S
S. Nakamura
Researcher at Mie University
Publications - 30
Citations - 106
S. Nakamura is an academic researcher from Mie University. The author has contributed to research in topics: Electrical resistivity and conductivity & Dielectric. The author has an hindex of 6, co-authored 30 publications receiving 102 citations.
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Journal ArticleDOI
Effects of molecular structure on electrical conduction in low-density polyethylene above its melting point
TL;DR: In this article, the electrical conduction of various kinds of low-density polyethylene (LDPE) has been studied above the melting point and two components of conduction currents were found: one obeyed Ohm's law in the low field range and the other was proportional to the square of the field at lower temperatures in the high field range, and was also inversely proportional to sample thickness for a constant field.
Journal ArticleDOI
Degradation of Dielectric Properties of Polyethylene by Combined Y-Irradiation and Thermal Stresses
TL;DR: In this article, the degradation of dielectric properties polyethylene under the combined environment of?-irradiation and thermal aging has been studied, and it is found that the primary dispersion of polymethylene shifts to higher temperatures with oxidation, due to chain scission, cross linking and dipole-dipole interaction.
Journal ArticleDOI
Electrical Insulating and Heat-Resistive Properties of PDMS-TEOS Hybrid with Different Molar Ratio of TEOS to PDMS
Makoto Sugiura,Fumitoshi Imasato,Atsushi Ohno,Yusuke Aoki,S. Nakamura,Tetsushi Okamoto,Takuya Shindou +6 more
TL;DR: In this article, the electrical insulating and heat resistive properties of polydimethylsiloxane (PDMS) and tetraethoxysilane (TEOS) hybrid materials were investigated by changing the molar ratio of TEOS to PDMS.
Proceedings ArticleDOI
Changes of capacitance and dielectric dissipation factor of water-treed XLPE with voltage
TL;DR: In this paper, the changes of capacitance C and dielectric dissipation factor of a non-penetrated water-treed XLPE sheet sample with voltage stress are discussed based upon the channel dynamism model.
Proceedings ArticleDOI
Properties of high-thermal conductive composite with two kinds of fillers
TL;DR: In this paper, the thermal conductivity of a composite made with a boron nitride was investigated and it was clarified that thermal conductivities increased by further introducing carbon black into the matrix resin.