav Banerjee,Krishna C. Saraswat,A. Rahman,R. Reif,James D. Meindl +9 more
TL;DR: This result emphasizes that changes in design, technology, and architecture are needed to cope with the onslaught of wiring demands and one potential solution is 3-D integration of transistors, which is expected to significantly improve interconnect performance.
Proceedings ArticleDOI
Multiple Si layer ICs: motivation, performance analysis, and design implications
TL;DR: It is shown that significant improvement in performance and reduction in wire-limited chip area can be achieved with 3-D ICs with vertical inter-layer interconnects (VILICs), and it is demonstrated that using a thermally responsible design and/or a high-performance heat sinking technology, die temperatures can be reduced well below present die temperatures.
Proceedings Article
3-D ICs: Motivation, performance analysis, and technology
TL;DR: It is shown that significant improvement in performance and reduction in wire-limited chip area can be achieved with 3-D ICs with vertical inter-layer interconnects, and implications of3-D architecture on several circuit designs are discussed.
Proceedings ArticleDOI
Performance analysis and technology of 3-D ICs
TL;DR: This paper presents a comprehensive analytical treatment of 3-D ICs with multiple Si layers and shows that significant improvement in performance and reduction in wire-limited chip area can be achieved if some long horizontal interconnects can be replaced by short vertical inter-layer interConnects.