Sheng-Da Liu

Bio: Sheng-Da Liu is an academic researcher from TSMC. The author has contributed to research in topics: Leakage (electronics) & CMOS. The author has an hindex of 7, co-authored 9 publications receiving 414 citations.

5nm-gate nanowire FinFET

Abstract: A new nanowire FinFET structure is developed for CMOS device scaling into the sub-10 nm regime. Accumulation mode P-FET and inversion mode N-FET with 5 nm and 10 nm physical gate length, respectively, are fabricated. N-FET gate delay (CV/I) of 0.22 ps and P-FET gate delay of 0.48 ps with excellent subthreshold characteristics are achieved, both with very low off leakage cur-rent less than 10 nA/ /spl mu/m. Nanowire FinFET device operation is also explored using 3-D full quantum mechanical simulation.

A next generation CMOS-compatible GaN-on-Si transistors for high efficiency energy systems

Abstract: CMOS-compatible 100 V / 650 V enhancement-mode high electron mobility transistors (E-HEMTs) and 650 V depletion-mode MISFET (D-MISFET) are fabricated on 6-inch GaN-on-Si wafers. These devices show excellent power converter switching performances. Both 100 V and 650 V E-HEMTs had passed industrial reliability qualifications. The importance of bulk leakage, interface quality and gate trapping in dynamic on-resistance is figured out. The device with optimized processes shows a significant reduction of the dynamic on-resistance degradation.

20nm gate bulk-finFET SONOS flash

Abstract: High-performance FinFET SONOS (silicon-oxide-nitride-oxide-silicon) flash cells with gate length down to 20nm have been fabricated and operated successfully on bulk-silicon substrate for the first time A program/erase window of 2V has been achieved with high P/E speed (TP equiv 10mus and TE equiv 1ms), and a 15V window remained after 10 years at room temperature Multi-level storage is also obtained with DeltaVt > 4V and TP,E equiv 1 ms Operation voltages are not more than 7V in the two applications Gate disturb issues are alleviated by applying an appropriate bias on unselected bit lines

Novel 20nm hybrid SOI/bulk CMOS technology with 0.183/spl mu/m/sup 2/ 6T-SRAM cell by immersion lithography

Abstract: For the first time, a novel hybrid SOI/bulk CMOS technology with 20nm gate length and low-leakage 1.3nm thick SiON gate dielectric has been developed for advanced SOC applications. 26% (for N-FET) and 35% (for P-FET) improvements of intrinsic gate delay (CV/I) at low gate leakage of 20-40A/cm/sup 2/ have been achieved over previous leading-edge 45nm node version, while maintaining the same sub-threshold leakage (100nA//spl mu/m). 10 times reduction of the leakage can be further modulated by a virtual back-gate control. Fine patterning with line pitch of 90nm by immersion lithography is demonstrated, which features 0.183/spl mu/m/sup 2/ 6T-SRAM cell for 32nm node on-trend scaling.

High performance dual-gate ISFET with non-ideal effect reduction schemes in a SOI-CMOS bioelectrical SoC

Abstract: A dual-gate ion-sensitive field-effect transistor (DGFET) with the back-side sensing structure implemented in a 0.18 μm SOI-CMOS SoC platform realizing high performance bioelectrical detection with non-ideal effect reduction is presented. Non-ideal effects of the conventional ISFET, such as time drift and hysteresis, are suppressed by the innovative scheme in DGFET using the bottom poly-gate (PG) transistor instead of the fluidic gate (FG) transistor for sensing. As a result, the signal-to-noise ratio (SNR) is improved by 155x, time drift is reduced by 53x, and hysteresis is reduced by 3.7x. For certain applications which require high sensitivity, a pulse-modulated biasing technique can be adopted to effectively reduce time drift with high pH sensitivity of 453 mV/pH which is ∼7.5x enhancement over the Nernst limit in the proposed DGFET.

GaN-on-Si Power Technology: Devices and Applications

Abstract: In this paper, we present a comprehensive reviewand discussion of the state-of-the-art device technology and application development of GaN-on-Si power electronics. Several device technologies for realizing normally off operation that is highly desirable for power switching applications are presented. In addition, the examples of circuit applications that can greatly benefit from the superior performance of GaN power devices are demonstrated. Comparisonwith other competingpower device technology, such as Si superjunction-MOSFET and SiC MOSFET, is also presented and analyzed. Critical issues for commercialization of GaN-on-Si power devices are discussed with regard to cost, reliability, and ease of use.

High-performance fully depleted silicon nanowire (diameter /spl les/ 5 nm) gate-all-around CMOS devices

Abstract: This paper demonstrates gate-all-around (GAA) n- and p-FETs on a silicon-on-insulator with /spl les/ 5-nm-diameter laterally formed Si nanowire channel. Alternating phase shift mask lithography and self-limiting oxidation techniques were utilized to form 140- to 1000-nm-long nanowires, followed by FET fabrication. The devices exhibit excellent electrostatic control, e.g., near ideal subthreshold slope (/spl sim/ 63 mV/dec), low drain-induced barrier lowering (/spl sim/ 10 mV/V), and with I/sub ON//I/sub OFF/ ratio of /spl sim/10/sup 6/. High drive currents of /spl sim/ 1.5 and /spl sim/1.0 mA//spl mu/m were achieved for 180-nm-long nand p-FETs, respectively. It is verified that the threshold voltage of GAA FETs is independent of substrate bias due to the complete electrostatic shielding of the channel body.

Tri-gate devices and methods of fabrication

Abstract: The present invention is a semiconductor device comprising a semiconductor body having a top surface and laterally opposite sidewalls formed on a substrate. A gate dielectric layer is formed on the top surface of the semiconductor body and on the laterally opposite sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the laterally opposite sidewalls of the semiconductor body.

Nonplanar transistors with metal gate electrodes

Abstract: A semiconductor device comprising a semiconductor body having a top surface and a first and second laterally opposite sidewalls as formed on an insulating substrate is claimed. A gate dielectric is formed on the top surface of the semiconductor body and on the first and second laterally opposite sidewalls of the semiconductor body. A gate electrode is then formed on the gate dielectric on the top surface of the semiconductor body and adjacent to the gate dielectric on the first and second laterally opposite sidewalls of the semiconductor body. The gate electrode comprises a metal film formed directly adjacent to the gate dielectric layer. A pair of source and drain regions are then formed in the semiconductor body on opposite sides of the gate electrode.