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Samuel Graham

Bio: Samuel Graham is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Thermal conductivity & Thermal resistance. The author has an hindex of 48, co-authored 347 publications receiving 9774 citations. Previous affiliations of Samuel Graham include Merck & Co. & United States Military Academy.


Papers
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TL;DR: In this paper, the buckling-driven delamination of carbon nanotube (CNT) forests from their growth substrates when subjected to compression was reported, and the postbuckling tensile stresses that developed at the base of the CNT forests serve as the driving force for delamination.
Abstract: We report buckling-driven delamination of carbon nanotube (CNT) forests from their growth substrates when subjected to compression. Macroscale compression experiments reveal local delamination at the CNT forest-substrate interface. Results of microscale flat punch indentations indicate that enhanced CNT interlocking at the top surface of the forest accomplished by application of a metal coating causes delamination of the forest from the growth substrate, a phenomenon not observed in indentation of as-grown CNT forests. We postulate that the post-buckling tensile stresses that develop at the base of the CNT forests serve as the driving force for delamination.

28 citations

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TL;DR: In this article, the authors proposed a method for interfacial charge transfer at organic/organic planar-hetero junctions, which allows access to device structures that create new opportunities for flexible electronic devices.
Abstract: Interfacial charge transfer at organic/organic planar-hetero junctions allows access to device structures that create new opportunities for flexible electronic devices. Fundamental characteristics ...

28 citations

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TL;DR: In this paper, the 3D microstructural damage due to cracking of Fe-rich intermetallic particles is quantitatively characterized as a function of strain under compression and tension in an Al-Mg-Si base wrought alloy.
Abstract: Three-dimensional (3-D) microstructural damage due to cracking of Fe-rich intermetallic particles is quantitatively characterized as a function of strain under compression and tension in an Al-Mg-Si base wrought alloy. The 3-D number fraction of damaged (cracked) particles, their average volume, average surface area, and shape factor are estimated at different strain levels for deformation under uniaxial tension and compression. It is shown that, depending on the type of loading, loading direction, particle shape, and microstructural anisotropy, the two-dimensional (2-D) number fraction of the damaged particles can be smaller or larger than the corresponding true 3-D number fraction. Under uniaxial tension, the average volume and surface area of cracked particles decrease with the strain. However, the average volume and surface area of the cracked particles increase with the increase in the compressive strain, implying that more and more larger elongated particles crack at higher and higher stress levels, which is contrary to the predictions of the existing particle cracking theories. In this alloy, the damage development due to particle cracking is intimately coupled with the particle rotations. The differences in the damage evolution under tension and compression are explained on the basis of the differences in the particle rotation tendencies under these two loading conditions.

27 citations

Journal ArticleDOI
TL;DR: In this paper, a multiphysics model was developed to describe the evolution of the electrical and thermal behavior along with the mechanical stress fields in AlGaN/GAN heterostructure field effect transistors and metal-oxide semiconductor HetNets under operational conditions.
Abstract: A multiphysics model was developed to describe the evolution of the electrical and thermal behavior along with the mechanical stress fields in AlGaN/GAN heterostructure field-effect transistors and metal-oxide semiconductor heterostructure field-effect transistors under operational conditions. The electric field and power dissipation were obtained from Maxwell's equations. A one-way coupling procedure between the electrical and thermo-mechanical model was utilized to estimate the peak temperature and thermal stresses in these devices. By coupling the solutions, the direct impact of the electrical performance on the thermal stresses in these devices was analyzed.

27 citations

Journal ArticleDOI
TL;DR: In this paper, the authors report on the thermal conductance across interfaces between various epitaxially grown metal films (Co, Ru, and Al) and $c$-plane sapphire substrates via time-domain thermoreflectance over the temperature range of 80 to 500 K.
Abstract: As electronic devices shrink down to their ultimate limit, the fundamental understanding of interfacial thermal transport becomes essential in thermal management. However, a comprehensive understanding of phonon transport mechanisms that drive interfacial thermal transport is still under development. The thermal transport across interfaces can be strongly affected by factors such as crystalline structure, surface roughness, chemical diffusion, etc. These complications lead to a significant quantitative uncertainty between experimentally measured thermal boundary conductance (TBC) across real material interfaces and theoretically calculated TBCs that are often predicted on structurally and/or chemically ideal interfaces. In this paper, we report on the thermal conductance across interfaces between various epitaxially grown metal films (Co, Ru, and Al) and $c$-plane sapphire substrates via time-domain thermoreflectance over the temperature range of \ensuremath{\sim}80 to \ensuremath{\sim}500 K. The room-temperature interface conductances of Al/sapphire, Co/sapphire, and Ru/sapphire are all $\ensuremath{\sim}350\phantom{\rule{0.16em}{0ex}}\mathrm{MW}\phantom{\rule{0.16em}{0ex}}{\mathrm{m}}^{\ensuremath{-}1}\phantom{\rule{0.16em}{0ex}}{\mathrm{K}}^{\ensuremath{-}1}$ despite the phonon spectra differences among the metals. We compare our results to predictions of TBC using atomistic Green's function calculations and the modal nonequilibrium Landauer method with transmission from the diffuse mismatch model. We found a consistent quantitative agreement between the experimentally measured TBCs and the predictions using the modal nonequilibrium Landauer model for the $\mathrm{Al}/{\mathrm{Al}}_{2}{\mathrm{O}}_{3}$, $\mathrm{Co}/{\mathrm{Al}}_{2}{\mathrm{O}}_{3}$, and $\mathrm{Ru}/{\mathrm{Al}}_{2}{\mathrm{O}}_{3}$ interfaces. This result suggests that interfacial elastic phonon thermal transport dominates TBC for the various epitaxial metal/sapphire combinations of interest in this work, while other mechanisms are negligible.

26 citations


Cited by
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08 Dec 2001-BMJ
TL;DR: There is, I think, something ethereal about i —the square root of minus one, which seems an odd beast at that time—an intruder hovering on the edge of reality.
Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

33,785 citations

01 May 1993
TL;DR: Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems.
Abstract: Three parallel algorithms for classical molecular dynamics are presented. The first assigns each processor a fixed subset of atoms; the second assigns each a fixed subset of inter-atomic forces to compute; the third assigns each a fixed spatial region. The algorithms are suitable for molecular dynamics models which can be difficult to parallelize efficiently—those with short-range forces where the neighbors of each atom change rapidly. They can be implemented on any distributed-memory parallel machine which allows for message-passing of data between independently executing processors. The algorithms are tested on a standard Lennard-Jones benchmark problem for system sizes ranging from 500 to 100,000,000 atoms on several parallel supercomputers--the nCUBE 2, Intel iPSC/860 and Paragon, and Cray T3D. Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems. For large problems, the spatial algorithm achieves parallel efficiencies of 90% and a 1840-node Intel Paragon performs up to 165 faster than a single Cray C9O processor. Trade-offs between the three algorithms and guidelines for adapting them to more complex molecular dynamics simulations are also discussed.

29,323 citations

Journal ArticleDOI
01 Aug 2014-Science
TL;DR: Perovskite films received a boost in photovoltaic efficiency through controlled formation of charge-generating films and improved current transfer to the electrodes and low-temperature processing steps allowed the use of materials that draw current out of the perovskites layer more efficiently.
Abstract: Advancing perovskite solar cell technologies toward their theoretical power conversion efficiency (PCE) requires delicate control over the carrier dynamics throughout the entire device. By controlling the formation of the perovskite layer and careful choices of other materials, we suppressed carrier recombination in the absorber, facilitated carrier injection into the carrier transport layers, and maintained good carrier extraction at the electrodes. When measured via reverse bias scan, cell PCE is typically boosted to 16.6% on average, with the highest efficiency of ~19.3% in a planar geometry without antireflective coating. The fabrication of our perovskite solar cells was conducted in air and from solution at low temperatures, which should simplify manufacturing of large-area perovskite devices that are inexpensive and perform at high levels.

5,789 citations

Journal ArticleDOI
TL;DR: A novel non-fullerene electron acceptor (ITIC) that overcomes some of the shortcomings of fullerene acceptors, for example, weak absorption in the visible spectral region and limited energy-level variability, is designed and synthesized.
Abstract: A novel non-fullerene electron acceptor (ITIC) that overcomes some of the shortcomings of fullerene acceptors, for example, weak absorption in the visible spectral region and limited energy-level variability, is designed and synthesized. Fullerene-free polymer solar cells (PSCs) based on the ITIC acceptor are demonstrated to exhibit power conversion effi ciencies of up to 6.8%, a record for fullerene-free PSCs.

3,048 citations