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Saurabh Basu

Bio: Saurabh Basu is an academic researcher from Pennsylvania State University. The author has contributed to research in topics: Severe plastic deformation & Digital image correlation. The author has an hindex of 10, co-authored 43 publications receiving 374 citations. Previous affiliations of Saurabh Basu include Indian Institute of Technology Kharagpur & Georgia Institute of Technology.

Papers
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Journal ArticleDOI
TL;DR: A survey of existing approaches, identifying commonly utilized methodologies and looking beyond carbon criteria for sustainable manufacturing is presented in this paper, where the challenges of establishing a comprehensive and standardized index based on all the manufacturing aspects, allowing companies to quickly assess the environmental footprint of their manufactured products, are debated.

86 citations

Journal ArticleDOI
TL;DR: In this paper, a suitably parameterized map-space is proposed for capturing average subgrain sizes resulting from severe shear deformation using high-speed digital image correlation and IR thermography to examine the microstructural consequences across a swathe of directly quantified thermomechanical conditions.

38 citations

Journal ArticleDOI
TL;DR: In this article, a generalizable rate-strain-microstructure (RSM) framework was proposed for relating the deformation parameters to the resulting deformed grain size and interface characteristics.
Abstract: Machining induces severe plastic deformation (SPD) in the chip and on the surface to stimulate dramatic microstructural transformations which can often result in a manufactured component with a fine-grained surface. The aim of this paper is to study the one-to-one mappings between the thermomechanics of deformation during chip formation and an array of resulting microstructural characteristics in terms of central deformation parameters–strain, strain-rate, temperature, and the corresponding Zener–Hollomon (ZH) parameter. Here, we propose a generalizable rate-strain-microstructure (RSM) framework for relating the deformation parameters to the resulting deformed grain size and interface characteristics. We utilize Oxley’s model to calculate the strain and strain-rate for a given orthogonal machining condition which was also validated using digital imaging correlation-based deformation field characterization. Complementary infrared thermography in combination with a modified-Oxley’s analysis was utilized to characterize the temperature in the deformation zone where the SPD at high strain-rates is imposed. These characterizations were utilized to delineate a suitable RSM phase-space composed of the strain as one axis and the ZH parameter as the other. Distinctive one-to-one mappings of various microstructures corresponding to an array of grain sizes and grain boundary distributions onto unique subspaces of this RSM space are shown. Building on the realization that the microstructure on machined surfaces is closely related to the chip microstructure derived from the primary deformation zone, this elucidation is expected to offer a reliable approach for controlling surface microstructures from orthogonal machining.

37 citations

Journal ArticleDOI
TL;DR: In this article, the authors examined the onset and progression of dynamic recrystallization (DRX) phenomena under shear deformation conditions characterized by strains > 1 and strain rates >102/s by purposing large strain machining (LSM) as a test of microstructure response.
Abstract: This paper examines the onset and progression of dynamic recrystallization (DRX) phenomena under shear deformation conditions characterized by strains >1 and strain rates >102/s by purposing large strain machining (LSM) as a test of microstructure response. To accomplish this, samples are created using LSM while characterizing the deformation using digital image correlation and infrared thermography. Microstructural consequences resulting from the characterized thermomechanical conditions are examined using electron backscattered diffraction. The progression of DRX is measured by identifying the threshold of grain orientation spread demarcating the onset of recrystallization and utilizing this threshold to segregate the microstructure and quantify the extent of DRX. A model for the onset of DRX as a function of thermomechanics of deformation is presented. This characterization can help understand surface microstructures resulting from shear-based manufacturing processes, such as turning, milling, shaping, etc., that are created under analogous thermomechanical conditions.

28 citations

Journal ArticleDOI
TL;DR: In this paper, the evolution of textures on surfaces created using plane strain machining (PSM) under machining-relevant thermomechanical conditions is studied and compared against that in the chips.
Abstract: Evolution of textures on surfaces created using plane strain machining (PSM) under machining-relevant thermomechanical conditions is studied and compared against that in the chips. By analyzing orientation distribution functions, it is shown that the texture on the surface is comprised of prominent and distinct fibers. By analyzing the pole figures of chips and the surface, it is shown that the two textures have features distinct from one other, even though the scale of the microstructure on the surface and the chips are traditionally considered to be comparable. In situ characterization using high speed imaging of PSM is coupled with a visco-plastic self-consistent (VPSC) model and is used to predict the pole figures in the chip and the surface. A finite element model of PSM is generated and coupled with the VPSC model to create a fully computational route for predicting textures from machining.

26 citations


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01 May 1993
TL;DR: Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems.
Abstract: Three parallel algorithms for classical molecular dynamics are presented. The first assigns each processor a fixed subset of atoms; the second assigns each a fixed subset of inter-atomic forces to compute; the third assigns each a fixed spatial region. The algorithms are suitable for molecular dynamics models which can be difficult to parallelize efficiently—those with short-range forces where the neighbors of each atom change rapidly. They can be implemented on any distributed-memory parallel machine which allows for message-passing of data between independently executing processors. The algorithms are tested on a standard Lennard-Jones benchmark problem for system sizes ranging from 500 to 100,000,000 atoms on several parallel supercomputers--the nCUBE 2, Intel iPSC/860 and Paragon, and Cray T3D. Comparing the results to the fastest reported vectorized Cray Y-MP and C90 algorithm shows that the current generation of parallel machines is competitive with conventional vector supercomputers even for small problems. For large problems, the spatial algorithm achieves parallel efficiencies of 90% and a 1840-node Intel Paragon performs up to 165 faster than a single Cray C9O processor. Trade-offs between the three algorithms and guidelines for adapting them to more complex molecular dynamics simulations are also discussed.

29,323 citations

Journal ArticleDOI
TL;DR: In this article, a conceptual framework is proposed to classify various factors along the triple bottom line pillars of sustainability issues in the context of sustainable supply chain management (SSCM), and a comprehensive thematic analysis was performed on 1068 filtered articles from 2000 to 2015.

447 citations

Journal ArticleDOI
TL;DR: In this paper, the authors identify and analyze the metrics that have been published in the literature on green supply chain management (GSCM) and sustainable supply chain Management (SSCM).

395 citations

Journal ArticleDOI
TL;DR: The results indicate that sustainable single sourcing enhances the ripple effect; facility fortification at major employers in regions mitigates the rippleEffect and enhances sustainability; and a reduction in storage facilities in the supply chain downstream of a disruption-risky facility increases sustainability but causes the rippleeffect.
Abstract: Dynamics of structures and processes is one of the underlying challenges in supply chain management, where multiple dimensions of economic efficiency, risk management and sustainability are interconnected. One of the substantiated issues in supply chain dynamics is resilience. Resilience has a number of intersections with supply chain sustainability. This paper aims at analysing disruption propagation in the supply chain with consideration of sustainability factors in order to design resilient supply chain structure in regard to ripple effect mitigation and sustainability increase. Ripple effect in the supply chain occurs if a disruption at a supplier cannot be localised and cascades downstream impacting supply chain performance. This simulation-based study helps to identify what sustainability factors mitigate the ripple effect in the supply chain and what sustainability factors enhance this effect. The results indicate that (i) sustainable single sourcing enhances the ripple effect; (ii) facility fortif...

254 citations