The present invention provides stretchable, and optionally printable, semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Stretchable semiconductors and electronic circuits of the present invention preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention may be adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

http://science.sciencemag.org/content/sci/311/5758/208.full.pdf

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

Methods and devices for fabricating and assembling printable semiconductor elements

Disclosed is a light-emitting diode package, comprising: a package body having a cavity; a light-emitting diode chip having a plurality of light-emitting cells connected in serial with each other; a fluorescent body for converting the wavelength of light emitted by the light-emitting diode chip; and a pair of lead electrodes. The light-emitting cells are connected together in series between the pair of lead electrodes.

Light emitting diode package

Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

Optical systems fabricated by printing-based assembly

Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

A bendable light emitting diode (LED) array in accordance with the present invention includes heat spreaders, dielectric material disposed above each heat spreader, and a bendable electrical interconnection layer disposed above these heat spreaders and electrically insulated from these heat spreaders by the dielectric material. At least one via passes through the dielectric material above each heat spreader, and at least one LED die is disposed above each via. The bendable electrical interconnection layer may be a lead frame comprising metal pathways that electrically interconnect some or all LED dice in series, in parallel, in anti-parallel, or in some combination of these configurations. Each via contains a thermally conductive material in thermal contact with the corresponding heat spreader below it and in thermal contact with the corresponding LED die above it. The LED dice may be thermally and electrically coupled to submounts disposed above corresponding heat spreaders in some embodiments.

Shane Harrah

Papers

Bendable high flux led array