Seiji Samukawa

Bio: Seiji Samukawa is an academic researcher from Tohoku University. The author has contributed to research in topics: Etching (microfabrication) & Plasma etching. The author has an hindex of 37, co-authored 469 publications receiving 7260 citations. Previous affiliations of Seiji Samukawa include Ebara Corporation & National Institute of Advanced Industrial Science and Technology.

The 2017 Plasma Roadmap: Low temperature plasma science and technology

Abstract: Journal of Physics D: Applied Physics published the first Plasma Roadmap in 2012 consisting of the individual perspectives of 16 leading experts in the various sub-fields of low temperature plasma science and technology. The 2017 Plasma Roadmap is the first update of a planned series of periodic updates of the Plasma Roadmap. The continuously growing interdisciplinary nature of the low temperature plasma field and its equally broad range of applications are making it increasingly difficult to identify major challenges that encompass all of the many sub-fields and applications. This intellectual diversity is ultimately a strength of the field. The current state of the art for the 19 sub-fields addressed in this roadmap demonstrates the enviable track record of the low temperature plasma field in the development of plasmas as an enabling technology for a vast range of technologies that underpin our modern society. At the same time, the many important scientific and technological challenges shared in this roadmap show that the path forward is not only scientifically rich but has the potential to make wide and far reaching contributions to many societal challenges.

The 2012 Plasma Roadmap

Abstract: Low-temperature plasma physics and technology are diverse and interdisciplinary fields. The plasma parameters can span many orders of magnitude and applications are found in quite different areas of daily life and industrial production. As a consequence, the trends in research, science and technology are difficult to follow and it is not easy to identify the major challenges of the field and their many sub-fields. Even for experts the road to the future is sometimes lost in the mist. Journal of Physics D: Applied Physics is addressing this need for clarity and thus providing guidance to the field by this special Review article, The 2012 Plasma Roadmap.

Generating high-efficiency neutral beams by using negative ions in an inductively coupled plasma source

Abstract: To minimize radiation damage caused by charge buildup or ultraviolet and x-ray photons during etching, we developed a high-performance neutral-beam etching system. The neutral-beam source consists of an inductively coupled plasma (ICP) source and parallel top and bottom carbon plates. The bottom carbon plate has numerous apertures for extracting neutral beams from the plasma. When a direct current (dc) bias is applied to the top and bottom plates, the generated positive or negative ions are accelerated toward the bottom plate. Most of them are then efficiently converted into neutral atoms, either by neutralization in charge-transfer collisions with gas molecules during ion transport and with the aperture sidewalls in the bottom plate, or by recombination with low-energy electrons near the end of the bottom plate. We found that negative ions are more efficiently converted into neutral atoms than positive ions. The neutralization efficiency of negative ions was almost 100%, and the maximum neutral flux density was equivalent to 4.0 mA/cm2. A neutral beam can thus be efficiently produced from the ICP source and apertures in our new neutral-beam source.

Plasma Treatment Method and Plasma Etching Method

Abstract: The present invention develops a process for plasma treatment using a gas having no greenhouse effect in order to realize global environmental preservation and sophistication of plasma process performance and provides a process for plasma etching with high accuracy which process can depress damage to devices. The process for plasma treatment according to the present invention comprises the steps of feeding a treatment gas containing fluorine gas (F2) into a plasma generating chamber, alternately repeating application of high frequency electric field and stop of the application thereof to generate plasma, and carrying out substrate treatment by irradiating the plasma to a substrate. Furthermore, the substrate treatment may be carried out by individually or alternately extracting negative ions or positive ions from the plasma, or selectively extracting only negative ions, neutralizing them, to generate a neutral beam and irradiating the neutral beam to the substrate.

Plasma processing method and equipment used therefor

Abstract: A plasma processing method is provided which suppresses the charge accumulation on a processing object such as a semiconductor substrate. An alternating excitation signal in the form of pulses for exciting the plasma is supplied to a reaction gas contained in a plasma chamber, each pulse having an on-period t on for supplying the excitation signal and an off-period t off for stopping the excitation signal. The off period ranges from 10 to 100 μsec. The on-period may be determined as needed. An alternating bias signal for biasing the processing object is also applied to the object in the chamber. The bias signal has a frequency of at most 600 kHz. As a result, an increased number of positive and negative ions impinge the object thus increasing the processing rate and reducing the charge accumulation compared to prior art processes.

I and i

Abstract: There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality. Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

Semiconductor device, and manufacturing method thereof

Abstract: An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Electronic Transport In Mesoscopic Systems

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Plasma-liquid interactions: A review and roadmap

Abstract: Plasma–liquid interactions represent a growing interdisciplinary area of research involving plasma science, fluid dynamics, heat and mass transfer, photolysis, multiphase chemistry and aerosol science. This review provides an assessment of the state-of-the-art of this multidisciplinary area and identifies the key research challenges. The developments in diagnostics, modeling and further extensions of cross section and reaction rate databases that are necessary to address these challenges are discussed. The review focusses on non-equilibrium plasmas.