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Author

Seymour R. Cray

Bio: Seymour R. Cray is an academic researcher from Cray. The author has contributed to research in topics: Integrated circuit & Electronic circuit. The author has an hindex of 11, co-authored 18 publications receiving 459 citations.

Papers
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Patent
08 Mar 1991
TL;DR: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation as mentioned in this paper.
Abstract: A cooling system employs a cooling liquid and a cooling gas in a combined thermodynamic cycle to overcome the flow resistance of dense assemblies of heat generating components and to improve heat transfer by inducing turbulence, thereby reducing the effects of thermal hysteresis and boundary layer formation. Sensible heat gain to the cooling liquid and gas and latent heat of vaporization of the cooling liquid also occur in channels through and over the components. The flow of cooling gas propels the cooling liquid through the channels. The cooling system is advantageous for cooling electronic components such as integrated circuits which exhibit relatively high degree of energy and physical density, in supercomputers. The cooling system may also be advantageously combined with an immersion cooling system for the power supply components in the computer.

121 citations

Patent
22 Jun 1990
TL;DR: In this paper, a method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes was proposed, which has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires.
Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

80 citations

Patent
09 Mar 1973
TL;DR: In this paper, the interconnect devices include rigid, elongated members extending through the region separating adjacent circuit boards and assembled to receiver means, such as recesses, located in housings supported by an adjacent circuit board.
Abstract: Circuit elements on circuit boards of a stacked assembly are electrically interconnected by interconnect devices located in a pseudo-random array on the boards. The interconnect devices include rigid, elongated members extending through the region separating adjacent circuit boards and assembled to receiver means, such as recesses, located in housings supported by an adjacent circuit board.

44 citations

Patent
08 Mar 1973
TL;DR: A computer system according to the present disclosure includes a plurality of individual processors and an interlock register connected to the processors for process control independent of memory as mentioned in this paper, where the main registers of each processor are selectively operated in different modes.
Abstract: A computer system according to the present disclosure includes a plurality of individual processors and an interlock register connected to the processors for process control independent of memory One aspect of the disclosure resides in a ''''universal'''' register technique and apparatus wherein the main registers of each processor are selectively operated in a plurality of modes Another aspect of the disclosure resides in an addressing technique and apparatus wherein a reference address of an object program is selectively added to addresses of programs inside and outside of the field length of the object program to obtain the absolute address of the program Absolute addresses of resident programs, however, are handled by not adding the reference address to the resident program address

40 citations

Patent
27 Jul 1989
TL;DR: In this paper, a method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes was proposed, which has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires.
Abstract: A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice directly to circuit boards by ball bonding gold wires to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the disc and inserting the gold leads into through-plated holes of circuit boards which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.

40 citations


Cited by
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Patent
01 Feb 1999
TL;DR: An adaptive interface for a programmable system, for predicting a desired user function, based on user history, as well as machine internal status and context, is presented for confirmation by the user, and the predictive mechanism is updated based on this feedback as mentioned in this paper.
Abstract: An adaptive interface for a programmable system, for predicting a desired user function, based on user history, as well as machine internal status and context. The apparatus receives an input from the user and other data. A predicted input is presented for confirmation by the user, and the predictive mechanism is updated based on this feedback. Also provided is a pattern recognition system for a multimedia device, wherein a user input is matched to a video stream on a conceptual basis, allowing inexact programming of a multimedia device. The system analyzes a data stream for correspondence with a data pattern for processing and storage. The data stream is subjected to adaptive pattern recognition to extract features of interest to provide a highly compressed representation that may be efficiently processed to determine correspondence. Applications of the interface and system include a video cassette recorder (VCR), medical device, vehicle control system, audio device, environmental control system, securities trading terminal, and smart house. The system optionally includes an actuator for effecting the environment of operation, allowing closed-loop feedback operation and automated learning.

1,182 citations

Patent
16 Sep 2002
TL;DR: In this article, the authors describe an electroosmotic pump that is capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as associated reduction in reliability.
Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

365 citations

Patent
24 Sep 1991
TL;DR: In this paper, a flexible, sheet-like element having terminals thereon overlying the front or rear face of the chip is used to provide a compact unit. But, the terminals on the sheetlike element are movable with respect to the chip, so as to compensate for thermal expansion.
Abstract: Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.

310 citations

Patent
20 Sep 1993
TL;DR: In this paper, methods of constructing a wire interconnect structure on a substrate are described, which broadly comprise the steps of depositing a spacer layer on a surface of the substrate, depositing mask layer on the spacer layers, and removing a first portion of the mask layer overlying a desired area on the substrate surface to expose the sacer layer underlying the first part of mask layer.
Abstract: Methods of constructing a wire interconnect structure on a substrate are described. The methods broadly comprise the steps of depositing a spacer layer on a surface of the substrate, depositing a mask layer on the spacer layer, and removing a first portion of the mask layer overlying a desired area on the substrate surface to expose the spacer layer underlying the first portion of the mask layer. The methods further comprise the step of etching the structure such that a first portion of the spacer layer overlaying the desired area is removed and such that a portion of the desired area is exposed, and the step of depositing a first conductive material on the exposed portion of the desired area such that a conductive post is formed on the substrate surface and mounted to the desired area. Some of the disclosed methods comprise additional steps for forming an interconnect structure on the opposite surface of the substrate and providing an electrical interconnect means between the two interconnect structures. Additionally, some of the disclosed methods comprise steps for forming fillets around the conductive post at the substrate surface.

301 citations

Patent
27 Dec 2001
TL;DR: In this article, a probe card assembly is described, which includes a probe, a space transformer, and an interposer disposed between the space transformer and the probe card to ensure that electrical connections are maintained between the transformer and probe card throughout the transformer's range of adjustment.
Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

290 citations