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Samuel Graham

Researcher at Georgia Institute of Technology

Publications -  361
Citations -  12423

Samuel Graham is an academic researcher from Georgia Institute of Technology. The author has contributed to research in topics: Thermal conductivity & Thin film. The author has an hindex of 48, co-authored 347 publications receiving 9774 citations. Previous affiliations of Samuel Graham include Merck & Co. & United States Military Academy.

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Journal ArticleDOI

Fabrication and Characterization of High-Performance Thin-Film Encapsulation for Organic Electronics

TL;DR: In this article, the results pertaining to the developed thin-film encapsulation were presented, and the integration of the developed barrier layers was demonstrated by encapsulating pentacene/ solar cells.
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Synthesis of Polycrystalline Zeolite Films and Thermal Conductivity Measurements by a 3-Omega Method

TL;DR: In this article, the authors investigated the use of zeolite films in the fabrication of more efficient adsorption heat pumping and refrigeration systems that use water vapor as the working fluid.
Proceedings ArticleDOI

The effectiveness of heat extraction by the drain metal contact of β-Ga 2 O 3 MOSFETs

TL;DR: In this article, the top-side features of lateral β-Ga2O3 MOSFETs have been investigated in both electrical and thermal design perspectives to study the effectiveness of heat extraction by the drain metal electrode.
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Molecular dynamics simulation of oxygen transport characteristics in the electrolyte membrane of PEMFC

TL;DR: In this article, the authors investigated the oxygen transport characteristics in the electrolyte membrane of proton exchange membrane fuel cell (PEMFC), in particular, the water content dependence and the microscopic view of the molecular transport.
Proceedings ArticleDOI

Efficient single-phase cooling techniques for durable power electronics module

TL;DR: In this article, the feasibility of single phase liquid channel cooling, pin fin cooling and spray cooling techniques for heat removal from a power electronic substrate is explored, and the authors concluded that channel cooling yields the best thermal management performance and its use is recommended in the development of a packaged assembly.