S
Stanton Earl Weaver
Researcher at General Electric
Publications - 116
Citations - 4331
Stanton Earl Weaver is an academic researcher from General Electric. The author has contributed to research in topics: Light-emitting diode & Heat sink. The author has an hindex of 34, co-authored 116 publications receiving 4306 citations. Previous affiliations of Stanton Earl Weaver include GE Lighting & Lockheed Martin Corporation.
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Patent
Led power package
Chen-Lun Hsing Chen,Stanton Earl Weaver,Ivan Eliashevich,Sébastien Paul René Libon,Mehmet Arik,David Shaddock +5 more
TL;DR: In this paper, a flip-chip-bonded surface mount light emitting diode (LED) die is flipped-chip bonded onto a frontside (16) of the sub-mount wafer (10).
Patent
Flexible interconnect structures for electrical devices and light sources incorporating the same
TL;DR: A flexible interconnect structure (10) as discussed by the authors allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements (300), such as lightemitting diodes ('LEDs') and/or laser Diodes.
Proceedings ArticleDOI
Thermal management of LEDs: package to system
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Thermal management of LEDs: Package to system
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Patent
Coated led with improved efficiency
Thomas F. Soules,Stanton Earl Weaver,Chen-Lun Hsing Chen,Mathew Sommers,Boris Kolodin,Anan Achyut Setlur,Thomas Elliot Stecher +6 more
TL;DR: An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light is described in this article.