Steve Knebel

Bio: Steve Knebel is an academic researcher. The author has contributed to research in topics: Capacitor & Dielectric. The author has an hindex of 12, co-authored 18 publications receiving 437 citations.

Insights into electrical characteristics of silicon doped hafnium oxide ferroelectric thin films

Abstract: Silicon doped hafnium oxide thin films were recently discovered to exhibit ferroelectricity. In the present study, metal-ferroelectric-metal capacitors with Si:HfO2 thin films as ferroelectric material and TiN as electrodes have been characterized with respect to capacitance and current density as functions of temperature and applied voltage. Polarity asymmetry of the frequency dependent coercive field was explained by interfacial effects. No ferroelectric-paraelectric phase transition was observed at temperatures up to 478 K. Clear distinctions between current evolutions with or without polarization switching were correlated to the time competition between the measurement and the response of relaxation mechanisms.

How to make DRAM non-volatile? Anti-ferroelectrics: A new paradigm for universal memories

Abstract: The major disadvantages of DRAM memory cells are the very short retention time and high power consumption needed to refresh the stored information. Here, we present a new concept using a modified DRAM capacitor stack to enable non-volatile data storage. Recent reports verified anti-ferroelectric properties for pure ZrO 2 dielectrics used in DRAM stacks. Anti-ferroelectric materials are well known for high endurance strength but at the same time volatile memory behavior. Based on Landau theory, we propose a simple way how non-volatility can be achieved in state-of-the-art ZrO 2 based DRAM stacks. By employing electrodes with different workfunction values, a built-in bias is introduced within the AFE stack, thus creating two stable non-volatile states. Moreover, we report the fabrication of the world's first non-volatile AFE-RAM. Detailed characterization proved high endurance and reliable operation of this non-volatile DRAM stack equivalent. In addition to the 1T-1C cell, we show a proof of concept for a MIS capacitor device which can be integrated in future AFE-FET based 1T memory architectures.

Conduction barrier offset engineering for DRAM capacitor scaling

Abstract: DRAM capacitors are reaching the scaling limit and new approaches are necessary to enable further reduction of the physical thickness of the capacitor dielectric The conduction band offset (CBO) of a platinum noble metal electrode on atomic layer deposited ZrO 2 /Al 2 O 3 /ZrO 2 is evaluated and compared to a titanium nitride electrode Internal Photo Emission Spectroscopy and Photoconductivity measurement are used to estimate the barrier height and band gap, respectively The barrier height difference between the two electrodes is evaluated in comparison with a previously reported model Finally, the impact of an increased barrier height on dielectric scaling will be discussed based on a leakage current simulation of a ZrO 2 capacitor

Ferroelectricity and Antiferroelectricity of Doped Thin HfO2‐Based Films

Abstract: The recent progress in ferroelectricity and antiferroelectricity in HfO2-based thin films is reported. Most ferroelectric thin film research focuses on perovskite structure materials, such as Pb(Zr,Ti)O3, BaTiO3, and SrBi2Ta2O9, which are considered to be feasible candidate materials for non-volatile semiconductor memory devices. However, these conventional ferroelectrics suffer from various problems including poor Si-compatibility, environmental issues related to Pb, large physical thickness, low resistance to hydrogen, and small bandgap. In 2011, ferroelectricity in Si-doped HfO2 thin films was first reported. Various dopants, such as Si, Zr, Al, Y, Gd, Sr, and La can induce ferro-electricity or antiferroelectricity in thin HfO2 films. They have large remanent polarization of up to 45 μC cm(-2), and their coercive field (≈1-2 MV cm(-1)) is larger than conventional ferroelectric films by approximately one order of magnitude. Furthermore, they can be extremely thin ( 5 eV). These differences are believed to overcome the barriers of conventional ferroelectrics in memory applications, including ferroelectric field-effect-transistors and three-dimensional capacitors. Moreover, the coupling of electric and thermal properties of the antiferroelectric thin films is expected to be useful for various applications, including energy harvesting/storage, solid-state-cooling, and infrared sensors.

Physical Mechanisms behind the Field-Cycling Behavior of HfO2-Based Ferroelectric Capacitors

Abstract: Novel hafnium oxide (HfO2)-based ferroelectrics reveal full scalability and complementary metal oxide semiconductor integratability compared to perovskite-based ferroelectrics that are currently used in nonvolatile ferroelectric random access memories (FeRAMs). Within the lifetime of the device, two main regimes of wake-up and fatigue can be identified. Up to now, the mechanisms behind these two device stages have not been revealed. Thus, the main scope of this study is an identification of the root cause for the increase of the remnant polarization during the wake-up phase and subsequent polarization degradation with further cycling. Combining the comprehensive ferroelectric switching current experiments, Preisach density analysis, and transmission electron microscopy (TEM) study with compact and Technology Computer Aided Design (TCAD) modeling, it has been found out that during the wake-up of the device no new defects are generated but the existing defects redistribute within the device. Furthermore, vacancy diffusion has been identified as the main cause for the phase transformation and consequent increase of the remnant polarization. Utilizing trap density spectroscopy for examining defect evolution with cycling of the device together with modeling of the degradation results in an understanding of the main mechanisms behind the evolution of the ferroelectric response.

The origin of ferroelectricity in Hf1−xZrxO2: A computational investigation and a surface energy model

Abstract: The structural, thermal, and dielectric properties of the ferroelectric phase of HfO2, ZrO2, and Hf0.5Zr0.5O2 (HZO) are investigated with carefully validated density functional computations. We find that the free bulk energy of the ferroelectric orthorhombic Pca21 phase is unfavorable compared to the monoclinic P21/c and the orthorhombic Pbca phase for all investigated stoichiometries in the Hf1−xZrxO2 system. To explain the existence of the ferroelectric phase in nanoscale thin films, we explore the Gibbs/Helmholtz free energies as a function of stress and film strain and find them unlikely to become minimal in HZO films for technological relevant conditions. To assess the contribution of surface energy to the phase stability, we parameterize a model, interpolating between existing data, and find the Helmholtz free energy of ferroelectric grains minimal for a range of size and stoichiometry. From the model, we predict undoped HfO2 to be ferroelectric for a grain size of about 4 nm and epitaxial HZO below 5 nm. Furthermore, we calculate the strength of an applied electric field necessary to cause the antiferroelectric phase transformation in ZrO2 from the P42/nmc phase as 1 MV/cm in agreement with experimental data, explaining the mechanism of field induced phase transformation.

Evolution of phases and ferroelectric properties of thin Hf0.5Zr0.5O2 films according to the thickness and annealing temperature

Abstract: The effects of annealing temperature (Tanneal) and film thickness (tf) on the crystal structure and ferroelectric properties of Hf0.5Zr0.5O2 films were examined. The Hf0.5Zr0.5O2 films consist of tetragonal, orthorhombic, and monoclinic phases. The orthorhombic phase content, which is responsible for the ferroelectricity in this material, is almost independent of Tanneal, but decreases with increasing tf. In contrast, increasing Tanneal and tf monotonically increases (decreases) the amount of monoclinic (tetragonal) phase, which coincides with the variations in the dielectric constant. The remanant polarization was determined by the content of orthorhombic phase as well as the spatial distribution of other phases.

The Origin of Ferroelectricity in Hf$_{x}$ Zr$_{1-x}$ O$_2$: A Computational Investigation and a Surface Energy Model

Abstract: The structural, thermal, and dielectric properties of the ferroelectric phase of HfO$_2$, ZrO$_2$ and Hf$_{0.5}$ Zr$_{0.5}$ O$_2$ (HZO) are investigated with carefully validated density functional computations. We find, that the free bulk energy of the ferroelectric orthorhombic Pca2$_{1}$ phase is unfavorable compared to the monoclinic P2$_{1}$/c and the orthorhombic Pbca phase for all investigated stoichiometries in the Hf$_{\chi}$Zr$_{1-\chi}$O$_2$ system. To explain the existence of the ferroelectric phase in nanoscale thin films we explore the Gibbs / Helmholtz free energies as a function of stress and film strain and find them unlikely to become minimal in HZO films for technological relevant conditions. To assess the contribution of surface energy to the phase stability we parameterize a model, interpolating between existing data, and find the Helmholtz free energy of ferroelectric grains minimal for a range of size and stoichiometry. From the model we predict undoped HfO$_2$ to be ferroelectric for a grain size of about 4 nm and epitaxial HZO below 5 nm. Furthermore we calculate the strength of an applied electric field necessary to cause the antiferroelectric phase transformation in ZrO$_2$ from the P4$_2$/nmc phase as 1 MV/cm in agreement with experimental data, explaining the mechanism of field induced phase transformation.