Sangwon Lee

Bio: Sangwon Lee is an academic researcher from Kookmin University. The author has contributed to research in topics: Thin-film transistor & Density of states. The author has an hindex of 13, co-authored 17 publications receiving 1497 citations.

High performance amorphous oxide thin film transistors with self-aligned top-gate structure

Abstract: We have demonstrated self-aligned top-gate amorphous oxide TFTs for large size and high resolution displays. The processes such as source/drain and channel engineering have been developed to realize the self-aligned top gate structure. Ar plasma is exposed on the source/drain region of active layer to minimize the source/drain series resistances. To prevent the conductive channel, N 2 O plasma is also treated on the channel region of active layer. We obtain a field effect mobility of 5.5 cm2/V·s, a threshold voltage of 1.1 V, and a sub-threshold swing of 0.35 V/decade at sub-micron a-GIZO TFTs with the length of 0.67#x00B5;m. Furthermore, a-IZO TFTs fabricated for gate and data driver circuits on glass substrate exhibit excellent electrical properties such as a field effect mobility of 115 cm2/V·s, a threshold voltage of 0.2 V, a sub-threshold swing of 0.2 V/decade, and low threshold voltage shift less than 1 V under bias temperature stress for 3 hr.

Extraction of Subgap Density of States in Amorphous InGaZnO Thin-Film Transistors by Using Multifrequency Capacitance–Voltage Characteristics

Abstract: An extraction technique for subgap density of states (DOS) in an n-channel amorphous InGaZnO thin-film transistor (TFT) by using multifrequency capacitance-voltage (C -V) characteristics is proposed and verified by comparing the measured I- V characteristics with the technology computer-aided design simulation results incorporating the extracted DOS as parameters. It takes on the superposition of exponential tail states and exponential deep states with characteristic parameters for N TA = 1.1 × 1017 cm-3 · eV-1, N DA = 4 × 1015 cm-3 · eV-1, kT TA = 0.09 eV, and kT DA = 0.4 eV. The proposed technique allows obtaining the frequency-independent C-V curve, which is very useful for oxide semiconductor TFT modeling and characterization, and considers the nonlinear relation between the energy level of DOS and the gate voltage V GS. In addition, it is a simple, fast, and accurate extraction method for DOS in amorphous InGaZnO TFTs without optical illumination, temperature dependence, and numerical iteration.

Modeling of amorphous InGaZnO thin-film transistors based on the density of states extracted from the optical response of capacitance-voltage characteristics

Abstract: In order to model dc characteristics of n-channel amorphous InGaZnO thin-film transistors from experimentally obtained density of states (DOS), the acceptorlike DOS is extracted from the optical response of capacitance-voltage characteristics and confirmed by the technology computer-aided design (TCAD) simulation comparing with the measured data. Extracted DOS is a linear superposition of two exponential functions (tail and deep states), and its incorporation into TCAD model reproduces well the experimental current-voltage characteristics over the wide range of the gate and drain voltages. The discrepancy at higher gate voltage is expected to be improved by incorporating a gate voltage-dependent mobility in the model.

Subgap Density-of-States-Based Amorphous Oxide Thin Film Transistor Simulator (DeAOTS)

Abstract: The amorphous oxide thin-film transistor (TFT)-oriented simulator [subgap Density of states (DOS)-based Amorphous Oxide TFT Simulator (DeAOTS)] is proposed, implemented, and demonstrated for amorphous indium-gallium-zinc-oxide (a-IGZO) TFTs. It only consists of parameters having their physical meanings and is supplied with concrete techniques for parameter extraction. Among the physical parameters, the acceptor-like DOS gA(E) was experimentally extracted using the multifrequency C-V technique, whereas the donor-like DOS gD(E) and the doping concentration ND were extracted using numerical iterations. The simulation result reproduces the DOS and thin-film-thickness-dependence of dc I-V characteristics very well. Compared with the previously reported a-Si TFT models, the proposed DeAOTS model not only reflects the strong VGS dependence of the effective mobility (μeff) but also clarifies the relations between process-controlled DOS parameters and dc I- V characteristics based on experimentally extracted DOS parameters. Also, it sufficiently takes into account the peculiar situation of amorphous oxide TFTs where the free-carrier charge can be larger than the localized one out of the total induced charge. Moreover, it reproduces the measured electrical characteristics within the wide range of VGS/VDS with a single equation, not distinguishing the operation regions such as the subthreshold, linear, and saturation regimes.

Extraction of Density of States in Amorphous GaInZnO Thin-Film Transistors by Combining an Optical Charge Pumping and Capacitance–Voltage Characteristics

Abstract: A technique for extracting the acceptorlike density of states (DOS) of n-channel amorphous GaInZnO (a-GIZO) thin-film transistors based on the combination of subbandgap optical charge pumping and C-V characteristics is proposed. While the energy level is scanned by the photon energy and the gate voltage sweep, its density is extracted from the optical response of C-V characteristics. The extracted DOS shows the superposition of the exponential tail states and the Gaussian deep states (N TA=2times1018 eV-1ldrcm-3, N DA=4times1015 eV-1ldrcm-3, kT TA=0.085 eV, kT DA=0.5 eV , E O=1 eV). The TCAD simulation results incorporated by the extracted DOS show good agreements with the measured transfer and output characteristics of a-GIZO thin-film transistors with a single set of process-controlled parameters.

Oxide Semiconductor Thin‐Film Transistors: A Review of Recent Advances

Abstract: Transparent electronics is today one of the most advanced topics for a wide range of device applications. The key components are wide bandgap semiconductors, where oxides of different origins play an important role, not only as passive component but also as active component, similar to what is observed in conventional semiconductors like silicon. Transparent electronics has gained special attention during the last few years and is today established as one of the most promising technologies for leading the next generation of flat panel display due to its excellent electronic performance. In this paper the recent progress in n- and p-type oxide based thin-film transistors (TFT) is reviewed, with special emphasis on solution-processed and p-type, and the major milestones already achieved with this emerging and very promising technology are summarizeed. After a short introduction where the main advantages of these semiconductors are presented, as well as the industry expectations, the beautiful history of TFTs is revisited, including the main landmarks in the last 80 years, finishing by referring to some papers that have played an important role in shaping transparent electronics. Then, an overview is presented of state of the art n-type TFTs processed by physical vapour deposition methods, and finally one of the most exciting, promising, and low cost but powerful technologies is discussed: solution-processed oxide TFTs. Moreover, a more detailed focus analysis will be given concerning p-type oxide TFTs, mainly centred on two of the most promising semiconductor candidates: copper oxide and tin oxide. The most recent data related to the production of complementary metal oxide semiconductor (CMOS) devices based on n- and p-type oxide TFT is also be presented. The last topic of this review is devoted to some emerging applications, finalizing with the main conclusions. Related work that originated at CENIMAT|I3N during the last six years is included in more detail, which has led to the fabrication of high performance n- and p-type oxide transistors as well as the fabrication of CMOS devices with and on paper.

Semiconductor device, and manufacturing method thereof

Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device and display device

Abstract: An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

Particle-in-Cell Charged Particle Simulations, plus Monte Carlo Collisions with Neutral Atoms, PIC-MCC

Abstract: Many-particle charged-particle plasma simulations using spatial meshes for the electromagnetic field solutions, particle-in-cell (PIC) merged with Monte Carlo collision (MCC) calculations, are coming into wide use for application to partially ionized gases. The author emphasizes the development of PIC computer experiments since the 1950s starting with one-dimensional (1-D) charged-sheet models, the addition of the mesh, and fast direct Poisson equation solvers for 2-D and 3-D. Details are provided for adding the collisions between the charged particles and neutral atoms. The result is many-particle simulations with many of the features met in low-temperature collision plasmas; for example, with applications to plasma-assisted materials processing, but also related to warmer plasmas at the edges of magnetized fusion plasmas. >