S
Samuel Graham
Researcher at Georgia Institute of Technology
Publications - 361
Citations - 12423
Samuel Graham is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Thermal conductivity & Thin film. The author has an hindex of 48, co-authored 347 publications receiving 9774 citations. Previous affiliations of Samuel Graham include Merck & Co. & United States Military Academy.
Papers
More filters
Journal ArticleDOI
Fabrication and Characterization of High-Performance Thin-Film Encapsulation for Organic Electronics
Namsu Kim,Samuel Graham +1 more
TL;DR: In this article, the results pertaining to the developed thin-film encapsulation were presented, and the integration of the developed barrier layers was demonstrated by encapsulating pentacene/ solar cells.
Proceedings ArticleDOI
Synthesis of Polycrystalline Zeolite Films and Thermal Conductivity Measurements by a 3-Omega Method
TL;DR: In this article, the authors investigated the use of zeolite films in the fabrication of more efficient adsorption heat pumping and refrigeration systems that use water vapor as the working fluid.
Proceedings ArticleDOI
The effectiveness of heat extraction by the drain metal contact of β-Ga 2 O 3 MOSFETs
Samuel Kim,Daniel Shoemaker,Bikramjit Chatterjee,Kelson D. Chabak,Andrew J. Green,Kyle J. Liddy,Gregg H. Jessen,Samuel Graham,Sukwon Choi +8 more
TL;DR: In this article, the top-side features of lateral β-Ga2O3 MOSFETs have been investigated in both electrical and thermal design perspectives to study the effectiveness of heat extraction by the drain metal electrode.
Journal ArticleDOI
Molecular dynamics simulation of oxygen transport characteristics in the electrolyte membrane of PEMFC
TL;DR: In this article, the authors investigated the oxygen transport characteristics in the electrolyte membrane of proton exchange membrane fuel cell (PEMFC), in particular, the water content dependence and the microscopic view of the molecular transport.
Proceedings ArticleDOI
Efficient single-phase cooling techniques for durable power electronics module
TL;DR: In this article, the feasibility of single phase liquid channel cooling, pin fin cooling and spray cooling techniques for heat removal from a power electronic substrate is explored, and the authors concluded that channel cooling yields the best thermal management performance and its use is recommended in the development of a packaged assembly.