Millimeter wave (mmWave) signals experience orders-of-magnitude more pathloss than the microwave signals currently used in most wireless applications and all cellular systems. MmWave systems must therefore leverage large antenna arrays, made possible by the decrease in wavelength, to combat pathloss with beamforming gain. Beamforming with multiple data streams, known as precoding, can be used to further improve mmWave spectral efficiency. Both beamforming and precoding are done digitally at baseband in traditional multi-antenna systems. The high cost and power consumption of mixed-signal devices in mmWave systems, however, make analog processing in the RF domain more attractive. This hardware limitation restricts the feasible set of precoders and combiners that can be applied by practical mmWave transceivers. In this paper, we consider transmit precoding and receiver combining in mmWave systems with large antenna arrays. We exploit the spatial structure of mmWave channels to formulate the precoding/combining problem as a sparse reconstruction problem. Using the principle of basis pursuit, we develop algorithms that accurately approximate optimal unconstrained precoders and combiners such that they can be implemented in low-cost RF hardware. We present numerical results on the performance of the proposed algorithms and show that they allow mmWave systems to approach their unconstrained performance limits, even when transceiver hardware constraints are considered.

Spatially Sparse Precoding in Millimeter Wave MIMO Systems

Communication at millimeter wave (mmWave) frequencies is defining a new era of wireless communication. The mmWave band offers higher bandwidth communication channels versus those presently used in commercial wireless systems. The applications of mmWave are immense: wireless local and personal area networks in the unlicensed band, 5G cellular systems, not to mention vehicular area networks, ad hoc networks, and wearables. Signal processing is critical for enabling the next generation of mmWave communication. Due to the use of large antenna arrays at the transmitter and receiver, combined with radio frequency and mixed signal power constraints, new multiple-input multiple-output (MIMO) communication signal processing techniques are needed. Because of the wide bandwidths, low complexity transceiver algorithms become important. There are opportunities to exploit techniques like compressed sensing for channel estimation and beamforming. This article provides an overview of signal processing challenges in mmWave wireless systems, with an emphasis on those faced by using MIMO communication at higher carrier frequencies.

An Overview of Signal Processing Techniques for Millimeter Wave MIMO Systems

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

Recent changes in how people consume multimedia services are causing an explosive increase in mobile traffic. With more and more people using wireless networks, the demand for the ultra-fast wireless communications systems is increasing. To date, this demand has been accommodated with advanced modulation schemes and signal-processing technologies at microwave frequencies. However, without increasing the carrier frequencies for more spectral resources, it may be quite difficult to keep up with the needs of users. Although there are several alternative bands, recent advances in terahertz-wave (THz-wave) technologies have attracted attention due to the huge bandwidth of THz waves and its potential for use in wireless communications. The frequency band of 275 ~ 3000 GHz , which has not been allocated for specific uses yet, is especially of interest for future wireless systems with data rates of 10 Gb/s or higher. Although THz communications is still in a very early stage of development, there have been lots of reports that show its potential. In this review, we will examine the current progress of THz-wave technologies related to communications applications and discuss some issues that need to be considered for the future of THz communications.

Present and Future of Terahertz Communications

According to Edholm’s law, the demand for point-to-point bandwidth in wireless short-range communications has doubled every 18 months over the last 25 years It can be predicted that data rates of around 5–10 Gb/s will be required in ten years In order to achieve 10 Gb/s data rates, the carrier frequencies need to be increased beyond 100 GHz Over the past ten years, several groups have considered the prospects of using sub-terahertz (THz) and THz waves (100–2000 GHz) as a means to transmit data wirelessly Some of the reported advantages of THz communications links are inherently higher bandwidth compared to millimeter wave links, less susceptibility to scintillation effects than infrared wireless links, and the ability to use THz links for secure communications Our goal of this paper is to provide a comprehensive review of wireless sub-THz and THz communications

Review of terahertz and subterahertz wireless communications

A phased-array transmitter (TX) for multi-Gb/s non-line-of-sight links in the four frequency channels of the IEEE 802.15.3c standard (58.32 to 64.8 GHz) is fully integrated in a 0.12-μm SiGe BiCMOS process. It consists of an up-conversion core followed by a 1:16 power distribution tree, 16 phase-shifting front-ends, and a digital control unit. The TX core is a two-step sliding-IF up-conversion chain with frequency synthesizer that features 40 dB of gain programmability, I/Q balance and LO leakage correction, and a modulator for 802.15.3c common-mode signaling. The tradeoffs involved in the implementation of a 1:16 power distribution network are analyzed and a hybrid passive/active distribution tree architecture is introduced. Each of the 16 front-ends consists of a balanced passive phase shifter and a variable-gain, 3-stage PA that features oP1dB programmability through the bias control of the its final stage. All of the chip features are digitally controllable and individual memory arrays are integrated at each front-end to enable fast beam steering through a high-speed parallel interface. The IC occupies 44 mm and is fully characterized on wafer. The TX delivers 9 to 13.5 dBm oPidB per element at 60.48 GHz with a total power consumption of 3.8 to 6.2 W. Each element attains a phase-shift range >360° with an amplitude variation <;±1 dB across phase settings and adjacent elements. Measurement results from a packaged IC in an antenna chamber are also presented including the demonstration of spatial power combining up to +40 dBm EIRP and 16-element radiation patterns.

A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications

A 0.13-mum SiGe BiCMOS double-conversion superheterodyne receiver and transmitter chipset for data communications in the 60-GHz band is presented. The receiver chip includes an image-reject low-noise amplifier (LNA), RF-to-IF mixer, IF amplifier strip, quadrature IF-to-baseband mixers, phase-locked loop (PLL), and frequency tripler. It achieves a 6-dB noise figure, -30 dBm IIP3, and consumes 500 mW. The transmitter chip includes a power amplifier, image-reject driver, IF-to-RF upmixer, IF amplifier strip, quadrature baseband-to-IF mixers, PLL, and frequency tripler. It achieves output P1dB of 10 to 12dBm, Psat of 15 to 17 dBm, and consumes 800 mW. The chips have been packaged with planar antennas, and a wireless data link at 630 Mb/s over 10 m has been demonstrated

A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications

This paper presents the first reported 28-GHz phased-array IC for 5G communications. Implemented in 130-nm SiGe BiCMOS, the IC includes 32 TRX elements and features concurrent independent beams in two polarizations in either TX or RX operation. Circuit techniques to enable precise beam steering, orthogonal phase and amplitude control at each front end, and independent tapering and beam steering at the array level are presented. A TX/RX switch design is introduced which minimizes TX path loss resulting in 13.5 dBm/16 dBm Op1dB/Psat per front end with >20% peak power added efficiency of the power amplifier (including switch and off-mode LNA) while maintaining a 6 dB noise figure in the low noise amplifier (including switch and off-mode PA). Comprehensive on-wafer measurement results for the IC across multiple samples and temperature variation are presented. A package with four ICs and 64 dual-polarized antennas provides eight 16-element or two 64-element concurrent beams with 1.4°/step beam steering (<0.6° rms error) across a ±50° steering range without requiring calibration. A maximum saturated effective isotropic radiated power of 54 dBm is measured in the broadside direction for each polarization. Tapering control without requiring calibration achieves up to 20-dB sidelobe rejection without affecting the main lobe direction.

A 28-GHz 32-Element TRX Phased-Array IC With Concurrent Dual-Polarized Operation and Orthogonal Phase and Gain Control for 5G Communications

A low-noise amplifier, direct-conversion quadrature mixer, power amplifier, and voltage-controlled oscillators have been implemented in a 012-/spl mu/m, 200-GHz f/sub T/290-GHz f/sub MAX/ SiGe bipolar technology for operation at 60 GHz At 615 GHz, the two-stage LNA achieves 45-dB NF, 15-dB gain, consuming 6 mA from 18 V This is the first known demonstration of a silicon LNA at V-band The downconverter consists of a preamplifier, I/Q double-balanced mixers, a frequency tripler, and a quadrature generator, and is again the first known demonstration of silicon active mixers at V-band At 60 GHz, the downconverter gain is 186 dB and the NF is 133 dB, and the circuit consumes 55 mA from 27 V, while the output buffers consume an additional 52 mA The balanced class-AB PA provides 108-dB gain, +112-dBm 1-dB compression point, 43% maximum PAE, and 16-dBm saturated output power Finally, fully differential Colpitts VCOs have been implemented at 22 and 67 GHz The 67-GHz VCO has a phase noise better than -98 dBc/Hz at 1-MHz offset, and provides a 31% tuning range for 8-mA current consumption from a 3-V supply

SiGe bipolar transceiver circuits operating at 60 GHz

An integrated SiGe superheterodyne RX/TX pair capable of Gb/s data rates in the 60GHz band is described. The 6dB NF RX includes an image-reject LNA, a multistage down-converter with on-chip IF filters, a frequency tripler, a PLL, and baseband outputs. The 10 to 12dBm P1dBTX achieves 10% PAE in the final stage. It includes a PA, image-reject driver, multistage up-converter with on-chip filters, tripler, and PLL

Scott K. Reynolds

Papers

A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications

A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications

A 28-GHz 32-Element TRX Phased-Array IC With Concurrent Dual-Polarized Operation and Orthogonal Phase and Gain Control for 5G Communications

SiGe bipolar transceiver circuits operating at 60 GHz

A silicon 60GHz receiver and transmitter chipset for broadband communications